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670 Series Hardware

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Remark

There are notes to each slide in this

The notes are needed in order for the

’

Time is required for preparation before

resentin this material

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670 Series Hardware

Introduction

Platform Based

Time Synchronization

I/O Ca abilit

Mounting Flexibility

Commitment to Quality

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Variants of 670 Series HardwareIntroduction

Ventilated casing withcommon look for all products

3 sizes - 1/2, 3/4 or 1/1 of 19” 6U high (266mm)

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670 Series Hardware

Introduction

Platform Based


I/O Ca abilit



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670 Series Hardware StructurePlatform

Based

Transformer Input Module TRM6I + 6U, 9I+3U or 12I

One or two - TRM1 & TRM2 for 12

Analog Digital Conversion module ADM1 and ADM2 for TRM inputs

GPS time synchronization moduleGSM (option)

Time s nchronization via binar signal and communication portsIRIG-B

Binary Input / Output modules BIM,

, , , Power supply module PSM

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670 Series Hardware PlatformPlatform

Based

ABB IED 670

A/D

Module

Analogue

Module

ConversionInputMain

ModuleProcessing

GPS

ModuleSynch

Binary

ModuleI/O

Binary

Module

I/O

TRM AD1 NUM GSM BIM

Binary

ModuleI/O

BIM BIM MIM PSMBOMBOM

Binary

Module

I/OBinary

Module

I/OPower

Module

SupplymA

Module

Input

3

3

3Logics CAN

1Mbit/s

PCU

~~~~

A/D6 I

6 U

3

Comm-

-

OEMLDCM

cation

I/O I/O I/O I/O mAI/O

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View from Rear Side with ContactsPlatform

Based

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View from Rear Side with RinglugsPlatform

Based

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Numerical ModulePlatform

Based

Main Controller/CPU typeIBM 3200 PowerPC 750FX, 600MHz

Internal communication with cPCIbus 100 Mbit/s

Up to 128 Mb FLASH

Up to 256 Mb DRAM yc e me n ser es

1 or 3 ms for protection

8 or 100 ms for logic

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Interfaces on the Numerical ModulePlatform

Based

Mounting position for serial

communication module with

SPA, LON, IEC -103

-

module

Mounting positions for two

commun ca onmodules

Internal communication cPCI

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bus

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Power Supply ModulePlatform

Based

Input range: 24-60 V DC

Input range: 90-250 V DC

Internal fail relay output

DC/DC Converter provides fullisolation between IED 670 andexternal battery system

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670 Series HardwarePlatform

Based

Few spare parts on

mo u ar eve

Type tested platform

Easy future extensions

Minimized Cost for Maintenance

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670 Series Hardware

Introduction

Platform Based


I/O Ca abilit



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Time

Synchronization GPS Time Synchronization Module

For multi-terminal current differential

1 MHz High Accuracy output; < 1μs Minute pulse / IRIG B

Connection

to antenna

differential protection)

IEC 61850-8-1 synchronization

Accurac < 1 ms

LON synchronization

Accuracy < 2 ms

module

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CAN bus

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IRIG-BTime

Synchronization

The IRIG interface to the IED

supplies two possible

, -

and PPS IRIG-B is a protocol used only for

An optical PPS signal can be

supplied to the optical interface of

Max 1 IRIG-B module per IED 670

Mounting position for the IRIG-B

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GPS Antenna and Coaxial CableTime

Synchronization

Accurate synchronization of

sampled data

1 microsecond accuracy Line Differential Protection

communication network

Wide Area Protection and Phasoreasuremen n app ca ons

SMA contact for connection to

GSM

Accurate time synchronization

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670 Series Hardware

Introduction

Platform Based

Time Synchronization I/O Ca abili t



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EMC Enhanced Binary Input ModuleI/O

Capability

16 independent Binary Inputs

Increased interference immunity2 x IEC requirements for 50 ms

Debounce filter, T = 5 ms

Oscillation suppressiondetection within 1 s > 0 - 40 Hz

No pulse counting Auxiliaryvoltage

48/60 V DC (±20%)

110/125 V DC (±20%)[mA]

Increased interference

immunit

Threshold voltage 60 %

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135 70 [ms]

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BIM for Pulse CountingI/O

Capability

16 independent Binary Inputs

Debounce filter, T = 5 ms

Oscillation suppressiondetection within 1 s; > 0 - 40 Hz

Pulse countin available for allinputs

Auxiliary voltages

48/60 V DC (±20%)

110/125 V DC (±20%)Standard interference immunity

Threshold voltage 60 %30

m

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13,5 7 [ms]

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Binary Output ModuleI/O

Capability

24 single output relays

or

