www.penchem.com

AGENDA1) Company Profile 2) Product Portfolio 3) Product Development & Technology Roadmap4) Organization Chart 5) Factory Overview 6) Why Penchem Products7) ISO Certification8) Penchem Analytical Capability & Services9) Applications Lab10) Customers Footprint11) IMDF Registered for Automotive Industries12)Penchem Products Overview

COMPANY PROFILE

• Founded in 1999

• Started as a formulator and manufacturer of high performance adhesives in Permatang Tinggi

• Focused mainly in General Electronic applications

1999 - 2003 2004 - 2007

• Expanded R&D and started the development of LED epoxy for Displays

• Initiated the research on silicone for LED

• Developed a wider range of products for General Electronic applications (>100 products)

• Appointed distributors in Malaysia, Thailand and Singapore

2008 -present

• Moved to a new factory in Bkt Minyak with total build-up area of 25k sqft

• Further expanded on R&D, Quality and Production capability and capacity

• Developed LED epoxy and silicone products for PLCC and high brightness lamps

• Setting up equipment & facilities to synthesize specialties silicone

• Appointed distributors in China and Taiwan

PRODUCT PORTFOLIO – PRESENT & FUTURE

LED Silicone, TIM (Thermal Interface Material), Fiber Optic Adhesives

• Manufacturing facilities to synthesize specialties compounds

• Specialty Fiber Optic Adhesive• Specialty Thermally or

Electrically Conductive Material

LED Epoxy, UV Epoxy, Silver Epoxy, SMT, COB, Potting & Sealant)

2007 - 20112000-2006 2012 - Present

Marine & Composites

2017

MedicalAdhesives

2015

Silicone LED

& Adhesives

2013

Fiber Optics & TIM

2009

Custom Formulations

1999

Silver DA & SMT Epoxies

银胶和SMT环

2001

COB & Relay Sealant

2003

LED Epoxies &

UV adhesives

2007

EMI GasketConductive Ink

2018

Markets

Electronics

Semiconductor

Automotive

Aerospace

LEDs

Fiber Optics

Marine

PRODUCT DEVELOPMENT & TECHNOLOGY ROADMAP

ORGANIZATION CHART

SALES & MARKETG

S & M Dept Mgr

-M.Sc. Chemistry

Sales & Mktg Mgr

-B.Eng. (Hons)

Mechanical

-B.Sc. (Hons)

Biotechnology

Sales & Mktg Eng.

-B.Eng. (Hons)

Chemical

Sales Support Exec.

MANAGING DIRECTOR

Ng Chee Mang

R&D

R&D Mgr

-M. Sc. Applied

Science

R&D Sec. Mgr

-M.Sc. Materials

Eng.

R&D Engineers

-PhD. Materials Eng.

-M. Sc Eng. Science

-B. Eng. (Hons)

Polymer

-B. Sc (Hons)

Chemistry, Materials

Science, Biology

Lab Assistants

FINANCE

Finance Mgr

-B. Accounting

Finance Exec

GENERAL MANAGER

BUSINESS

DEVELOP.

MD

Director

Director

R&D Mgr

GM

ADMIN & HR

HR Manager

-B.A. (Hons)

Management

HR Exec

-B.A. (Hons) English

QUALITY

Quality Manager

-B.Eng. (Hons)

Chemical

Quality Engineers

B.Sc. (Hons)

-Chemistry

-Pure Chemistry

-Applied Science

Doc Control

Lab Assistants

SUPPLY CHAIN

Supply Chain Mgr

Procure, Warehse, Production Mfg Process Eng Customer Service

Pack’g-Del’ry Mgr Mgr Execs

-B.Eng. (Hons) -B.Eng. (Hons) -B. Computer

Chemical Chemical Science

-B. Logistics &

Transportation

Procurement Exec. Prod. Eng Process Eng

-B. Food Sc -B.Eng. Mfg. -PhD. Polymer Composites

Store Exec Prod. Supervisor Maintenance

Technician Sup

Technician Specialist

Store Assistant Line Leader Technician

Prod. Clerk

Operators

FACTORY OVERVIEW

R&D and Quality Laboratories

WarehouseProduction

Administration Office

Silicone Synthesis Plant

WHY PENCHEM PRODUCTS

Main key reasons:

