» 2013 embedded boards - kontron...3 » why buy an embedded board? « lowest total cost of...

1

» 2013 Embedded Boards «

The pulse of innovation

» Pico-ITX 2.5"» Mini-ITX to full size ATX» PC/104» Computer-on-Modules

www.kontron.com2

Why buy an Embedded Board? ______________________ 3

Lowest total cost of Ownership ______________________ 3

Complete lifecycle management ______________________ 3

The Longevity Factor ______________________________ 4

Embedded Motherboards Compatibility ________________ 4

Your value add beyond Hardware _____________________ 5

Motherboard _____________________________________ 6

KTQ87/mITX ______________________________________ 7

Embedded Mini-ITX Motherboards ____________________ 8

Technology Highlights ______________________________ 8

Hardware-based remote Diagnosis and Repair ___________ 9

Accessories ______________________________________ 10

New Long-Life Cooler ______________________________ 10

Evaluation Break-out Boards ________________________ 10

Display Cables for Motherboards _____________________ 10

ADD2/PCIe-Cards __________________________________ 11

PicoITX _________________________________________ 12

Standard cooling concept ___________________________ 13

PC/104 __________________________________________ 14

Stack & start your SFF engine _______________________ 15

Computer-on-Modules _____________________________ 16

Proven designs for extended temperatures _____________ 17

The Thermal Concept _______________________________ 17

Software & Services for ARM ________________________ 17

Fast, complete solutions with... _____________________ 18

Technical Informations ____________________________ 19

» Table of Contents «

www.kontron.com3

» Why buy an Embedded Board? «

Lowest total cost of Ownership (TCO) with Embedded Boards

At first glance, buying an industrial motherboard may seem to be more expensive than a board designed for the consumer market. However, there are several factors that could contri-bute to cost savings of more than 50% over the lifetime of product including:

» Strong product life management and revision control from design to EOL

» 7-years life and beyond, giving optimal time for return of initial design-in investment

» Fast time to market by using complete set of tools, services and software (BSP´s)

» Logistics and service made easy with long life products and product life management

» Free technical support (Hotline)» Highly reduced replacement costs» Stable and reliable products with high MTBF* and low field

failure rate due to high quality industrial grade components» Reduced test and approval efforts

Safety for your investment decisions!

Complete lifecycle management for all Embedded Boards

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» PIB = Product Introduction Bulletin» EFT = Early Field Test» PMI = Product Marketing Information» PCN = Product Change Notification» EOL = The End of Life Notification

Embedded Boards

€

www.kontron.com4

Embedded Motherboards Compatibility

Same Dimension (width) for rear-i/O from Mini-ITX up to full ATX Size

ETH1USB5USB4

ETH2ETH3

USB1USB0DP0

USB3USB2DP1

DVI-I Audio

ATXMini-ITX FLEX-ATX Micro-ATXPico-ITX

Kontron's entire range of motherboards offers full mechanical compatibility from Mini-ITX to full size ATX.

The Longevity Factor

» Availability up to 7 years after release

» 7-years lifetime and beyond, giving optimal time for return of initial design-in investment

Kontron Embedded Motherboard

» Availability 6 -18 Months

Consumer Motherboard

» Availability 6 -18 Months

Embedded Motherboards

www.kontron.com5


» Up to seven years lifecycle and long term service and support » Extensive validation, verification and testing » Extended technical support and documentation » Flat panel display support expertise including LVDS, DVI,

CRT, HDMI and ADD2/PCIe Cards » Remote hardware and hard disk monitoring/control

by original API software» Quick time-to-market with standard form factors» Advanced technologies such as solid capacitors and

up to 12 multilayer PCBs» Boards are tested and approved to UL 60950 – Information

Technology Equipment (ITE) for easy validation efforts on behalf of customers and system integrators when system-level products must go through UL / CE safety testing

» All Motherboards are designed and tested for Industrial Operating Temperature Range 0°C to 60°C

» All Motherboards are tested for their shock resistance, to be prepared for rugged environments

Your value add beyond Hardware

The use of Solid CAPs offers the following advantages:» Long-life cycle – enhanced MTBF» Liquid free – no drying out» Improved resistance against higher ambient temperature» Optimized electric strength

Up to 12 Multilayer PCBs support more features on smaller form factors with the highest signal quality

The availability of 3D-Drawings at early introduction for all available boards al-lows an instant start of housing design

Extended Documentation and Drivers – ready for download via Website

Up to 12x extended lifetime

www.kontron.com6

Feature-packed Kontron embedded KTQM77 - Mini-ITX mother-board with 3rd generation Intel® Core™ i3/i5/i7 mobile proces-sors offers extended graphics capabilities, best-in-class perfor-mance and highest versatility.» DVI-I, Dual DisplayPort, eDP & LVDS» MULTIPURPOSE Feature Connector

Based on 8085 Microcontroller for easy customizing, KT Break-out Board available

» Solid CAPs for extended Lifetime & MTBF» Longevity up to 7 years and enhanced

life cycle management» License-Bundles for Microsoft

Wind River and Linux OS

33 independent Display Support,PCIe 3.0, USB 3.0

» Motherboards «


www.kontron.com7

KTQ87/mITX

» 4th Generation Intel® 22nm Dual and Quad Core i7, i5, i3, Pentium & Celeron® CPUs with Intel® Q87 Lynx Point PCH

» Long term available Embedded mITX motherboard» High performance CPU, graphics, and media performance

supporting 3 independent displays pipes» Graphics APIs DirectX® 11.1, OpenGL 4.x, OpenCL 1.2» 3x Display Port for flexible, high resolution display drive» 2x DDR3L/DDR3 DIMM sockets supporting

up to 16GB DDR3 Memory

Typical Applications» Digital Signage: High graphics performance and

multi-display support» Gaming/POS/POI: High graphics and high CPU performance» Medical: High Graphics performance & longevity» Industrial Automation: wide range of I/Os and longevity» Future-oriented devices due to Display Port and

mSATA/compact SSD support

mSATA socket on rear side

Widest range of Interfaces: KTQ87/mITX

mSATA interface for compact SSD

eDP

eDPEmbedded DisplayPort» Standardized pinout» High throughput to support

high resolution» Fewer wires than LVDS –

easier wiring» Less EMI

DP to VGA DP to HDMI DP to DVI-D

Display Port Adapter


LAN1 USB3 USB2

LAN2 USB1 USB0

DP2 DP1DP0

Audio

ATX+12V

FAN CPU

mPCIe & USB8

PCIe x16

mSATA & USB9

ATX/BTXPWR

DD3 Slot 1

DD3 Slot 0

COM1

COM2

SATA4 SATA3 SATA2 SATA0 SATA5 SPI

USB4 USB5

USB10 USB11 FRONTPNL

FEATURE

www.kontron.com8

Embedded Mini-ITX Motherboards

Mini-ITX has become a very successful embedded motherboard form factor. Key features including multi LAN and a wide range of I/O options make these products ideal for many applications. The compact and space-saving footprint (17cm x 17cm) meets the growing need for a small form factor board-level solution and allows the customer to design a compact system without sacrificing the requirement of standard ATX mounting holes and the I/O bracket area.

The Mini-ITX form factor fills the gap between ultra small form fac-tor boards like Pico-ITX and full-size Flex and ATX motherboards.

Whatever your needs are – low power consumption with passive (fanless) cooling or high CPU speed, excellent graphics perfor-mance, TCO reduction by Intel® AMT remote control or a wide range of extension slots and accessories – you will find it here. Additionally, all Kontron Mini-ITX boards offer longevity, low to high-end performance and high MTBF.

Up to 4 independent display outputs with new AMD® R-series based Motherboards KTA70M/mITX and KTA75/FLEX

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Please note: Realization requires 1 ADD-Card

DP, single link DVI or HDMI™



DP1

DP2

DP3

DP4DP, single link DVI or HDMI™

Technology Highlights

KTA70M-mITX

ADD card KT-PCIe-DP++ to realize the 4th display port with AMD R-series boards


www.kontron.com9


Intel® AMT is part of the Intel® Management Engine, which is built into PCs with Intel® vPro™ Technology. Intel® AMT is run-ning in a ME integrated into the PCH (Platform Controler Hub) and is independent of the host CPU. This deep level hardware-based AMT Remote Troubleshooting and Recovery for distributed applications offers:

» Remote monitoring, maintenance and installation via existing network connections

» Hardware-based management when system is powered off or when OS is unresponsive

» Remote power up / power down» Support of full KVM remote control» Remote boot and BIOS Update» Remote status information» Remote BIOS parameter changes and firmware updates» Proactive Alerting» For enhanced security HW-based encryption is included

This means:» Significant reduction of on-site-findings and field work» Decrease of downtime and minimized time-to-repair» Increased efficiency of IT technical staff» Reduced TCO (Total Cost of Ownership)

Currently available for KTGM45, KTQ45, KTQM77, KTQ87 and KTQ77 QM67/Q67 Motherboard families.

