05/11/06sasha pronko, silicon workshop ii, ucsb1 portcards & doims sasha pronko fermilab
Post on 22-Dec-2015
219 views
TRANSCRIPT
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 1
PORTCARDs & DOIMsPORTCARDs & DOIMs
Sasha PronkoFermilab
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 2
PortCard & DOIM: what & PortCard & DOIM: what & where?where?
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 3
PortCart requirementsPortCart requirements
o Low mass & sizeo High radiation doseo Reliabilityo High heat transfer capabilityo Remote control and data transmissiono Low noise regulated voltageo Detector grounding strategy
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 4
PortCard functionsPortCard functions
o Powers, initializes, controls and read out chips– Connects to SVX3 chips
by High Density Interconnects (HDI)
– Power for analog section of chips
– Calibration voltages for z & sides
– Interface with FIB– Forwards L1A accept to
chips
– Buffers FECLK & BECLK – Forwards data to FIB
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 5
PortCard basicsPortCard basics
o PC—beryllia based multi-chip moduleo One PC per wedge:
– SVX: 72 PC’s; ISL: 30 PC’s; L00: 12 PC’s
HD
I’s
to la
dde
rs
Pow
er/c
omm
ands
fr
om J
C/F
IB
Dat
a &
OB
VD
to
FIB
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 6
PortCard componentsPortCard componentso Per PC
– 1 Transceivero Per Ladder
– 1 analog DDR;– 1 digital DDR;– 2 ELCO’s;– 2 JFET’s;– NPN– DOIM
DDR — Digital to Analog Converter/Decoder/Regulator chip
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 7
PortCard: Digital sectionPortCard: Digital sectiono 11 Commands & CLKs
– 53 MHz clock– Beam X-ing clock– L1A signal– etc. (SVX3D by
Ankush)
o DVDD power supplieso Data transmission
– DOIM
o Components– Transceiver
• Receives FIB commands & CLKs, transforms them into single-ended signals
– digital DDR• Decoder• Buffers CLKs
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 8
PortCard: Analog sectionPortCard: Analog section
o Voltages– AVDD to FE– Bias to sensors
o Components– Analog DDR
• FE voltage regulation
• DAC-calibration voltage
– JFET & NPN transistors
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 9
PortCard locationPortCard location
L00 & ISL PC’s are in the same place
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 10
PortCard location, PortCard location, continuedcontinued
o PC need to be cooled
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 11
PortCard: PortCard: Performance stability & Radiation Performance stability & Radiation
hardnesshardnesso Performance
– Noise SSDDAQ Noise SSDPCDAQ
o Radiation hardness– Rick Tesarek says (Run2 measurement) that
ionizing doze for SVX PC is 20 krad/fb-1 (~10% error)
– ~80-160 krad in Run2 (4-8 fb-1)– PC designed hardness is ~200 krad – L00 bias issues
• Degradation of dielectric possible problems with HV bias (specification is ~200V, L00 may need to be biased up to much higher voltages)
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 12
PortCard: Radiation Hardness PortCard: Radiation Hardness TestsTests
o Radiation hardness tests with 63 MeV protons (UC Davis) and 8 GeV protons (Fermilab)– 2 PC’s irradiated: 200 krad & 400 krad– 400 krad PC was used for long term reliability
testing with resistive loads• No failure after 3 months• No change in TX & DDR current draws• No change in DDR DAC calibration voltage slope
change• No shift in pedestals; no change in noise
– JFET & NPN irradiated by ~500 krad• No problems with analog voltage regulation observed
o PC’s should withstand the radiation dose expected for Run 2
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 13
DOIM basicsDOIM basics
o DOIM — Dense Optical Interface Module– Converts electrical signal
from SVX chip into optical signal (interface between chip & FIB)
– 53 Mbyte/sec/DOIM data transfer rate;
– 8 bits & OBVD; bit error rate <10-12 at 63 MHz
– 3 major components: transmitter (TX), 22m fiber, receiver (RX)
– 1 DOIM per ladder – Radiation tolerance up to
200 krad
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 14
DOIM: component locationDOIM: component location
o TX on PC (5 TXs per PC in SVX)o 10 RX (2 wedges) on Fiber Transition
Module (FTM)
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 15
DOIM: TXDOIM: TX
o TX — InGaAsP edge emitting laser diode array– 12 channel (9 used);
250m pitch matches fiber
– Power supply: VCC-VLD
• VCC=5V & VLD adjustable
– current: 20 mA/ch at 3V; slope ~2mA/0.1V
– Differential amplifier is sensitive up to 10mV
– Light output: 1 mW/ch @20mA
– Light cone: uniformity in far field angle affects light coupling (~400 W span)
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 16
DOIM: RXDOIM: RX
o RX — InGaAs/InP PIN-diode array– 12 channels (9
used)– Power supply:
VCC=5V
– Optical input converted to current pulse to receiver chip
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 17
DOIM: TX & RX characteristicsDOIM: TX & RX characteristics
Digital 1 =Digital 0 =
Digital 1 =Digital 0 =
We have bit stuck low or bit stuck high errors if these characteristics are out of range
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 18
DOIM: OBVD & 8 bitsDOIM: OBVD & 8 bits
o OBVD & 8 bits — SVX chip (Ankush’s talk)o Example of TX output
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 19
DOIM: Temperature sensitivityDOIM: Temperature sensitivity
o TX is sensitive to temperature (not an issue for RX)
o RX designed to operate at 40-60% duty cycle
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 20
DOIM: Radiation Hardness of RXDOIM: Radiation Hardness of RX
o Beam tests with protons: 200krad & 400krado Linear dependence to doseo Ratio of light drop independent on light
powero Degradation is <10% per 200 krad
05/11/06 Sasha Pronko, Silicon Workshop II, UCSB 21
SummarySummary
o PC’s & DOIM’s provide an interface between sensors/chips and PS, DAQ
o PC’s performance is stable respect to radiation dose expected for Run2
o DOIM– TX sensitive to temperature– 10% degradation per 200 krad — it should
be enough for Run2– RX sensitive to duty cycle
o Sources of info: – cdf5535, cdf3865, cdf6497, cdf7281, ESE-
SVX980318, old talks, TDR