✓Wide range of high quality and performance products ✓Custom formulations and solutions✓Cost effective alternatives

• Industry leading price and performance• Small Minimum Order Quantity, MOQ• Design and Synthesis of key raw materials / specialties materials

✓Strong and comprehensive technical support • Provide competitors evaluations, incorporate with professional system/equipment

manufacturer to provide total solutions, materials failure analysis and process trouble shooting

✓RoHS compliant (test report issue by SGS and accredited test labs)

ISO CERTIFICATION

ANALYTICAL CAPABILITY & SERVICESElectrical, Reliability & Curing

Analysis

Resistivity Meter

Hot Plate

Humidity Chamber

Digital Programmable Oven

Digital Oven

Solder reflow chamber

Light integrating sphere

UV Spot, UV LED, UV Conveyer

Thermal, Optical and Physical Analysis

TGA

TMA

DMA

DSC/UV-DSC

Tensile Tester

Hardness Tester

Viscometer

Refractor Meter

Colour Assessment Chamber

Digital Balance

Flow Tester

Density Meter

LP and HP Microscopes

Thermal Conductivity meter

Chemical and Molecular Analysis

Pyr-GC-MS

GPC

MICRO-FTIR

NMR

APPLICATIONS LAB

• Simulate customers process conditions• Help customers resolve material & process issues

CUSTOMER’S FOOTPRINT

United States of America

Malaysia, Singapore, Thailand, Indonesia, India and Australia

Europe

China (HK & Taiwan), Japan,

Philippines

IMDF FOR AUTOMOTIVE INDUSTRIESPenchem is a registered manufacturer and automotive materials supplier in

the International Material Data System (IMDS) since 2012

PENCHEM PRODUCTS OVERVIEW

产品概述

GENERAL ELECTRONICFinished Products Product Category Product Code Applications Special Features

Chip On Board Epoxy (COB)

➢ EN453➢ EN485 series➢ EN525➢ EN641➢ EN690➢ EN943-19

• Chip-On-Board• Dam & Fill• Encapsulation and protect

components and bonded wires

• Good mechanical and adhesion strength• Low stress• Good thermal-mechanical properties• Good whether ability

Die Attach / SMTEpoxy / Silver Epoxy / Under Fill

➢ CB643➢ CB644➢ CB651➢ DA669-series➢ UF256-series➢ AG828

➢ AG803➢ AG806 ➢ AG830-12➢ AG819 – series➢CB603 Series

• Bonding chip and component on PCB• Die attach (Electrically & non-

electrically conductive)• Under-fill

• Good mechanical and adhesion strength• High thixotropic, no bleeding and tailing• High electrical conductivity (silver epoxy)

Epoxy Sealant ➢ GL158➢ GL168➢ GL172➢ GL174➢ GL440➢ GL506

➢ GL616➢ GL902-4

• Relays & Contactors• Fiber optic• Lens

• Low thermal-mechanical stress• High thermal and moisture resistance• Good chemicals resistance

Epoxy Potting / Silicone Potting

➢ PT300➢ PT365➢ PT366 ➢ PT369➢ PT380-1➢ PT497

➢ PT542➢ PT605➢ PT610➢ PT910-4➢ PT912-1

• Transformer• Sensor

• Low stress, Good thermal-mechanical properties and whether ability

• Good flow ability & self-levelling

UV Epoxy / Silicone ➢ UV200 ➢ UV255➢ UV367➢ UV379-1➢ UV421-2 ➢ UV705 Series➢ UV706 Series➢ UV566-series