Hardware-based remote Diagnosis and Repair with Intel® vPro™ Technology with Intel® Active Management Technology:

Remote power-up and access to protected memory - asset infor-mation, BIOS settings, event logs - when system is powered off*

Remote boot, console redirection, power reset, alerting and access to, protected memory - when OS is unresponsive*

Communication channel "below" the OS through TCP/ IP Firmware stack - when the system’s working*

MedicalFactory Robots, HMI,Industrial PC

ATM, Kiosks, POS POI

IT or Service Provider can power on, remotely access and fix inoperable Embedded systems

* Different examples for remote management and security capabilities depending on system status

IT-Console

www.kontron.com10

For application notes, cable specification drawings and a regularly updated LVDS display cable list visit: www.kontron.com

Display Cables for Motherboards

New Long-Life Coolers available!

E.G. the new “Cooler Active KTQM67 35W 33 mm longlife” (PN 1052-6345) is a cooling solution for 35W CPU’s like all mobile 3rd Generation Core CPU’s and some 2nd Generation Core CPU’s. It fits for KTQM67, KTQM77, KTHM65 and KTHM76 and is PWM controlled. The highest part of the cooler is 33 mm above PCB and the MTBF of the fan is 710.000 hours @ 40C, 177.500 hours @ 60C. Please ask for further models!

Evaluation Break-out Boards for the KT Feature Connector

The unique KT Evaluation Break-out Boards will simplify the ac-cess to the functions available on the KT Feature Connector and to add additional functions.

Up to 4 Evaluation Break-out Boards can be connected in series.

The first board includes special functions, shared functions and standard functions, while the other boards include shared and standard functions only.

» 4 DAC & 5 ADC» System Monitoring LED’s» Thermo sensor onboard» 2 digital 7-segment LED» 18 Open Drain Output» 20 GPIO’s

» Thermo sensor remote» Case Open» iBotton» Fan1» Fan2

» Accessories «

Industrial MTBF

Accessories

www.kontron.com11

ADD2-Cards add extra digital flat panel display support by using onboard graphics interface connectors such as PCI Express®/SD-VO. The solution is flexible and cost effective. By using an ADD2-Card, you can build a low-cost, single LCD-supported system. By adding an ADD2-Card to motherboards that have onboard

LVDS support, you can drive two LCDs from a single motherboard. Kontron offers both LVDS, CRT, HDMI and DVI interface ADD2-Cards.

ADD2/PCIe-cards

ADD2-cards

ADD2-CRT-Internal ADD2-DVI-DUAL-Internal ADD2-DVI-DUAL-Internal-External

Series ADD2-Card ADD2-Card ADD2-Card

Video Output CRT Single or Dual DVI Single or Dual DVI

Resolution Up to 1600x1200 1600x1200 / 1920x1080 1600x1200 / 1920x1080

Applicable Motherboards 986LCD-M, KT965, KTQ45, KTG41 and KTGM45 families

986LCD-M, KT965, KTQ45, KTG41 and KTGM45 families


Height Low Profile Low Profile Low Profile

Interface PCI Express®/SDVO PCI Express®/SDVO PCI Express®/SDVO

Partnumber 820954 820951 820952

ADD2-cards

ADD2-LVDS-Internal ADD2-LVDS-DUAL-Internal KT-PCIe-DVI-HDMI-I

Series ADD2-Card ADD2-Card Intel® PCIe Card

Video Output Single output LVDS Single or dual output LVDS DVI & HDMI

Resolution 1600x1200 / 1920x1080 1600x1200 / 1920x1080 Up to 1920x1200

Applicable Motherboards 986LCD-M, KT965, KTQ45, KTG41 and KTGM45 families


KTQ45 and KTGM45 families

Height Low Profile Low profile Low Profile

Interface PCI Express®/SDVO PCI Express®/SDVO PCI Express®

Partnumber 820953 820950 820977

Accessories

www.kontron.com12

Pico-ITX – the small, powerful and cost-effective 2.5" Motherboard family.

» Pico-ITX «

With the Pico-ITX form factor, Kontron supports a new definition of small (100 x 72 mm), powerful and cost-effective 2.5" Mo-therboards. The pITX-SP, Kontron’s first 2.5" Motherboard based

on the Pico-ITX industry standard, features the Intel® Atom™ Z5xx series processors US15W chipset, along with multiple I/O options and microSD-Card boot.

KTA55/pITXUltrasmall 2.5" Dual Core Motherboard » AMD FUSION Technology» Superior DX11 graphics» DVI-I & 24-bit LVDS» 6x USB 2.0, 2x SATA, GBit Ethernet» Bootable micro SD Card Slot» Standard KT PICO-ITX cooling concept» Lockable DC Power Connector

Accessory Kit Available

Pico-ITX

13

CONCEPT

MINI-ITX FANLESS COMPUTER

CB 753 Dual Head

www.kontron.com

Pico-ITX standard cooling concept – perfect for Box-PC-Design

Audio SDIO

4xUSB

GPIO

1GB LAN

Front Panel

DVI-D 2xUSB DCI in 5V

Cool

ing

Fan

SATA

SATA

SPDI

F PATA

44

Pico-ITX

www.kontron.com14

» PC/104 «

Since 1992, PC/104 remains one of the most reliable and flexible standards for Single Board Computers and is equipped to provi-de for leading-edge solutions in the years to come. With the la-test processor technology such as the Intel® Atom processor and AMD embedded G-Series Accelerated Processing Units, PC/104 is an ideal fit for many SFF solutions. As one of the leading global

embedded vendors, Kontron offers long-term availability and Ex-tended Life Cycle Management for the highest investment securi-ty for your PC/104 projects. And to further improve the time-to-market and reduce total-cost-of-ownership, Kontron offers dedi-cated customization and software services including integration services for third party products into your PC/104 applications.

PC/104-Plus™AMD embedded G-Series processor

» Powerful graphics for long-term available PC/104-Plus™ designs

» 1.0 or 1.2 GHz Single Core» Up to 4 GB RAM (DDR3)» Full ISA support

PC/104

www.kontron.com15

Cable-KitsCooling SolutionsEvaluation-Kits

The Kontron Microspace environment at a glance

Stack & start your SFF engine

We offer a broad selection of PC/104 modules to build reliable embedded PC Systems. If the required functionality is not part of the standard product portfolio, we have capabilities to develop and manufacture such a customized embedded solution and its modules. Complete cable sets can be delivered with all CPU modules to facilitate the customer`s entry into the world of PC/104.

Small Form Factor With its extremely compact form factor of only 90 x 96 mm, Kontron’s PC/104 boards are the ideal platform for innovative SFF designs in applications which only have restricted space available.

Processor Options PC/104 modules from Kontron are always available featuring the latest leading-edge processor technology and range from low-power processors for extremely energy-sensitive applications up to powerful multi-core processors with superior graphics capa-bilities.

Flexible With its stackable expansion boards for application specific I/Os, PC/104 offers one of the most comprehensive and proven eco systems of boards and peripherals. And with Kontron’s broad product range of verified building blocks all you need to do is stack & start.

Reasons to recommend Kontron PC/104!» Compact size with leading-edge SFF processor technology» Easy stack & start system design» I/O expansion boards for nearly all embedded tasks

available off-the-shelf» Proven long-term investment security

PC/104

www.kontron.com

» Computer-on-Modules «

Computer-on-Modules (COM) are highly integrated computer modules that support system expansion and application-spe-cific customization without the use of cables. When using a Computer-on-Module, customers don't need to worry about the complex design of the COM, instead freeing them to concentra-te on their core business. To tailor this modular solution to the application's specific needs, Kontron designs the carrier board that includes all necessary interfaces for the individual appli-cation. Kontron COMs are based on industry standards like ETX® and COM Express®. As such, Kontron COMs are simply plugged into the carrier board like a component.

Advantages of COMs at a Glance:» Scalability in size and performance» Short time-to-market» Simplified development» Flexibility and interoperability» Reuse of knowledge» Longevity of standards and products» Multi-vendor support

16

Computer-on-Modules

www.kontron.com17

Bootloader» Configuration Services» Customer specific bootloader

development and variant handling

OS/Licenses» Evaluation Images» Support for Getting Started» Image Building» Microsoft Embedded Licenses

Software & Services for ARM

Computer-on-Modules: proven designs for extended temperatures

The Thermal Concept

COM Express® Heatspreader provides:» Identical mechanical size – all COM Express® modules

fit in the same system» The only surface that needs cooling is the top of the

heatspreader» Additional active and passive Heatsinks are available

Mission-critical applications in the military, aerospace, transportation, energy and industrial automation markets offer the biggest challenges for extended temperature designs. To achieve functionality in extended temperature ranges, customers have two recommended ways to ensure that COM solutions perform within extended temperature environments – by design (solutions built with all industrial grade components) and by 100 percent extended temperature testing of the solution.The Kontron x86, ARM and Power Architecture® technology COMs in particular COMe-mTTi10, COMe-cXLi2, SMARC-sAMX6i, SMARC-sA3874i and COMe-P2020 offers a "by design" modular solution fully approved for use under E2 industrial temperature range (-40°C to +85°C) conditions. Kontron also offers other high-performance COMs re-engineered to be reliable under such extreme temperature conditions. A whitepaper detailing the Kontron approach to serving extreme applications also is downloadable from the Kontron website.

