04 arcamone-mems devices and applications
TRANSCRIPT
MEMS devices and applications
Dr Julien ArcamoneBusiness development, Silicon Components [email protected]
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 2| 2
Outline |
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
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MEMS activities at LETI: missions & scope|
Market areas
Missions
R&D
domainsMEMSat LETI
Designing new MEMS components and/or developing fabrication processes of MEMS devices with Si‐based technologies
In strong partnership with international industrial companies
Focusing on single process steps or full development cycle including device concept and prototyping
MEMS actuators
MEMS (NEMS) sensors
RF MEMS & passives
+ packaging and associated design kits
Very broad range
Consumer applications, mobile phones
Automotive & Space
Health
Defense
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MEMS activities at LETI: main figures|
Some statistics: the largest R&D MEMS lab in EuropeMore than 150 persons including research engineers and technicians, PhD students and Post‐docs∼30 patents and more than 150 publications every year5 common labs with industrial companies
Covering the whole chain: from MEMS design to system integration
MEMS design (modeling and simulation) and prototyping
Fabrication and packaging
Electrical and functional characterization
Integration with analog and digital electronics
Main industrial partners
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 5| 5
Outline |
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 6| 6
MEMS actuators|
Research FocusMaterials and process development (PZT,…)Piezoelectric and Electrostatic actuators
Applications Inkjet technology Imaging: adaptive focus lensAcoustic: MEMS loudspeakers Medical: energy harvesting, micro‐pump
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MEMS actuators realizations 1/3
Material development and 200mm integrationSpecific deposition techniques (Sol‐Gel, epitaxial) for
gradient‐free layers
In‐depth characterization → extracted parameters: e31,eff ∼ ‐16 C/m², d31 ∼ 155pm/V, ε∼1500
Implementation as piezoelectric actuatorApplied voltage on PZT → in‐plane stress → membrane deflection
Application: inkjet and switch
Development of PZT asMEMS material|
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MEMS actuators realizations 2/3
Acoustic digital MEMS for portable electronic devicesSound Level Pressure at 1m: 50 dB/cm2
Actuation voltage < 30 V
Thickness < 1mm , size 1 x 1cm2
Acoustic applicationMEMS digital loudspeaker|
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MEMS actuators realizations 3/3Optical applicationMEMS varifocal lens|
Electrostatic or piezoelectric actuator for portable electronic devicesFocal distance: ∞ → 10 cm
Actuation voltage < 10 V
Thickness < 500 µm
Start‐up creation: Wavelens
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 10| 10
Outline |
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 11| 11
RF MEMS|
Research FocusMaterials and process development (AlN,…)High‐Performance RF Passive ComponentsHigh‐Q and Tunable Magnetic InductorsAcoustic Resonators and FiltersRF MEMS Switches
Applications Impedance Matching NetworksTunable AntennasFiltering, Time Reference, RF Circuits
Market areas Space & Defense, Telecom, Low‐Power Radio, Medical, Entertainment
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RF MEMS switch| RF MEMS realizations 1/2
Electrostatic switchSPST dc‐contact series switch
Ultra‐compact design → 800x800µm2
High maturity 200mm process
Highly reliable Ruthenium metal contact
Dielectric free electrostatic actuation →no charging effects
DC to 40 GHz operation band
Insertion Loss < 0.6 dB, Isolation > 20dB
Low actuation voltage (35 V)
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RF filters| RF MEMS realizations 2/2
Lamb waves filtersBasis: strong know‐how on BAW devices
Use of laterally‐propagating waves
Frequency and other resonator properties fixed by layout (and not only by layer thicknesses)
Frequencies ranging from 100 MHz to 2.5 GHz depending on the exploited acoustic mode
Suitable for narrow‐band filtering
Resonant cavity
Air gap
Waveguide fo = 280 MHz
kt2 =1 %Qshunt = 400
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Outline |
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
©© CEA. All rights reservedCEA. All rights reserved
Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 15| 15
MEMS sensors|
Research FocusProcess integrationInertial sensors (accelerometer, gyroscope, magnetometer)Pressure and force sensorsNEMS‐based chemical and biosensorsMagnetic sensors
Applications Motion capture (11 axis platform)HapticsGas analysis and point‐of‐care
Market areas Space & Defense, Automotive, Entertainment, Industrial Safety, Health monitoring
SEM view
CMOS
NEMS
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Multi‐axis M&NEMS platform| MEMS sensors realizations 1/3
3D accelerometer 3D magnetometer3D gyroscope Microphone & Pressure sens.
