© h. heck 2008section 1.31 module 1:introduction topic 3:interconnect technology ogi ee564 howard...
TRANSCRIPT
© H. Heck 2008 Section 1.3 1
Module 1: IntroductionTopic 3: Interconnect Technology
OGI EE564
Howard Heck
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Where Are We?
1. Introduction1. Overview
2. Trends & Challenges
3. Interconnect Technology
2. Transmission Line Basics
3. Analysis Tools
4. Metrics & Methodology
5. Advanced Transmission Lines
6. Multi-Gb/s Signaling
7. Special Topics
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Contents
Component PackagingPassive ComponentsConnectorsPrinted Circuit Boards
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Overview
Components(Chip + Pkg)
PCB(Motherboard)
PCB(add-in card)
Connector
Source: Intel Corp.
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Overview – SOA Desktop Motherboard
Microprocessor
Memory Slots
Chipset
Graphics Connector
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Overview – SOA Desktop Motherboard
Microprocessor
Memory ConnectorsChipset
Graphics Connector
X48 chipset motherboard
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Component Packaging
Packages house the silicon chips. They provide:Mechanical supportHeat removalEnvironmental protectionElectrical signal & power connections (chip to PCB).
SiliconPackage
PCB
Soldered Connections
Heat Spreader
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Component Packaging
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Component Packaging
Source: Intel Corp.
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Example: Flip Chip Pinned Grid Array
Bottom Top
Cross-section
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Medium Speed Package Electrical Models
Bond Wire Trace Pin / Land
Tie Bar
Lbw Rbw Lpin Rpin
Z0, d
Rtb , Ltb , Ctb
Die
Bo
ard
Source: Packaging Databook, Intel Corp
Today’s speeds demand that we use fully coupled 3D package models.
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Passive Components
Resistors Uses: termination for interconnect, pull up/down for static
features Variability: 5%, 2%, 1% Chip resistors – 1 resistor per component R-Packs – up to 4 resistors per small outline component Resistor networks – more resistors per component Lead inductance and package crosstalk can be important
effects for high frequency applications. Capacitors Variability: 20%, 10% Chip capacitors – used for high frequency (local) decoupling of
power suppliers Tantalum capacitors – used for bulk decoupling At high frequencies, resistance and inductance of the packages
must be included in the models.
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Sockets & Connectors
Sockets connect packages to PCBs. Connectors connect PCBs to PCBs. Connection is mechanical between two metal surfaces.
LGA775 Socket
DIMM connector
PCI® Express
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Socket/Connector Electrical Models
R con L con
C con
These are simple models. Coupled models are frequently used for high performance applications.
Rcon Z0con, dcon
Today’s speeds demand that we use fully coupled 3D connector models.
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Printed Circuit Boards Function: provide electrical signal connections
between components & deliver power to the components.
Material Set:Function Material
Signal Conductors (traces) Copper (foil & plated)
Power (layers & traces) Copper (foil)
Vias (layer-layer connection) Copper (plated)
Dielectric (insulator) FR-4 (epoxy resin/fiberglass)?
Component connection Eutectic Sn/Pb solder
Solder Mask Typically polyimide based.
Construction: Typically 4 to 6 layers (always an even number). 4 layer board: 2 signal, 2 power ($0.09/in2) 6 layer board: 4 signal, 2 power ($0.18-$0.24/in2) Higher layer counts are available at higher cost.
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PCB Construction
Power Plane
Signal Trace
Solder Mask
Via Barrel
Surface Mount Pad
Via Land
Laminate (Dielectric)
Laminate (Resin)
Laminate (Glass)
Signal Trace
Power Plane
Solder Mask
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PCB Signal Layer
0.0
50
"
G0.005"
W
0.024"D2
0.005"S1
0.006"S2
0.012"D1
W Signal trace width G Via grid spacing
D1 Via diameter S1 Pad-trace spacing
D2 Via capture pad diameter S2 Trace-trace spacing
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PCB Vias
Vias make layer-layer connections by drilling holes and filling them with conductor material (copper).
They are used in chips, package, and boards.
SiliconPackage
PCB
Soldered Connections
Heat Spreader
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PCB Design Goals
Function: All signals connected Performance: Maximum operating frequency Cost
Minimized technology requirements• Layer count
• Board size
• Relaxed width & spacing
• Relaxed via size
Design for manufacturability• Component selection
• Component placement
• Trade routing
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Summary
Package electrical parameters are typically modeled with lumped circuit elements and transmission lines.
We will examine the effects of lumped elements later, and will account for them in our design project. We will also consider when transmission line models are required.
For high volume PCs, system designers use pervasive, low cost PCB solutions: FR-4 material set 4 layer boards 5/5 or 6/6 mil trace/space wiring 4 boards per panel for motherboards
PCBs are used for motherboards, add-in cards, and CPU packages.
PCBs provide interconnect for high speed buses operating as high as 400 MHz/800 MT/s and beyond.
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References
Intel Packaging Databook, Intel Corporation, 2002, http://developer.intel.com/design/packtech/packbook.htm.
Component Types Used for SMT, IBM Microelectronics Division, January 1994.
Surface Mount Design and Land Pattern Standard, IPC-SM-782, IPC, Revision A – August 1993.
R.R. Tummala, E.J. Rymaszewski (ed.), Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989.
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Appendix: More Packages
Celeron® Processor PackageCeleron® Processor Package Celeron® Processor CartridgeCeleron® Processor Cartridge
Pentium® Processor w/ MMX™ PackagePentium® Processor w/ MMX™ Package850 Chipset 850 Chipset PackagePackage
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Appendix: More Connectors
ISA PCI
Memory DIMM
SLOT1
AGP
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Appendix: CPU Sockets
PGA370