Board Support Package» For WEC7, Linux, Android available» QNX, VxWorks on request» Customization and Driver

Development Services

Computer-on-Modules

Support & Services» Getting Started Support» ARM Baseboard & Software Training» Enhanced Software Support» Customization, Software Development

and Migration Services

www.kontron.com18

Fast, complete solutions with...

Concentrate on Your Core Business

With Kontron Computer-on-Modules (COM), customers can con-centrate on their core business and only have to design the ne-cessary interfaces and circuits for their individual carrier boards. The standardized computer module is then simply plugged into the carrier board. Customers can focus on their application-spe-cific elements without worrying about the computing core.

Broad Knowledge Base Accelerates Time-to-Market

Kontron offers a variety of hardware and software tools to speed up and simplify your R&D processes.

With complete starter kits that, which include all required hard- and software for quick evaluation, engineers can start develop-ment while defining their application-specific solution. In addi-tion to the available starter kits Kontron also provides various additional Graphics Adapters help developers to convert panel signals to the required specification of the target application.

Find out more on: kontron.com/mysafechoice

Individual Carrier Board Design

When Carrier Board design and Computer-on-Modules come from a single source, system functionality is optimally tuned for the application. Kontrons Team offers the correct form factor fit with the highest quality. With x86, ARM and PowerPC design experi-ence, Kontron develops and delivers any kind of Carrier Board, including test, memory, heatsink, housing, assembly, individual configuration, packaging and shipment. Even if you can't find a suitable module in Kontron's broad product range, we'll take on the design and the manufacturing of complete boards with any desired CPU in any desired form factor.

Find out more on kontron.com/boardsandmore

Computer-on-Modules

www.kontron.com19

» Technical Informations «

The pulse of innovation

» Pico-ITX 2.5"» Mini-ITX to full size ATX» PC/104» Computer-on-Modules

www.kontron.com20

Embedded Mini-ITX Motherboards170 x 170 mm

KTGM45/mITX KTQM77/mITX KTHM76/mITX KTA70m/mITX KTT30/mITX KTQ87/mITX

CPU Intel® Core™2 Quad & Intel® Core™2 Duo

Intel® i7-,i5,-i3 2 Core and 4 Core CPUs; Intel® Celeron® Processor B810

3rd Generation, Intel® i7-,i5,-i3 2 Core and 4 Core CPUs; Intel® Celeron® Processor B810

AMD® R-Series FP2 BGA CPU ARM Cortex-A9 Quad Core 900MHz Processor with NEON Technology

Intel® Core i7/i5/i3 2C/4C CPU clock up to 3.1 GHz

CPU

CPU Clock Up to 3.06 GHz Up to 2.9 GHz (3.7 GHz in Turbo) depending on actual CPU

Up to 2.7GHz (3.5 GHz in Turbo) depending on actual CPU

Clock speeds up to 2.0 GHz - Clock up to 3.1 GHz CPU Clock

667 / 800 / 1066 MHz DMI 2.0 support; 4 lanes in each direction; 5 GT/s point-to-point DMI interface to PCH is supported

- - - - Front Side Bus

Chipset Intel® GM45 + ICH9M-E Intel® QM77 Intel® HM76 A70M Hudson-M3 Integrated Intel® Embedded Q87 Chipset

DRAM Up to 8 GB DDR3, 2 pcs. DIMM 240 pin Up to 8 GB DDR3 x2 (max 16 GB) Up to 8 GB DDR3 x2 (max. 16 GB) on Mini-ITX

2x SODIMM, up to PC3-10600 (16Gb Max)

Up to 2 GB DDR3L memory down Up to 16 GB of DDR3 RAM DRAM

Video Memory Up to 256 MByte shared video memory Up to 1760 MByte shared video memory Up to 1,7 Gb shared with system memory Shared with system memory Shared with system memory - Video Memory

IDE Interface 4x SATA 1,5 Gb/s / 3 Gb/s w. RAID 0,1, 1x ATA133

6x SATA 3Gb/s / 6Gb/s w. RAID -Support - - - - IDE Interface

USB 12x USB 2.0 4x USB 3.0, 10x USB 2.0 4x USB 3.0, 8x USB 2.0 10x USB 2.0, 4x USB 3.0 3x USB 2.0 (2x Type A and 1x Micro) 4x USB 3.0 & 10 USB 2.0. (USB3.0 4x Rear IO, USB 2.0 4x Rear IO, USB 2.0 4x Internal Header, USB 2.0 2x PCIe sockets)

USB

Ethernet Up to 3x GbE LAN Up to 3x GbE LAN 1x Intel® GB LAN 2x Intel GB LAN 1x 10/100/1000 Ethernet Controller 2x Intel Gigabit-LAN, one LAN controller supporting Intel® AMT 9.0

Ethernet

Form Factor Mini-ITX 170 x 170 mm (6.7" x 6.7")

Mini-ITX 170 x 170 mm (6.7" x 6.7")

Mini-ITX, 170 x 170 mm (6.7" x 6.7")

Mini-ITX, 170 x 170 mm (6.7" x 6.7")

Mini-ITX, 170 x 170 mm (6.7" x 6.7")

Mini-ITX, 170 x 170 mm (6.7" x 6.7")

Form Factor

Available I/Os 1x PCI, 4x COM, 1x mini PCI Express®

One PCIe x16, Gen. 3.0 plus one PCIe x1, Gen. 2.0, 4x COM, 2x mini PCI Express®, 2x IEEE1394a (Pin row), Internal PS2 Mouse/Keyboard connector

1x PCIe x16, Gen. 3.0 plus 1x PCIe x1, Gen. 2.0, 4x COM, 2x mini PCI Express®, Internal PS2 Mouse/Keyboard connector

1x PCIe x4, PCIe x8 gen 2.0 in X16 slot, 2x mPCIe, one shared with mSATA

USB, RS232, CSI/DSI/12-bit par. Camara input, Bootable eMMC, 1x mPCIE, 1x mPCIE/mSATA, 2x SD card

PCIe x16 socket with Gen3 and Gen2 support, 1x Mini-PCIe, 1x mSATA 1.50/3/6Gbit/s, 2x COM (RS232)

Available I/Os

Graphics Controller Intel® GMA4500 MHD, LVDS onboard

Integrated Intel® HD4000 Integrated, Intel® HD4000 with support for 3 independent Displays

4 independent display outputs(with add-card)

Ultra low power NVIDIA GeForce GPU with enhanced 3D capabilities Dual Channel 24bit LVDS

Intel® HD Graphics 4600 build into CPU Graphics Controller

Graphic Interface CRT / LVDS / PCI Express® x16 / SDVO 2x Display port, 1 DVI-I, LVDS / Embedded DP, HDMI via Adapter / 1x Gen3.0 PCIe x16 slot

2x Display port, 1 DVI-I, LVDS, HDMI via Adapter / Gen 3.0 PCIe x16 slot

3x Display port HDMI 1.4a & 24-bit LVDS, DSI output, Possible at screen resolutions of LVDS 2048x1536 pixel (18bpp), DSI 1440x900 pixel (18bpp), HDMI 1080p60

3x Display Port revision 1.2 in Rear IO Graphic Interface

Rear I/0 COM1, CRT, IEEE1394, Ethernet, USB, line-in, line-out, speaker, PS/2 mouse/keyboard

2x (Dual USB +Displayport), Dual USB + Ethernet, DVI, Audio 3x

2x (Dual USB +Displayport), Dual USB + Ethernet, DVI, Audio 3x

2x RJ45 Gbit Ethernet, 4x USB 3.0, 4x USB 2.0, Audio Jack 1x3 (line-out, line-in, microphone), 3x Display Port, 4-pin Power Connector

POWER, 2 x single USB, HDMI, RJ45, 3 x single AUDIO, 1 x microUSB

Audio stacked 2x3 mini Jack tower, 4x USB, 3x Display port, 2x RJ45 LAN

Rear I/0

Special Feature GPIO, IEEE1394, HDD RAID 0/1 support, AMT 4.0, TPM 1.2

GPIO, IEEE1394, HDD RAID 0,1,5,10 support, AMT 8.0, TPM 1.2, support for 3 indepentent displays Displays, PCI 3.0 support

GPIO, TPM 1.2, mSATA for SSD Storage, ATX and single 12V power supply, KT embedded feature port with ADC, DAC up to 160 GPIO

TPM on board, SATA supporting rev 1/2 & 3 (1.5/3.0 & 6.0Gbit/s), 1x mSATA shared with mPCIe, 12V DC PSU, KT emb. Controller