12 double pole command

output relays

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EMC Enhanced Binary Input/Output ModuleI/O

Capability

8 independent Binary Inputsand 10+2 Binary Output relays

Increased interferenceimmunity 2 x IEC for 50 ms

Fixed filter time 3/5 ms

24/30 V DC (±20%)

48/60 V DC (±20%) 110/125 V DC (±20%)

220/250 V DC (±20%)

30[mA] Increased interference

immunity

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1

35 70 [ms]

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Static Output ModuleI/O

Capability

High Speed Applications

6 static binary outputs

6 change over contacts

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Analog / Digital Conversion ModuleI/O

Capability

Analogue inputs from

transformer module

Mounting position for Optical

Ethernet module (only on AD1)

cPCIbus

Mounting positions for EIA-485

module (only on AD1)

Mounting positions for 2 extraLDCM modules (only on AD1)

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mA Input ModuleI/O

Capability

6 independent input channels

Software selected input ranges

- - -, , ,

1-5, 2-10, 4-20, mA ± 5, ± 10, ± 20 mA

Resolution: 16 bit

Accuracy: 0,1%

Inde endent settable di ital filters

Supervision of

Limits,

ver ow

Max/Min Range

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Transformer Input ModuleI/O

Capability

Up to 12 analogue inputs can be

connected

0 - 6 U, 110-220V rated range 50/60 Hz

6 -12 I, 1A or 5A rated current

to enter into IED 670

Adapt measured values to static circuitry

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Standardized Transformer ModulesI/O

Capability

6I and 6U 6 66I and 6U 6 6

9I + 3U 9 3

9I + 3U 9 3

9I + 3U 5 4 3

12I 1212I 12

6I

5I + 5U

6

5 5

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I/O-modules 1/1 19” CaseI/O

Capability

Full 19” case with 24 binary

modules

¾ x 19” case with 24 analogin uts and u to seven I/Omodules

½ x 19” case with 12 analog

inputs and up to three I/Omodules

Extensive I/O capability enables

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670 Series Hardware

Introduction

Platform Based

Time Synchronization I/O Ca abilit



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Mounting ArrangementsMounting

Flexibility

Several mounting alternatives

½, ¾ and 1/1 rack size

- - -, ,rack mounting

IP 54 front protection flushmounting

Side by side

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Rack, Panel or Surface MountingMounting

Flexibility

1/2, 3/4 or 1/1 of 19” wide

6U = 266 mm high

-

19” rack mounting brackets

Suitable for new and

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retrofit installations

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670 Series Hardware

Introduction

Platform Based




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Serial Communication ModuleCommunication

Communication protocols

LON

IEC 60870-5-103 DNP 3.0

Alternative media

Glass fiber Plastic fiber

Combination of glass & plastic fiber

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Line Data Communication ModuleCommunication

wo vers ons or er op c commun ca on: Multi mode ST fiber 50/125 μm or 62,5/125 μm for short range

Single mode FC fiber 8/125 μm for medium and long range

Transmission of 4 analog values and 8 binary signals

Transmission of up to 192 binary signals when no analog

64 kbit communication channel in HDLC

Optical budget:

Long range 26dB or up to typically 120 km

Short range 11dB 62,5/125 μm and 7dB 50/125 μm

Galvanic X21 short range for connection to multiplexers

.

Up to 4 modules per IED 670 with restrictions for case seize

Mounting position for the 64 kbit communication modules is

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Optical Ethernet ModuleCommunication

- - protoco Ethernet 100 Mbit/second link

One or two optical ports

Module with two ports

Multimode fiber 62,5/125 μm

ST fiberoptic connector

Glass

fiber Typical maximum distance

between nodes, 1 kmor

A/D converter one

Module with one portInternal communication bus

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ersat e se ect on o

communication protocols

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670 Series Hardware

Introduction

Platform Based




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Commitment

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Reliability through Quality Assuranceto

Quality

All application functions aretype tested

e s are es e n an

Automatic Test System All products are verified in a

,operating environment

Extensive tests at ABB’s

The full compliance of ourIEDs and tools with the

tested and certified by KEMA

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Rely on ABB Quality

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670 Series Hardware

Introduction

Platform Based




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670 Series HardwareSummary

Minimized Cost for Maintenance

Accurate time synchronization for each

installation

Extensive I/O capability enables unique

unc on n egra on

Suitable for new and retrofit installations

Versatile selection of communication

protocols

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everyday life and saves cost

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