0.5mm, 0.65mm pitch giga-snap™€¦ · • upgrading production systems that has 0.5mm and 0.65mm...
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www.ironwoodelectronics.com
0.5mm, 0.65mm
IP, Dec2013
0.5mm, 0.65mm Pitch Giga -snaP™Emulation, System Development,
Field Upgrade, Production Socket Adapters
High PerformanceIC Sockets And Test Adaptors
www.ironwoodelectronics.comApplication Need
• In-circuit emulation of a system board that has 0.5mm and 0.65mm pitch array pattern.
• Test and debug of a system development board that has 0.5mm and 0.65mm pitch area array devices such as BGA, LGA.
IP, Dec2013
• Debugging production board that has 0.5mm and 0.65mm pitch area array devices such as BGA, LGA.
• Reworking 0.5mm and 0.65mm pitch BGA devices by removing from the board (both development and production) and reattaching to the target land pattern.
• Upgrading production systems that has 0.5mm and 0.65mm pitch BGA devices.
www.ironwoodelectronics.com
Plug and Play Giga -snaP™ Adapters An economical and reliable alternative to soldering
BGA devices directly to the motherboard.
Same footprint as BGA device.
RoHS compliant materials.
Soldering very similar to IC package using conventional methodology and no external hardware required.
Solution – Chip Size Adapters
IP, Dec2013
RoHS compliant materials.
PCB can be reflowed with Giga-snaP™ assembled (withstands
multiple reflow cycles).
Compact, low-profile design maximizes PC board space in
system development.
Access to BGA pads for in-circuit emulation, test and interconnection.
Connection via Gold plated terminals that has optimized insertion/extraction force for reliability and robustness.
Shortest interconnect length enables high speed applications.
www.ironwoodelectronics.comGiga-snaP™ Interconnect
DUT
Terminal pins360 BrassGold plated
Top adapter substrateHigh temperature plastic
IP, Dec2013
BeCu ContactGold plated
Bottom socket substrateHigh temperature plastic
www.ironwoodelectronics.com
0.5mm Pitch Giga-snaP™ Contact Typical Characteristics
Contact resistance < 20 mΩ
IP, Dec2013
Contact resistance < 20 mΩ Self Inductance <0.79nH Bandwidth >20.1GHz @-1dB Mutual Capacitance <0.088pF Insertion force 16grams per pin Extraction force 7grams per pin Operating temperature -55 to +160° C Insertion/Extraction cycles >100 Current rating 3A per contact
www.ironwoodelectronics.com
Insertion and Extraction Force Data
Mechanical Characterization
10.0
12.0
14.0
16.0
18.0
For
ce p
er p
in (
gms)
Extraction force #1
Extraction force #2
IP, Dec2013
0.0
2.0
4.0
6.0
8.0
10.0
0 1 2 3 4 5 6 7 8 9 10
For
ce p
er p
in (
gms)
Number of cycles
Insertion force #1
Insertion force #2
www.ironwoodelectronics.com
Contact Resistance Data
Electrical Characterization
0.014
0.016
0.018
0.02
Con
tact
resi
stan
ce p
er p
in, (
ohm
s)0.5mm Gigasnap, room temperature, endurance data
IP, Dec2013
0
0.002
0.004
0.006
0.008
0.01
0.012
0 10 20 30 40 50 60 70 80 90 100
Con
tact
resi
stan
ce p
er p
in, (
ohm
s)
# of insertions
www.ironwoodelectronics.comMechanical Characterization +160C
15.00
20.00
25.00
con
tact
(m
Oh
ms)
BGA153 GigaSnap 0.5mm Test @ 160°C
IP, Dec2013
0.00
5.00
10.00
15.00
0 66 143 167 238 260
Re
sist
an
ce P
er
con
tact
(
Hours
www.ironwoodelectronics.comMechanical Characterization -55C
15.000
15.500
16.000
16.500
17.000
Res
istn
ace
Per
Con
tact
(M
illi O
hms)
Room temperatureBrought back to Room temperature- empty Nitrogen tank
IP, Dec2013
12.000
12.500
13.000
13.500
14.000
14.500
0 1 17 19 21 23 23 23 25 39 41 44 45 47 61 63 65 67 68
Res
istn
ace
Per
Con
tact
(M
illi O
hms)
Time ( Hours)
www.ironwoodelectronics.comElectrical Characterization AC
IP, Dec2013
www.ironwoodelectronics.comElectrical Characterization DC
IP, Dec2013
www.ironwoodelectronics.comHigh Volume Manufacturing
Pick & Place SMT Line, Reflow Oven
Stencil/Screen Printer, Tape & Reel Packaging
IP, Dec2013
CNC & Screw Machines Optical Inspection Unit
www.ironwoodelectronics.comValue Proposition
Proven solution for automobile applications due to extreme temperature capability.
Shortest electrical path, proven solution for high speed digital and RF applications (excellent bandwidth >20GHz).
Reliable and Robust due to low and stable contact resistance throughout life cycle.
Low insertion and extraction force for ease of operation.
IP, Dec2013
Established processes eliminate non-value added steps in the manufacturing sequence which enables low cost for end customers.
Established manufacturing flow which enables short lead time for various order sizes.
Pick & Place, Tape & Reel support for end users. No substrate warping, No CTE mismatch, Co-planarity <100µm. Component heat dissipation does not affect solder connection. Solders same as the IC it emulates.