2x SD Card, 1x eMMC ( Bootable) AMT 9.0, TPM 1.2, Intel® AES security, Kontron embedded feature connector with ADC, DAC up to 160 GPIO

Special Feature

Additional Up to 7 years availability, ADD2-Cards for SDVO Interface for 2nd LCD, S-Video, HD Audio, SPDIF

GPIO, TPM 1.2, mSATA for SSD Storage, ATX and single 12V power supply (only on Mini-ITX), KT embedded feature port with ADC, DAC up to 160 GPIO, up to 7 years availability

GPIO, TPM 1.2, mSATA for SSD Storage, ATX and single 12V power supply (only on Mini-ITX), KT embedded feature port with ADC, DAC up to 160 GPIO, up to 7 years availability

"add card" support for DP output, UMI 4x 5Gbit/s, Longterm available up to 7 years

Operating temp. 0°C to 60°C Up to 7 years availability Additional

Embedded Mini-ITX

Motherboards170 x 170 mm

» Embedded Mini-ITX Motherboards «

www.kontron.com22

EmbeddedMotherboards

KTGM45/FLEX KTGM45/ATXE KTQ45/Flex KTQ45/ATXE KTQ77/FLEX KTQ67/ATXE

CPU Intel® Core™ 2 Quad & Intel® Core™ 2 Duo Intel® Core™ 2 Quad & Intel® Core™ 2 Duo Intel® Core™ 2 Duo E8400 and Intel® Core™ 2 Quad Q9400

Intel® Core™ 2 Duo E8400 and Intel® Core™ 2 Quad Q9400

Intel® 3rd generation Core i-Series - Core i7/Xeon®4C (COM i5/Xeon®4C /i3 2C™)

Intel® 2nd generation Core i-Series -Core i7/Xeon®4C (Core) i5/Xeon®4C/ i3 2C™)

CPU

CPU Clock Up to 3.06 GHz Up to 3.06 GHz Up to 3.0 GHz Up to 3.0 GHz Up to 3.9 GHz Up to 3.8 GHz CPU Clock

Front Side Bus 667 / 800 / 1066 MHz 667 / 800 / 1066 MHz 800/1066/1333 MHz 800/1066/1333 MHz - - Front Side Bus

Chipset Intel® GM45 + ICH9M-E Intel® GM45 + ICH9M-E Intel® Q45 Express Intel® Q45 Express Intel® Q77 Intel® Q67 Chipset

DRAM Up to 8 GB DDR3, 2 pcs. DIMM 240 pin Up to 8 GB DDR3, 2 pcs. DIMM 240 pin Up to 8 GB DDR3, 4x DIMM-240

Up to 8 GB DDR3, 4x DIMM-240

Up to 8 GB DDR3, 4x Up to 8 GB DDR3, 4x DRAM

Video Memory Up to 256 MByte shared video memory Up to 256 MByte shared video memory Up to 256 MByte Dynamic shared memory Up to 256 MByte Dynamic shared memory - - Video Memory

IDE and SATA Interfaces 4x SATA 1,5Gb/s / 3Gb/s w. RAID 0,1, 1x ATA133

4x SATA 1,5Gb/s / 3Gb/s w. RAID 0,1, 1x ATA133

5x SATA1,5Gb/s / 3Gb/s w. RAID 0/1/5/10, 1x eSATA

5xSATA 1,5Gb/s / 3Gb/s w. RAID 0/1/5/10, 1x eSATA

- - IDE Interface

USB 12x USB 2.0 12x USB 2.0 12x port USB 2.0 (4x internal) 12x port USB 2.0 (4x internal) 4x USB 3.0, 10x USB 2.0 14x port USB 2.0 USB

Ethernet Up to 3x GbE LAN Up to 3x GbE LAN 2x GbE LAN 2x GbE LAN 3x GbE LAN 3x GbE LAN Ethernet

Form Factor Flex-ATX 228.6 x 190.5 mm (9" x 7.5")

ATX 300.5 x 190.5 mm (12" x 7.5")

Flex-ATX 228.6 x 190.5 mm (9" x 7.5") ATX 300.5 x 190.5 mm (12" x 7.5")

Flex-ATX 228.6mm x 190.5mm (9" x 7.5") ATX (12" x 7.5") 300.5mm x 190.5mm

Form Factor

Available I/Os 1x PCI Express® x4, 2x PCI, 4x COM 1x PCI Express® x4, 5x PCI, 4x COM 1x PCI Express® x4, 2x PCI, 2x COM 1x PCI Express® x4, 4x PCI, 2x COM 1x PCIe x4 Gen2 (In x16 connector), 2x PCI 32bits/33MHz, 1x Mini-PCIe, 1x mSATA, 4x COM, Internal PS2 Mouse/Keyboard connector

1x PCIe x4 Gen2 (In x16 connector), 5 x PCI 32bits/33MHz, 1x Mini-PCIe, 1x mSATA 4x COM

Available I/Os

Grafik-Controller Intel® GMA 4500MHD chipset graphic Intel® GMA 4500MHD chipset graphic Intel® GMA 4500 chipset graphic Intel® GMA 4500 chipset graphic Up to Intel ® HD Graphics 4000 depending on CPU type

Intel HD Graphics 3000 build into CPU Grafik-Controller

Graphic Interface CRT / LVDS / PCI Express® x16 / SDVO CRT / LVDS / PCI Express® x16 / SDVO CRT / PCI Express® x16 / SDVO CRT / PCI Express® x16 / SDVO 1x PCIe x16 Gen3, 2x Display port, 1X LVDS, 1x CRT

1x PCIe x16 Gen2, 2x Display port, 1X LVDS, 1x CRT

Graphic Interface

Rear I/0 COM1, CRT, Ethernet, USB, line-in, line-out, speaker, PS/2 mouse/keyboard

COM1, CRT, Ethernet, USB, line-in, line-out, speaker, PS/2 mouse/keyboard



DB9 serial port, DB15 VGA , Audio stacked 2x3 mini Jack tower, 6x USB, 2x Display port 3x RJ45 LAN

DB9 serial port, DB15 VGA , Audio stacked 2x3 mini Jack tower, 6x USB, 2x Display port, 3x RJ45 LAN

Rear I/0

Special Feature GPIO, HDD RAID 0/1 support, AMT 4.0, TPM 1.2

GPIO, HDD RAID 0/1 support, AMT 4.0, TPM 1.2

HDD RAID, GPIO, LPT, HD Audio, AMT 5.0 HDD RAID, GPIO, LPT, HD Audio, AMT 5.0 HDD RAID, GPIO, LPT, HD Audio, Mini-PCIe; AMT 8.0, 3 independent Displays, PCIe 3.0 support

HDD RAID, GPIO, LPT, HD Audio, Mini-PCIe; AMT 7.0

Special Feature

Additional Up to 7 years availability, ADD2-Cards for SDVO Interface for 2nd LCD

Up to 7 years availability, ADD2-Cards for SDVO Interface for 2nd LCD



GPIO, HDD RAID 0,1,5,10 support, AMT 8.0, TPM 1.2, mSATA for SSD Storage, ATX power supply, KT embedded feature port with ADC, DAC up to 160 GPIO, Up to 7 years availability

GPIO, HDD RAID 0,1,5,10 support, AMT 7.0, TPM 1.2, mSATA for SSD Storage, ATX power supply, KT embedded feature port with ADC, DAC up to 160 GPIO, Up to 7 years availability

Additional


» Embedded Motherboards «

www.kontron.com24


KTQM67/FLEX KTQM67/ATXP KTA75/FLEX

CPU Intel® i7-,i5,-i3 2 Core™ and 4 Core CPUs; Intel® Celeron® Processor B810

Intel® i7-,i5,-i3 2 Core™ and 4 Core CPUs; Intel® Celeron® Processor B810

AMD® R-Series Fs1R2 uPGA

CPU Clock Up to 2.7GHz (3.5GHz in Turbo) depending on actual CPU

Up to 2.7GHz (3.5GHz in Turbo) depending on actual CPU

Up to 3.2 GHz depending on actual APU

Front Side Bus - - -

Chipset Intel® QM67 Intel® QM67 A75 Hudson-D3 FCH

DRAM Up to 8 GB DDR3, 4x Up to 8 GB DDR3, 4x 2x UDIMM up to 32 GB in total

Video Memory Up to 1,7 Gb shared with system memory

Up to 1,7 Gb shared with system memory

Shared with system memory

IDE and SATA Interfaces 6x SATA150/SATA300 w. RAID 0/5/10 6x SATA150/SATA300 w. RAID 0/5/10 -