MEMS‐size inertial mass+ Nano‐size piezoresistive gauge
M&NEMS: a multi‐sensor, multi‐axis generic platformSensors fusion with one common electronics, protected by more than 20 patents
Not sensitive to parasitic, x3 area gain, low‐power
To be published
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NEMS‐based sensors| MEMS sensors realizations 2/3
NEMS‐based resonant sensors address other domains than MEMS:eg, chemical and bio‐sensingHigh‐efficiency generic (patented) design of NEMS
resonator based on electrostatic actuation and piezoresistive detection (high SNR, high frequency)
Unique and robust NEMS technology
Multi‐gas sensor coupling gas chromatography and NEMS detectors Start‐up creation 2012 APIX tech.
NEMS‐based mass spectrometry for biodetection (proteins, viruses and bacteria)
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Magnetic sensors| MEMS sensors realizations 3/3
Above‐IC GMR current sensors
Thickness of Thickness of free layer tfree layer t
Pinned Pinned layerlayer
Free layerFree layer Yoke Yoke width wwidth w
contactcontact
HHxxyyzz
CurrentCurrent lineline Ta (5 nm)CoFeBCoFeCu (2.5nm)CoFePtMn (20nm)
TaCoFeB (4nm)CoFe (1nm)CuCoFe (4nm)
Ta (5 nm)CoFeBCoFeCu (2.5nm)CoFePtMn (20nm)
TaCoFeB (4nm)CoFe (1nm)CuCoFe (4nm)
Magnetic Tunnel Junction (TMR, MRAM)
110nm110nm
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 19| 19
Outline |
I. Introduction: LETI, a major player in MEMS R&D
II. Activities on MEMS actuators
III. Activities on RF MEMS
IV. Activities on MEMS sensors
V. Key accomplishments and vision for the future
©© CEA. All rights reservedCEA. All rights reserved
Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 20| 20
Key accomplishments|Examples of technological transfers to industrial companies
Recent start‐ups
APIX Multi‐gas analyzers couplinggas chromatography and NEMS
Wavelens MEMS‐actuator –based varifocallens (autofocus) for mobile phone camera
MEMS accelerometersand gyroscopes
High‐value capacitors
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Leti Day in Nagoya, October 4th 2012 – MEMS devices and applications (J.Arcamone) | 21| 21
Future perspectives|
MEMS actuatorsMEMS using low‐cost piezoelectric polymer as structural layerEnergy harvesters
RF MEMS Tunable, reconfigurable and low‐power componentsUltra‐high frequency (60‐100GHz) filters and switchesComplex SoC (DC‐DC converters, decoupling capacitors)
MEMS sensorsExtension of M&NEMS platform to other kinds of sensorsMEMS / NEMS for biosensingCurrent sensors based on magnetic components
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Support to industry either on technological steps (new materials, technology consulting) or full development cycle (new device concept demonstrator including design and process of prototypes)
LETI’s MEMS activities in summary|
Investigating new materials for improved performance, reliability, lower production cost, and new applications
Investigating breakthrough devices architectures
Keep industrialization in mind at all times, ensure quick demonstration for design feedback
Deliver
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Annex |
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Original approach on energy harvesting|
Multi‐ferroic Composites coupled to shape‐memory/PiezoE CompositesMagnetization changes with stress
PZT actuator to obtain a voltage controlled of the uniaxial anisotropy
New concept for thermal harvesting based on combination of shape memory effect and direct piezoelectric effect (ΔT≈ 2 – 20°C)
Net uniaxial anisotropy field of the composite vs applied stress
Voltage response of the piezo/magnetic compositevs time with natural T variations in a room (open window)