➢UV760-series➢ UV766-series➢ UV768➢ UV788➢ UV900➢ UV923➢UV773 Series

• Bonding Fiber optic• Bonding Lens• Tacking Coils• Coating

• High Refractive index (RI=1.4 to 1.5)• Good mechanical and adhesion strength• Fast curing

PHOTONICFinished Products Product Category Product Code Applications Special Features

Casting Epoxy ➢ PT1002➢ PT542➢ OP695-7➢ OP692 Series

• Automobile lighting• Turn signal bulbs• Electronic signs• Signboards• Backlighting• Traffic signal lights

Package Type:❑ Through hole LED (3mm, 5mm, Oval, Flat-

top)❑ Super Flux❑ Snap LED

• Outstanding performance for outdoor applications• Pass 1000TMCL -55°C to 100°C and -45°C to

+120°C• Meet MSL2 specifications• Low Iv degradation (<10%) at 1000hours HTOL• Comply to REACH & RoHS requirements

High Brightness LEDEpoxy/Silicone

➢ OP954 Series➢ OP959 Series ➢ OP966➢ OP955 Series➢OP995 series

• Commercial lighting• Architectural lighting• Outdoor lighting

Package Type:❑ High power LED

• High transmission > 92%• High thermal & radiation resistance, Low stress• Low gas permeability• Wide range of refractive index (RI from 1.4 to 1.58)

SMD/PLCCEpoxy / Silicone ➢ OP685 series

➢ OP955 Series➢ OP959 Series

• Backlighting for signage, LCD panel (TV, hand phone, tablets, etc

• Architectural Lighting• Automotive Accent Lighting

Package Type:❑ PLCC/SMD LED

• Good heat & UV resistance• Meet MSL2 specification

Potting Epoxy ➢ OP281-1 • S4 (seven Segment Display) for counters and digital instruments

• Low thermo-mechanical stress • Meet MSL2 specification

THERMAL MANAGEMENTFinished Products Product Category Product Code Applications Special Features

Silicone or Non Silicone Pad

➢ TH935-2➢ TH979➢ TH996➢ TH211 Series➢TH212 Series➢ TH832➢ TH997➢ TH994➢ TH838

• Heat sink for Power driver, IC for PC, Set

box, Notebook, & Server• Heat sink for high power LED and controller• Heat sink for automobile and heat

exchangers

• Very good thermal conductivity up to 8.0W/mK• 2 types of Pad: (a)Non-sticky and (b)Two-side

sticky• Can die cut to specific size and dimensions• Wide range of thickness (0.3mm up to 7mm)

Silicone or non Silicone Putty / Grease

➢ TH930➢ TH931-2➢ TH932-3➢ TH936-1➢ TH937➢ TH975➢ TH976-1

➢ TH235 Series➢ TH837 • Excellent outdoor performance with good stability

& reliability • Ease of use by dispensing or screen printing

Potting Silicone /Epoxy

➢ TH912-1 ➢ TH934-4➢ TH934-6➢ PT604➢ PT605

• 2-Part RTV potting compound• Good adhesion and weather ability • Good flow ability and self-leveling

Thermally ConductiveSilicone / Epoxy

➢ TH732-1➢ TH670➢ TH974

• 1-Part heat curable epoxy• Excellent adhesion and good mechanical strength • Good thermal conductivity

• Solid at room temperature but changes phase to a viscous liquid at 55°C• For an ultra thin bond linePhase Change

Thermal Stick➢ TH711 (B)➢ TH711-1 (P)

COMPOSITEFinished Products Product Category Product Code Applications Special Features

Structural Epoxy ➢ GL 301➢ GL 302➢ GL 304➢ GL 305➢ GL 306➢ GL 307➢ GL 310➢ GL 311 Series➢ GL 312

• Lamination and vacuum infusion for quality boat• Repair of boat blister and parts• Tank and other composite structures

• Good water resistance• Low viscosity for good wetting on different substrates. E.g: Closed cell foams (PVC and SAN foams) and various types of fiberglass mat.