USB 14x port USB 2.0 14x port USB 2.0 10x USB 2.0, 4x USB 3.0

Ethernet 3 x GbE LAN 3x GbE LAN 2x Intel GB LAN

Form Factor Flex-ATX (9" x 7.5") 228.6 x 190.5 mm

ATX (12" x 7.5") 300.5 x 190.5 mm

Flex-ATX (9" x 7.5") 228.6 x 190.5 mm

Available I/Os 1x PCI Express® x 16, 1 PCI Express® x 1, 3x PCI; 4x COM, 2x mini PCI Express®, 2x IEEE1394a (Pin row), Internal PS2 Mouse/ Keyboard connector, LPT Parallel port in FFC connector

1x PCI Express® x 16, 1 PCI Express® x 1, 6x PCI; 4x COM, 2x mini PCI Express®, 2x IEEE1394a (Pin row), Internal PS2 Mouse/ Keyboard connector, LPT Parallel port in FFC connector

2x PCI, 1x PCIe x4, PCIe x16 gen 2.0, 2x mPCIe, one shared with mSATA, KT embedded feature port with ADC, DAC up to 160 GPIO

Graphic Interface 2x Display port, 1 DVI-I, LVDS / Embedded DP, HDMI via Adapter / 1x PCIe x16 PCI slot

2x Display port, 1 DVI-I, LVDS / Embedded DP, HDMI via Adapter / 1x PCIe x16 PCI slot

3x Display port

Rear I/0 2x (Dual USB +Displayport), Dual USB + Ethernet, Dual Ethernet, DVI, Audio 3x

2x (Dual USB +Displayport), Dual USB + Ethernet, Dual Ethernet, DVI, Audio 3x

2x RJ45, 4x USB 3.0, 4x USB 2.0, 3x DP, Audio jack 1x3

Special Feature HDD RAID, GPIO, LPT, HD Audio, Mini-PCIe; AMT 7.0

HDD RAID, GPIO, LPT, HD Audio, Mini-PCIe; AMT 7.0

TPM on board, SATA supporting rev 1/2 & 3 (1.5/3.0 & 6.0Gbit/s), 1x mSATA shared with mPCIe, ATX PSU, KT emb. Controller

» Embedded Motherboards «

www.kontron.com25

» Pico ITX «

2.5" Pico-ITX

pITX-SP KTA55/pITX KTAM3874/pITX

CPU Intel® Atom™ Z510 / Z530 1.1 / 1.6 GHZ

AMD 1.0 GHz Dual Core T40N ARM® CortexTM-A8, TI® AM3874 SitaraTM, up to 1 GHz Core frequency

Chipset Intel® System Controller Hub US15W AMD A55E -

DRAM 1x DDR2 SODIMM up to 2GB 1x DDR3 SODIMM up to 4GB -

Audio HD Audio analog / S/PDIF Realtek ALC888 Controller, S/PDIF Analog audio interface (Line-In, Line-Out, Mic-In), Speaker connector

USB 6x USB 2.0 (2x at front panel, 4x onboard)

6x USB 2.0 (2x at front panel, 4x onboard)

5x USB 2.0 (2 on front I/O, 2 internal (1x USB client) and 1x USB 2.0 optional on mPCIe connector)

Serial Ports - - 2x RS232, 1x RS232/485

Ethernet Intel® 82574L Gigabit Ethernet Intel® 82574L, Gigabit Ethernet Dual port Ethernet (10/100/1000 Mb/s) with integrated optional switch

I/O Features 8 Bit GPI/O TTL , SDIO 8 configurable GPIO 1x mPCIe® 2.0 port (x1 lane), I2C, 26x GPIOs, TTL and SPI output shared with GPIO´s

Graphics Controller Integrated decoders in Intel® System Controller Hub US15W for MPG2 and H.264 / MPEG-4 AVC

Internal GPU with DirectX® 11 support and support of open CL/GL

-

Graphics DVI-D JILI30 single channel LVDS (24 Bit) interface

DVI and VGA output on DVI-I connector, JILI30 dual channel LVDS (24bit) interface

2 independent graphic outputs (LVDS dual channel 24bit, HDMI 1.3a) both up to 1080p

Dimensions (H x W x D) 100 x 72 mm (Pico-ITX) 100 x 72 mm (Pico-ITX) 100 x 72 mm (Pico-ITX)

Special Features TPM 1.2 , 1x microSD socket 1x microSD socket, lockable DC Power Connector, Backlight output selectable 5V or 12V external bypass

2x CAN Bus, onboard SIM-card slot for mPCIe modem cards

Temperature/Humidity Operating 0°C to 60°C (32°F ~140°F) Operating 0°C to 60°C (32°F ~140°F) Operating 0°C to +60°C

Power Consumption (typ.) 5V DC, 8W typical 5V DC, 10W typical -

Storage Single or Dual SATA 3Gb/s (chipset option), 1x PATA 44 Master / Slave; mSD-Card-Slot

2x SATA 6Gb/s, mSD-Card-Slot -

www.kontron.com26

» PC/104 «

PC/104

MSM-LP MSM-eO/N MSM945P MSM800XEV MOPSlcdLX

Processor/Performance Intel® Atom™ D525 (Dual Core)/1.8 GHz or D425/1.8 GHz

AMD embedded T44R 1.2GHz / T24L 1GHz

Intel® Core™ Duo L2400 / Intel® Core™2 Duo L7400 / Intel® Atom™ N-270 (2x 1.6 GHz / 2x 1.5 GHz / 1x 1.6 GHz)

AMD Geode™ LX800 / 0.5 GHz

AMD Geode™ LX800 / 0.5GHz

Chipset Intel® 82801HM AMD™ FCH A55E 945GME CS5536 AD CS5536 AD

Bus PCI-BUS: Option, on the bottom, PCI Express® Bus: Yes, on the bottom

PC/104-PCI: 32 bit 33MHz 4 Slots, PC/104-ISA: 16 bit

PCI-BUS: Option, PCI Express® BUS: On the bottom

PC/104-Plus: Option PC/104-Plus: Option

Memory Up to 4GB DDR3 SODIMM

Up to 4GB LVDDR3-1066 1x SO-DIMM

512-3072 MByte DRAM 128-1024 MByte 128-1024 MByte

Video Controller Int. graphic controller, multi display support, high performance

AMD Radeon™ HD 6250 / -

i945GME Int. graphic Controller Int. graphic Controller

Video Memory Up to 256 MB (UMA) Up to 384 MB shared video memory / -

8-224 MByte 16 MB (UMA) 16MB (UMA)

LCD Interface LVDS up to 1366x768 18bpp

Up to 1920x1200 24bpp / -

LVDS 24 bit, 320x240 to 1600x1200

24bit, 320x240 to 1600x1200

CRT Interface Up to 2048x1536 @ 60Hz

Up to 1920x1200 30bpp / -

Yes Yes Yes

IDE Interface P-ATA 1x - 1x 1x 1x

IDE Interface S-ATA 2x SATA300 2x SATA150/300/600 w.RAID 0,1 support

2x SATA 300 - -

COM1 / COM2 RS232C or Option: UART 2x RS232 RS232C / RS232C RS232C / RS232C RS232C / RS232C

COM3 / COM4 UART 2x UART - - -

USB 4x 2.0, 2x 2.0 on PCI104ex Connector

4x 2.0 4x 2.0, 2.0 on PCI104ex connector

4x 2.0 2x 2.0

Ethernet 2 Gbit LAN 2x 1 Gbit LAN 10/100 LAN 10/100 LAN 10/100 LAN

Sound HDA, 2x Stereo, SPDIF in/out

HD Audio line-out, mic-in, SPDIF out/in

HDA, 2x Stereo, SPDIF AC97 -

RTC Battery onboard 900mAh (typ. 10 years) - 80mAh (or ext. 900mAh) 400mA -

Dimensions (W x L in mm)

90 x 102 mm 90 x 102 mm 90/117 x 96/99 mm 90 x 99 mm 90 x 96 mm

Standard Temperature 0°C to +70°C 0°C to + 60°C -25°C to +60°C/+70°C 0°C to +60°C 0°C to +60°C

Extended Temperature -40°C to +85°C -40°C to +85°C -40°C to +70°C 25°C to +70°C, -40°C to +85°C (with large cooler and E48 or with thermo junction and E48)

-

Special Features Optional: soldered SSD, 2 - 16 GB (SSD), PXE, GIPO, PWE Eval-Kit available

8x GPIO 4x A/D 2x D/A PWM Boot from LAN, Watchdog, bootable micro SD card slot, ECO Mode (min. pwr. consumption), Eval-Kit available

- Soldered RAM Lan Boot, Watchdog, JIDA-Support, JRC-Support, Dark Boot, 32 MB - 1GB, chipDISK

www.kontron.com27

COM Express® QorIQ™

COMe-cP2020* COMe-cP5020*

Processor Freescale QorIQ™ P2020 e500 Power Architecture (2x 1.2 GHz commercial temp. / 1.0 GHz industrial temp.)

