01/30/04 *other brands and names are the property of their respective owners page 1 futures...
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Futures Subcommittee Proposed “New” Futures Subcommittee
To create, discuss and draft IBIS/ICM updates
Tasks for IBIS 4.2 and Following “Clean up” of language and resolve conflicts
Example: [S. Pin Mapping] (BIRD87), [Driver Sched.] (BIRD88) [External Model] integration issues
Example: Acceptable digital states for input ports [External Circuit] usage issues
User-definable measurement parameters and delay fixtures Specification “hooks” between ICM and IBIS ANSI ballot approval as 656-B
Tasks for ICM Add frequency-dependent RLGC matrix support Resolve known parser assumptions and keyword conflicts
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Cookbook & Training Proposed Cookbook Subcommittee
Joint action with Quality Subcommittee Creates, edits and distributes Cookbooks
Practical examples of new keywords Hints for data extraction and correlation See S. Peters’ 1997 IBIS 2.1 Cookbook
Suggest following model of HTML specification guides Describe all keywords Use “deprecated” for those no longer encouraged
e.g., [TTpower] Separate ICM and IBIS publications
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Previous Cookbook1.0 Introduction
1.1 Quick Overview of an IBIS File1.2 Steps to creating an IBIS Model
2.0 Pre-Modeling Steps2.1 Basic Decisions
Model Version and ComplexitySpecification Model vs. Part ModelFast and Slow Corner Model LimitsInclusion of SSO Effects
2.2 Information Checklist2.3 Tips For Component Buffer Grouping
3.0 Extracting the Data3.1 Using Spice to IBIS (s2ibis)3.2 Extracting I/V and Switching Data via Simulations
3.2.1 Extracting the I/V DataSimulation Setup3-state BuffersOutput Only BuffersOpen Drain BuffersInput BuffersSweep RangesMaking Pullup and Power Clamp Sweeps Vcc RelativeDiode ModelsDiode Transient Time Data
3.2.2 Extracting the Ramp Rate or V/T Waveform DataExtracting Data for the [Ramp] KeywordExtracting Data for the Rising and Falling Waveform KeywordsMinimum Time StepMulti State Drivers
3.3 Obtaining I/V and Switching Information via Lab Measurement
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Previous Cookbook (2)
4.0 Putting the Data Into an IBIS File4.1 IBIS File Header Information4.2 Component and Pin Information4.3 The [Model] Keyword
Parameter sectionTemperature and Voltage KeywordsI/V data sectionPulldownGround ClampPullupPower ClampExtrapolation Errors[Ramp] and Waveform Tables
4.4 External Package Models4.5 Verifying the IBIS file
5.0 Validating the Model6.0 Correlating the Data7.0 Resources
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Apr May Jun Jul Aug Sep Oct Nov Dec Jan Feb MarQ2’04 Q3’04 Q4’04 Q1’05
26 39 52 13
Apr May Jun Jul Aug SepQ2’05 Q3’05
26 39
Development Timeline
Not Shown July, 2002: IBIS 4.0 approved Sept., 2003: ICM 1.0 approved
Spec Activities
1
Jan Feb MarQ1’04
IBIS 4.1Approval
IBIS 4.1Parser
DesignCon Summit
DATE
PCB East
IBIS 4.2Proposal
ICM 1.5Proposal
IBIS 4.1Cookbook
ICM 1.5Approval
ICM 1.0Cookbook
IBIS 4.2Approval
DAC
Summits
“E-Roadshow” “E-Roadshow” “E-Roadshow” “E-Roadshow” “E-Roadshow”