THANK YOU!

PENCHEM ANALYTICAL CAPABILITY & SERVICES

TGA Thermal Gravimetric Analysis

TMA Thermo MechanicalAnalysis

DMA Dynamic Mechanical Analysis

DSC Differential Scanning Calorimetry

It is a thermal analysis in which changes in physical and chemical properties of materials are measured as a function of increasing temperature or time. Determination of 1. Trace of inorganic filler

content 2. Thermal stability of materials3. Oxidation stability of

materials

It measures the dimensional and mechanical changes of materials at elevated temperature. Determination of 1. CTE2. Tg3. Changes of mechanical properties subjected to temperature change 4. Cure shrinkage

It measures the change in modulus or stiffness of material at elevated temperature.Determination of 1. Complex modulus, M*2. Storage modulus, M'3. Loss modulus, M"4. Glass transition, Tg

It measures the change of thermal dynamic performance Determination of 1. Oxidative Induction time (OIT)2. Glass transition, Tg3. Melting point, Tm4. Crystallization Temp, Tc5. Heat capacity changes6. Estimation of curing % or curing duration 7. Thermal kinetics study

GPC / SEC GC-MS + Pyrolyzer Micro-FTIR (ATR / KBr method)

Ultraviolet-Visible Spectrometer (UV/Vis)

• GPC is often used to determine the relative molecular weight of polymer samples as well as the distribution of molecular weights.

• The primary goal of instrument analysis is to quantify an amount of substance by comparing the relative concentrations among the atomic masses in the generated spectrum

• Material purity• Trace contaminants analysis

• Determination of functional group and structure of materials. Quantitative analysis and qualitative characterization.

• Determination of 1. % T or absorbance2. PtCo color3. Haze4. Whiteness index5. Hunter Lab6. Gardner Color

PENCHEM ANALYTICAL CAPABILITY & SERVICES

NMR Nuclear Magnetic Resonance Spectroscopy

Tensile Machine Refractometer Viscometer

It determines the physical and chemical properties of atoms or the molecules in the sample base on the nuclear magnetic resonance phenomenon and can provide detailed information about the structure, dynamics, reaction state, and chemical environment of molecules

Determination of 1. Tensile strength2. Elongation % 3. Push Strength 4. Strength(Compression) 5. Lap shear strength 6. Tear strength

Measure the Refractive Index (RI) ofthe sample

1. Viscosity and viscoelasticproperties

2. Pot Life determination3. Gel time determination

PENCHEM ANALYTICAL CAPABILITY & SERVICES

PENCHEM ANALYTICAL CAPABILITY & SERVICES

Thermal Conductivity Meter Resistivity Meter Hardness Tester (Shore A/ D/ 00)

Density Meter

Determination of the thermal conductivity of material.

Measure the electrical resistivity of the sample using 4-point probes technique

Determination of Hardness Specific gravity/ Density of solid sample

PENCHEM ANALYTICAL CAPABILITY & SERVICES

Low/High Resolution Optical Microscope

Light Integrating Sphere Micro-Reflow Simulation Oven Humidity Chamber

1. Sample appearance2. Contaminant including shape, size,

texture and uniformity. characterization.

3. Stress characterization

Measure the Light output and the performance and stability of light emitting and optical products

Simulate real reflow ovenstemperature profiles and conditions. The real-time video camera records the changes (eg. color change, crack, delamination) of the samples under the testing conditions.

Humidity and temperature simulation test to accelerate the effects of exposure to the various environmental conditions.

PENCHEM ANALYTICAL CAPABILITY & SERVICES

UV Chamber Molding machine R&D Chemical Reactors R&D Fume Hood

Developing UV curable compoundsand UV aging test

Developing of Silicone Molding Compound

Synthesis of chemical compounds Materials preparation