Freescale QorIQ™ P5020 (P5010) e5500 Power Architecture (2x 2.0 GHz (2x 1.6 GHz))

Cache 32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache with ECC

32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache/Core; 2MB L3 cache shared

Memory Up to 4GB DDR3-667 72-bit Up to 8GB DDR3-1333 MHz ECC

Storage/Flash 64kbit I²C EEPROM / up to 2GB NAND Flash + 2MB NOR Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; 512kB MRAM

64kbit I²C EEPROM / up to 2GB NAND Flash; 2MB NOR Flash; 2nd 2MB SPI NOR Flash for boot recovery purposes; 2x SATA multiplexed with SerDes; 512kB MRAM

Micro SD Card MicroSD card slot / bootable MicroSD card slot/bootable

USB 4x USB 2.0 5x USB 2.0 (one channel device capable)

PCI Express® See SerDes See SerDes

SerDes* Options 4x SerDes up to 3.125 Gbps multiplexed across controllers can be configured as: PCI Express®, sRIO, GbE; Example: 1x PCIe x42x PCIe x1 + 1PCIe x2 2.5 Gbps1x PCIe x2 + 2x 1GbE SGMII2x SRIO x1 2.5Gbps + 2x GbE SGMII2x SRIO x1 3.125 Gbps1x SRIO x4 with 1.25/2.5 or 3.125 Gbps

18x SerDes lanes configurable; pre-selected standard configurations: 2x PCIe x4 + 4x 1 GbE SGMII + 1x SATA2x PCIe x4 + 4x 1 GbE SGMII + 1x XAUI2x PCIe x4 + 1x XAUI + 1x SATA2x sRIO x4 + 4x 1 GbE SGMII + 1x SATA

Serial 2x UART 2x UART (2x FourWire/ 2x TX/RX)

Serial Rapid I/O See SerDes See SerDes

Ethernet 3x 10/100/1000 Base-T 1x 10/100/1000 Base-T

SPI Yes Yes

GPIO 2x GPIO (exclusive with SDHC usage); additional GPIO on project base

12x GPIO

I²C 2x I²C 1x I²C

IEEE 1588 2x IEEE 1588 control IEEE 1588 control

Interface Others 1x SDHC; 1x MDIO (IEEE 802.3 clause 22); 5x IRQ; 1x IRQ OUT; 16 bit eLBC (2 Devices); Processor Local Bus

1x SDHC; 2x MDIO (iEEE 802.3 clause 22 + clause 45) 5x IRQ Interrupts; Processor Local Bus

Other Features Watchdog, JTAG debug, Real time clock; LEDs Watchdog, JTAG debug, Aurora debug; Temperatur Monitor; LEDs

Bootloader U-Boot U-Boot

Operating Systems Linux; Wind River VxWorks 6.9.2 Linux; Wind River VxWorks 6.9.2

Power 12 V +/- 5% (optional RTC supply voltage of 3.3V) 12 V +/- 5% (optional RTC supply voltage of 3.3V)

Power Consumption Est. 12W/12V Est. 30W/12V

Temperature c-version 0°C to +60°C; i-version -40°C to +70°C 0°C to 60°C

Humidity 93% relative Humidity at 40 °C, non-condensing (acc. to IEC 60068-2-78)

93% relative Humidity at 40°C, non-condensing (acc. to IEC 60068-2-78)

Compliance Com Express® compact, 95x95 mm Com Express® basic, 95x125 mm

* Please consult our sales support team for other processor versions and SerDes configurations.

» COM Express® QorIQ «

www.kontron.com28

–40°C to +85°C

COMe-mSP1(nanoETXexpress-SP)

COMe-mTT10 (nanoETXexpress-TT)

COMe-mCT10

CPU Intel® Atom™ Z510, Z530 Intel® Atom™ E6xx / E6xxT Intel® Atom™ N2600, N2800, D2700

CPU Clock 1.1 GHz up to 1.6 GHz 0.6 GHz up to 1.6 GHz Up to 2x 2.13 GHz

Cache 32 kB Instruction Cache + 24 kB L1/512 kByte L2

32 kB Instruction Cache + 24 kB L1 Cache, 512 kB L2 Cache

32 KB Instructions cache + 24 KB L1 Cache, 1MB L2 Cache

Chipset Intel® SCH US15W Intel® PCH EG20 / EG20T Intel® SCH NM10 Express

Bus Speed 400/533 MHZ FSB n/a n/a

Memory Onboard up to 2 GB DDR2 Onboard up to 2 GB DDR2-800 Onboard up to 4 GB DDR3 (800/1066 MHz)

Hard Disk 1x onboard SSD up to 4 GByte, 1 SDIO port (shared with GPIO)

2x SerialATA 300, 1x microSD-Card Slot on GPIO alternatively, 1x SATA 300, 1x SATA E2 SSD up to 8 GB

2x Serial ATA external supporting 3Gb/s alternatively: 1x SATA + 1x SATA onBoard SSD Flash drive up to 8GB SLC / 32GB MLC

USB USB 2.0, 8 ports (1 USB Client) USB 2.0, 6 ports + USB Client port USB 2.0, 8 ports

PCI Express® 1 PCIe x1 lane (opt. 2 PCIe x1 if no onboard LAN)

3x PCIe x1 lanes 4x PCI Express® x1 Lanes, one for LAN onboard

Serial Ports – 2x 2-wire TTL 2x 2-wire TTL optional

Ethernet Intel® 82574L Hartwell, 10/100/1000 MBit

MAC in Chipset integrated, Phy: Broadcom BCM54610, 10/100/1000 MBit

Intel® 82574L (Hartwell) 10/100/1000 Mbit

Sound Intel® High Definition Audio Intel® High Definition Audio Intel® High Definition Audio w/ HDMI 1.3a support

Graphics Controller Integrated Intel® Graphics HDTV/HD capable, Decoder for MPEG2(HD)/H.264

Integrated 2D/3D Graphics Engine, Gfx Core 333/400 MHz, shared VRAM Video Encode: MPEG4, H.263, H.264 Video Decode: MPEG2, MPEG4, VC1, WMV9, H.264

Integrated 2D/3D Graphics Engine, GMA 3650/3600, Gfx clock 640/400MHz, DirectX® 9.1, Video Decode: MPEG2, Blu-Ray Disk 2.0, VC-1, H.264, WMV9 up to 1080p

Graphics Memory Up to 256 MB, DVMT Up to 352 MB, DVMT tbd

Display Interfaces Single Chanel LVDS 18/24 Bit 1366x768; SDVO (optional) up to 1920x1080

LVDS 18/24bit 1280x768@60Hz SDVO 1920x1080@50Hz

LVDS 18bit (N2600/2800) 1366x768@112MHz LVDS 18/24bit (D2700) 1440x900@112MHz 1x DP++ (HDMI/DVI/DisplayPort)

Power Support 4.75 V – 14.7 V; ACPI 3.0 4.75 V – 14.7 V; ACPI 3.0 4.75 V – 20 V, ACPI 3.0

Form Factor COM Express® mini: 84 x 55 mm, Pin-out Type 1

COM Express® mini: 84 x 55 mm, Pin-out Type 10

COM Express® mini: 84 x 55 mm, Pin-out Type 10

Temperature Operation: 0°C to 60°C Storage: -30°C to 85°C

Operation: 0°C to +60°C Storage: -30°C to +85°C Industrial Temperature Range: -40°C to +85°C

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

» COM Express® mini «

COM Express® mini

www.kontron.com29

» COM Express® basic «

COM Express® basic

COMe-bPC2 (ETXexpress®-PC)

COMe-bAI# (ETXexpress®-AI)

COMe-bSC# (ETXexpress®-SC)

COMe-bIP# COMe-bHL6

CPU Intel® Core™2 Duo SP9300, SL9400, SU9300, T9400, P8400, Celeron® M575

Intel® Core™ i7-610E, i7-620LE, i7-620UE, i5-520E

Intel® Core™ i7-2715QE, i7-2655LE, i7-2610UE, i5-2515E, i3-2310OE, i3-2340UE, Celeron® B810E, 847E

Intel® Core™ i7-3615QE, i7-3612QE, i7-3555LE, i7-3517UE, i5-3610ME, i3-3210ME, i3-3217UE

Intel® Core™ i-CPUs, future 4th Generation (formerly codename Haswell-M)

CPU Clock Up to 2x 2.53 GHz Up to 2x 2.53 GHz Up to 2x 2.5 GHz resp. 4x 2.1 GHz

Up to 2x 2.7 GHz resp. 4x 2.3 GHz

Cache Up to 6 MB L2 Up to 4 MB L2 Up to 6 MB L2 Cache Up to 6 MB L2

Chipset Intel® GS45, ICH9M SFF, Intel® GM45, ICH9EM, Intel® GL40, ICH9M

Intel® Mobile Platform Controller Hub QM57

Intel® Mobile Platform Controller Hub QM67 resp. HM65

tbd Intel® 8-Series QM87 / HM86

Bus Speed 800/1066 MHz FSB 800/1066 FSB n/a n/a

Memory Up to 2x 4 GB DDR3, Dual Channel

Up to 2x 4 GB DDR3, Dual Channel with ECC

Up to 2x 8 DDR3, Dual Channel with ECC

Up to 2x 8 GB DDR3, Dual Channel

Up to 2x 8GB DDR3 (DDR3L-1333/1600)

Hard Disk 4x SerialATA 2, 1x PATA (optional Flash onboard)

4x SerialATA 2 PATA (on Type 2 only)

2x SerialATA 3, 2x SerialATA 2 PATA (on Type 2 only)

2x SerialATA 3, 2x SerialATA 2 PATA (on Type 2 only)

4x SATA (up to 3x SATA 6Gb/s, 1x SATA 3Gb/s); Raid 0,1,5,10

USB USB 2.0, 8 ports USB 2.0, 8 ports Type 2: USB 2.0, up to 8 ports; Type 6: USB 3.0, 2 ports and USB 2.0, 6 ports

Type 2: USB 2.0, 8 ports Type 6: USB3.0, 4 ports and USB 2.0, 4 ports

4x USB 3.0 (XHCI, fully compatible to USB 2.0),4x USB 2.0 (UHCI/EHCI)

PCI Express® 5 PCIe x1 1 PEG x16

Type 2: 6 PCIe x1, 1 PEG x16; Type 6: 7 PCIe x1, 1 PEG x16

Type 2: 5 PCIe Gen 2.0 x1, 1 PEG x16; Type 6: 7 PCIe Gen 2.0 x1, 1 PEG x16 (Gen 2.0)

Type 2: 5 PCIe Gen 2.0 x1, 1 PEG x16 Gen 2.0; Type 6: 7 PCIe Gen 2.0 x1, 1 PEG x16 Gen 3.0

7x PCIe x1 Gen 2.0 (optional: 8x PCIe x1 without LAN)

PCI PCI 2.3, 32 bit / 33 MHz PCI 2.3, 32 bit/33 MHz (Type 2 only)

PCI 2.3, 32 bit/33 MHz (Type 2 only)

PCI 2.3, 32 bit/33 MHz (Type 2 only)

-

Ethernet Intel® 82567, 10/100/1000 MBit

Intel® 82557, 10/100/1000 MBit

Intel® 82579, 10/100/1000 MBit

Intel® 82579, 10/100/1000 MBit

Intel® i218-LM (Clarkville), 10/100/1000 MBit

Sound Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio + DP dual stream

Graphics Controller Intel® GMA X4500 DirectX® 10, PS 4.0

Intel® iGFX GMA HD/5700MHD, DirectX® 10, PS 4.0

Intel® iGFX HD3000/HD2000 integrated, DirectX® 10.1, PS 4.0, OpenGL 3.0

Intel® iGFX HD4000 integrated, DirectX® 11, PS 5.0, OpenGL 4.0, OpenCL 1.1

Intel® HD Graphics 4600 (Gen 7.5)

Graphics Memory Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 1700 MB DVMT Up to 1720 MB DVMT

Display Interfaces Dual SDVO multiplexed with PEG, DisplayPort and HDMI, Single/Dual Channel LVDS 18/24 Bit up to 1600x1200, TVout, CRT up to 2048x1536

Type 2: VGA, LVDS, PEG (Multiplexed) Type 6: VGA, LVDS, 1x DDI (SDVO/DVI/DP/HDMI), 2x DDI (DVI/DP/HDMI), PEG (Multiplexed)

3x DP++ (incl. 1x SDVO, 1x eDP) 1x CRT, 1x Dual Channel LVDS 18/24 bit ( DP++ and PEG multiplexed on Type 2)

3x DP++ (incl. 1x eDP), 1x SDVO, 1x CRT, 1x Dual Channel LVDS 18/24 bit (DP++ and PEG multiplexed on Type 2)

3 independent display outputs, 3x DP++ (HDMI/DVI/DP) including 1x eDP, support for Daisy Chain, 1x CRT up to 1920 x 1200, 1x Dual Channel LVDS 1/2x18/24 bit up to 1920 x 1200

Power Support 8.5 V – 18 V; ACPI 3.0 8 V – 18 V; ACPI 3.0 8.5 V – 18 V; ACPI 3.0 8.5 V – 20 V; ACPI 3.0

Form Factor COM Express® basic: 125 x 95 mm, Pin-out Type 2

COM Express® basic: 125 x 95 mm, Pin-out Type 2 or 6



COM Express® basic: 125 x 95 mm, Pin-out Type 6

Temperature Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C on request (esp. Celeron® 722, SU9300, SL9400)

Operation: 0°C to +70°C, Storage: -30°C to +85°C

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C (esp. i7-2610UE, i7-2655LE) on request


Operation: 0°C to 60°C, Storage: -30°C to 85°C

www.kontron.com30

» COM Express® compact «

COM Express® compact

COMe-cSP2 (microETXexpress®-SP)

COMe-cXLi2 (microETXexpress®-XL)

COMe-cPV2 (microETXexpress®-PV)

COMe-cDC2 (microETXexpress®-DC)

CPU Intel® Atom™ Z510, Z530 Intel® Atom™ Z520PT Intel® Atom™ D510, D410, N450, D525

Intel® Atom™ N270

CPU Clock Up to 1.6 GHz 1.33 GHz Up to 2x 1.66 GHz 1.6 GHz

Cache 32 kB Instruction Cache + 24 kB L1, up to 512kB L2

512 kB L2 Up to 1 MB L2 512kB L2

Chipset Intel® SCH US15W Intel® SCH US15WPT Intel® 82801HM Intel® 945GSE, ICH7M

Bus Speed 400/533 MHz FSB 533 MHz FSB 667/800 MHz 400/533 MHz FSB

Memory Up to 2 GB DDR2 Onboard up to 2 GB DDR2 (industrial temperature range)

Up to 2x 2 GB DDR2/DDR3 Up to 2 GB DDR2

Hard Disk 2x SerialATA (RAID 0,1), 1x PATA

1x SerialATA, 1x PATA, Optional industrial temperature range SSD onboard

3x SerialATA 2x SerialATA (AHCI), 1x PATA, optional SSD flash onboard

USB USB 2.0, 8 ports (1x USB Client)

USB 2.0, 8 ports USB 2.0, 8 ports USB 2.0, 8 ports

PCI Express® 2 PCIe x1, optional up to 5 PCIe x1

2 PCIe x1 lanes 5 PCIe x1 lanes 3 PCIe x1

PCI PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz

Ethernet Intel® 82574L, 10/100/1000 MBit

Intel® 82574 (Industrial Temperature Range), 10/100/1000 MBit

Intel® 82567, 10/100/1000 MBit

Intel® 82574L, 10/100/1000 MBit

Sound Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio, AC97

Graphics Controller Intel® GMA 500, DirectX® 9, PS 3.0

Intel® GMA 500, DirectX® 9, PS 3.0

Integrated in Atom™ CPU, GMA950 (200 MHz) with DirectX® 9, PS 2.0

Intel® GMA950, DirectX® 9, PS 2.0

Graphics Memory Up to 256 MB DVMT Up to 1024 MB DVMT Up to 384 MB DVMT Up to 256 MB DVMT

Display Interfaces SDVO 1920x1080, Single-Channel LVDS 18/24 Bit, JILI support

Single channel 24 bit LVDS, Single SDVO channel

LVDS, VGA Single/Dual Channel LVDS up to 1600 x 1200, CRT up to 2048x1536, SDVO, TVout, JILI support

Power Support 8.5 V – 18 V; ACPI 3.0 4.75 V – 18 V; ACPI 3.0 4.75 V – 18 V; ACPI 3.0 8.5 V – 18 V; ACPI 3.0

Form Factor COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2



Temperature Operation: 0°C to +60°C Storage: -30°C to +85°C

Operation: -40°C to +85°C Storage: -40°C to +85°C Industrial Temperature Range: -40°C to +85°C

Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C or -40°C to +85°C (only D525) on request

Operation: 0°C to +60°C, Storage: -30° to +85°C, Extended Temperature: -25°C to 75°C on request

COM Express® compact

COMe-cPC2 (microETXexpress®-PC)

COMe-cOH# (microETXexpress®-OH)

COMe-cTH6 COMe-cCT6

CPU Intel® Core™ 2 Duo SL9400, SU9300, Intel® Celeron® M Processor 722, 723

AMD® G-Series T16R, T44R, T52R, T40N, T56N

AMD® eTrinity R-460L, R-452L, R-260H

Intel® Atom™ N2600, N2800, D2700

CPU Clock Up to 2x 1.86 GHz Up to 2x 1.6 GHz Up to 4x 2.0 GHz Up to 2x 2.13 GHz

Cache Up to 6 MB L2 512 kB L2 tbd 32 KB Instructions cache + 24 KB L1 Cache, 1MB L2 Cache

Chipset Intel® GS45, ICH9M SFF AMD® FCH A50M AMD® A70 Intel® SCH NM10 Express

Bus Speed 800/1066 MHz FSB 800/1066 MHz FSB tbd n/a

Memory Up to 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 2x 4 GB DDR3 Up to 4 GB DDR3

Hard Disk 3x SerialATA 2, 1x PATA 4x SerialATA 3 4x SerialATA 600 2x SerialATA 2

USB USB 2.0, 8 ports USB 3.0 (type 6 only), 2 ports and USB 2.0, 6 ports

USB 3.0, 4 ports and USB 2.0, 4 ports

USB 2.0, 8 ports

PCI Express® 5 PCIe x1 1 PEG x16

6 PCIe x1 7 PCIe Gen 2.0 x1, 1 PEG x8

4x PCI Express® x1 Lanes, one for LAN onboard

PCI PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz (Type 2 only)

- -

Serial Ports – 1x 2-wire TTL 2x 2-wire TTL 2x 2-wire TTL optional

Ethernet Intel® 82567, 10/100/1000 MBit

Intel® 82574L, 10/100/1000 MBit

Intel® WGI210AT, 10/100/1000 MBit

Intel® 82574L (Hartwell) 10/100/1000 Mbit

Sound Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio Intel® High Def. Audio w/ HDMI 1.3a support

Graphics Controller Intel® GMA X4500, DirectX® 10, PS 4.0

AMD® Mobility Radeon HD6250/HD6310, DirectX® 11, OpenCL 1.0, PS 5.0,H.264, VC-1 (ATI Avivo HD)

Integrated Radeon™ HD 7000 series

Intel® GMA 5650/560 DirectX® 9.1, OpenGL 3.0, BluRay 2.0

Graphics Memory Up to 1024 MB DVMT tbd tbd tbd

Display Interfaces Dual SDVO multiplexed with PEG, DisplayPort and HDMI, Single/Dual Channel, LVDS 18/24 Bit up to 1600x1200, TVout, CRT up to 2048x1536

Single Channel LVDS 18 bit, (type 6) 24 bit (Type 2), 2x DDI (DisplayPort/HDMI/DVI) CRT up to 2560x1600 (Type 6)

Single Channel LVDS, 3x DP++ (HDMI/DVI/DisplayPort) incl. 1x eDP, additional 3x DP (multiplexed with PEG), 1x CRT

Single Channel LVDS,2x DP++ (HDMI/DVI/DisplayPort), CRT up to 1920x1200

Power Support 8.5 V – 18 V; ACPI 3.0 4.75 V - 18V; ACPI 3.0 4.75 V – 18V; ACPI 3.0 4.75 V – 20 V, ACPI 3.0

Form Factor COM Express® compact: 95 x 95 mm, Pin-out Type 2

COM Express® compact: 95 x 95 mm, Pin-out Type 2 or 6

COM Express® compact: 95 x 95 mm, Pin-out Type 2 or 6


Temperature Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request

Operation: 0°C to +70°C Storage: -30°C to +85°C

Operation: 0°C to +70°C Storage: -30°C to +85°C

Operation: 0°C to +60°C, Storage: -30° to +85°C, Extended Temperature: -25°C to 75°C on request

–40°C to +85°C

www.kontron.com32

» ETX® «

ETX®

ETX®-DC ETX®-OH

CPU Intel® Atom™ N270 AMD® G-Series, T16R, T40R, T52R, T40E, T56N

CPU Clock 1.6 GHz Up to 2x 1.65 GHz

Cache 512 kB L2 2x 512 kB L2

Chipset Intel® 945GSE, ICH7M AMD® FCH A55M

Bus Speed 400/533 MHz 1066 MHz FSB

Memory Up to 2 GB DDR2 Up to 4 GB DDR3

Hard Disk 2x SerialATA (AHCI), 2x PATA 2x SerialATA (AHCI),2x PATA

USB USB 2.0, 4 ports; opt. 6 ports USB 2.0, 4 ports; opt. 2x miniUSB 2.0

PCI PCI 2.3, 32 bit/33 MHz PCI 2.3, 32 bit/33 MHz

ISA ISA Bus (ETX® 3.0 compliant) ISA Bus (ETX® 3.0 compliant)

Serial Ports 2x full COM ports TTL 2x full COM ports TTL

Ethernet Intel® 82562V, 10/100 MBit Broadcom BCM54610 10/100 MBit

Sound Realtek ALC886GR HDA Realtek ALC886GR HDA

Graphics Controller Intel® GMA 950 Integrated Radeon HD6310 / HD6250 DirectX® 11, PS 5.0, OpenGL 3.2 ATI Avivo HD with H.264, VC-1, Blu-ray support

Graphics Memory Up to 224 MB DVMT 3.0 tbd

Display Interfaces Single/Dual Channel LVDS 18/24 bit up to 1600x1200, SDVO, CRT up to 2048x1536, JILI support

DP++ (DisplayPort/HDMI/DVI), Dual Channel LVDS 18/24 bit up to 1920 x 1200, CRT up to (2560 x 1600)

Power Support 5 V; ACPI 2.0 5 V; ACPI 3.0

Form Factor ETX® 3.0: 95 x 114 mm ETX® 3.0: 95 x 114 mm

Temperature Operation: 0°C to +60°C, Storage: -30°C to +85°C, Extended Temperature: -25°C to +75°C on request


www.kontron.com33

SMARC - Smart Mobility Architecture (82 x 50 mm)

SMARC-sA3874i SMARC-sAMX6i SMARC-sAT30

Processor TI Sitara AM3874, Single core Cortex A8, Up to 800MHz

Freescale i.MX 6 Solo, Dual and Quad Core ARM Cortex-A9, Up to 1.2GHz

NVIDIA® Tegra 3 (Kel-Al), Quad Core™ ARM Cortex A9 1.2 GHz

Memory DDR3 memory, up to 2GB soldered down

DDR3 up to 2 GB, memory down DDR3, 1 or 2 GB, down

Flash Up to 32GB NAND (optionally) Up to 64GB NAND/eMMC (optionally) Up to 64 GB NAND/eMMC (optionally)

Ethernet 10/100/1000 Gbit 10/100/1000 Mbit/sec 10/100/1000 Mbit/sec

USB 2x USB 2.0 (one OTG) 3x USB 2.0 port (one OTG) 3x USB 2.0 port (one OTG)

Display Parallel LCD 18/24bit LVDS Single Channel HDMI

Parallel LCD 18/24 bit LVDS Single Channel 18/24bit HDMI

Parallel LCD 18 / 24 bit LVDS Single Channel 18 bit / 24 bit - 18 bit compatible Support for dual channel 24 bit LVDS (Carrier board xmitter) HDMI

Graphics 3D graphics acceleration HD video processing

Dual Display HD 1080p encode and decode 2D and 3D acceleration

Dual Displays HD Video Decode, including MPEG2 HD Video Encode 2D and 3D acceleration GPU ULP GeForce / 12 cores

Additional Interface 1x PCIe; I2C; I2S; 4x UART; 2x CAN; GPIO Battery and System Management; SATA

Up to 3 PCIe x1, MLB150, 12xGPIOs, SDIO, SATA eMMC, 2x SPI, 5x I2C, 2x I2S, SPDIF, WDT, 2x CAN, Battery and System Management

PCIe Gen 1 x1 lane width, 2 links plus support signals SATA, SD Card, eMMC, 2x SPI, 5x I2C, 3x I2S, 4x UART, 12x GPIO, SPDIF, WDT, Battery and System Management

Image Capture Interfaces Camera 10bit parallel interface 1x PCAM, 1x CSI 2x Camera Ports CSI-2, dual lane

SW Support Windows WEC7, Android, Linux Windows WEC7, Android, Linux Android ICS, Linux

Power Typ. 2 Watts tbd 5 Watts typical

Thermal Industrial temperature: -40°C to +85°C

Commercial temperature: 0°C to +60°C Industrial temperature: -40°C to 85°C (800 MHz)

Operating temperature: 0°C to 60°C Industrial version planned

–40°C to +85°C–40°C to +85°C

» SMARC «

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About Kontron

Kontron is a global leader in embedded computing technology. With more than 40 % of its em-ployees in research and development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and sup-port, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators.

Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelera-ted time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.

Kontron is listed on the German TecDAX stock exchanges under the symbol “KBC”. For more infor-mation, please visit: www.kontron.com

Asia Pacific

17 Building,Block #1, ABP. 188 Southern West 4th Ring Road Beijing 100070, P.R.China

Tel.: + 86 10 63751188 Fax: + 86 10 [email protected]

CORPORATE OFFICES

Europe, Middle East & Africa

Oskar-von-Miller-Str. 1 85386 Eching / Munich Germany

Tel.: + 49 (0) 8165 / 77 777 Fax: + 49 (0) 8165 / 77 [email protected]

North America

14118 Stowe Drive Poway, CA 92064-7147 USA

Tel.: + 1 888 294 4558 Fax: + 1 858 677 [email protected]

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