Engineering of Polymeric MaterialsThe 5 PʼsTim A. Osswald

Polymer Engineering CenterUniversity of Wisconsin-Madison

King Saud University15-17 November 2008

Topics

The 5 PʼsIntroduction to PolymersPolymer Recognition and DiagnosticsIntroduction to Mixing and Blending

Anisotropy DevelopmentSolidification Shrinkage and WarpageMechanical Behavior of PolymersFailure of Polymers

Simulating Polymer ProcessesProcessing InnovationsMaterials InnovationPolymers from Renewable ResourcesModeling Innovations

The 5 Pʼs

Polymer

Processing

Product

Performance

Post-consumer Life

Polymer

Process

Product

Performance

Post-consumer life

HeatingMixingPumpingForming

PelletFilm/FiberComponent/Assembly

ThermalMechanicalEnvironmentalOpticalElectrical

ExtrusionInjectionCompression

MorphologyOrientationDegradation

MoleculeMaterialFiller FiberAdditive

CompatibilityAdhesionRegulation/LegislationCost

RecyclingEnvironmentSustainabilityLegislation

Properties

Polymer(s)

Process

Performance

Rheological propertiesThermal propertiesMechanical PropertiesFlow

Heat TransferFiber orientationFiber damageDegradationShrinkage/Warpage

AnisotropyMechanical PropertiesStressesFriction Properties

Assembly Injection Molding

ProductAssemblyDesired interactions

Post-Consumer LifeAssembly/DisassemblyChoice of materials

Osswald - Fürth, Germany, Montagespritzgießen (2007)

Misconceptions and Misunderstandings

300

200

100

00

5

10

15200

150

100

50

0

1000

10,000

100

Deflectiontemperature °Cunder flexuralload (1.82 MPa)ASTM D 648

Thermalexpansioncoefficient,10-5 m/m °CASTM D 696

Tensilestrength, MPaat 23°CASTM D 638

Flexuralmodulus, MPaat 23°CASTM D 790

HIPS

HIPS

HIPS

HIPSPP

PP

PP

PP

PC PC

PC

PC PVC

PVC

PVC

PVC

Epoxy

Epoxy

Epoxy

EpoxyPhenolic

PhenolicPhenolic

Phenolic

POM

POM

POM

POM

PMMA

PMMA

PMMA

PMMA

PET

PET

PETPET

PA66

PA66

PA66

PA66

HDPE

HDPE

HDPE

HDPELDPE

LDPE

LDPE

LDPEPS

PS

PS

PS

SAN

SAN

SAN

SAN

ABS

ABS

ABS

ABS

PTFE

PTFE

PTFE

PTFE

PI

PI

PI

PI

UP

UPUP

UP

100

10

1000 2.0

1.5

1.0

1.0

10

100

1000

Elongationat break, %at 23°CASTM D 638

IZOD impactstrengthJ/m of notchat 23°CASTM D 256

Specific gravityASTM D 792

HIPS HIPS

HIPS

PP

PP

PP

PC PC

PC

PVC

PVC

PVC

Epoxy

Epoxy

EpoxyPhenolic

Phenolic

Phenolic

POM

POM

POM

PMMA

PMMA

PMMA

PET

PET

PET

PA66

PA66PA66

HDPE

HDPE

HDPE

LDPE

LDPE no break

LDPE

0.5

PS PS

PSSAN

SAN

SAN

ABS

ABS

ABS

PTFE

PTFE

PTFE

PI

PI

PI

UP

UP

UP

20.0

1.5

1.0

HIPSPP

PC

PVC

Epoxy

Phenolic

POM

PMMA

PET

PA66

HDPELDPE0.5 PS

SANABS

PTFE

PI

UP

5.0

10.0

15.0

Market price $/lb(February 2003)

Data useful for comparison between materials

Standard Testing Methods (ASTM)

ASTM Designation: D638 - 01Standard Test Methods for Tensile Properties of Plastics

Polyethylene Straw Experiment

Straw Test

10% 20%

“Slower” test

“Impact” Test

100% 200% 300%

STRAIN

“Faster” Test

PMMA100

80

70

60

50

40

30

20

10

0

90

0 1 2 3 4 5 6 7 8Strain, ε (%)

Strain rate = 0.05%/h0.20.5

110 20

50100200500

100020005000

10000

Plastics Material Properties Data Survey

Conducted at the SPE ANTEC 2002 People attending product design and

failure sessions 300 surveyed, 100 responded (on site)

Product Development RespondentsWhich of the following properties do you often use during product and process development?

0.00% 10.00% 20.00% 30.00% 40.00% 50.00% 60.00% 70.00% 80.00% 90.00% 100.00%

Tensile strengthMaterial cost

DensityImpact StrengthMelt flow index

Flexural ModulusChemical resistance

Elastic ModulusYield Stress

Viscosity curvesHeat deflection temperature

Fracture StrainThermal Expansion coefficient

Optical propertiesCreep Data

Friction characteristicsDielectric properties

Tensile-creep modulusSecant ModulusShear ModulusPoisson's ratioP-V-T diagram

Dynamic ModulusHeat Conduction

Isochronous q-e curvesIsometric q-relaxation curves

Product Development respondents

Polymer Material Data Survey (Germany)*Which of the following properties do you often use during product and process development?

* Berlich, Gabriel, Schmachtenberg, Kunststoffe, 2001

0 50 100 150 200 250 300 350

Young's modulus

Tensile Strength

Temperature behavior

Tensile stress at yield

Tensile strain at breakPrice of raw material

Chemical resistance

Flexural modulus

Viscosity

Tensile-creep modulus

Charpy values

Isochrones

Critical strain

P-V-T diagrams

Poisson's ratio

Reduction factors

Deformation energy density

points

Data from Germany

3 Pts – Often 1 Pts – Rarely 0 Pts – Never-1 Pts – Do not Understand Property

300

200

100

00

5

10

15200

150

100

50

0

1000

10,000

100

Deflectiontemperature °Cunder flexuralload (1.82 MPa)ASTM D 648

Thermalexpansioncoefficient,10-5 m/m °CASTM D 696

Tensilestrength, MPaat 23°CASTM D 638

Flexuralmodulus, MPaat 23°CASTM D 790

HIPS

HIPS

HIPS

HIPSPP

PP

PP

PP

PC PC

PC

PC PVC

PVC

PVC

PVC

Epoxy

Epoxy

Epoxy

EpoxyPhenolic

PhenolicPhenolic

Phenolic

POM

POM

POM

POM

PMMA

PMMA

PMMA

PMMA

PET

PET

PETPET

PA66

PA66

PA66

PA66

HDPE

HDPE

HDPE

HDPELDPE

LDPE

LDPE

LDPEPS

PS

PS

PS

SAN

SAN

SAN

SAN

ABS

ABS

ABS

ABS

PTFE

PTFE

PTFE

PTFE

PI

PI

PI

PI

UP

UPUP

UP

100

10

1000 2.0

1.5

1.0

1.0

10

100

1000

Elongationat break, %at 23°CASTM D 638

IZOD impactstrengthJ/m of notchat 23°CASTM D 256

Specific gravityASTM D 792

HIPS HIPS

HIPS

PP

PP

PP

PC PC

PC

PVC

PVC

PVC

Epoxy

Epoxy

EpoxyPhenolic

Phenolic

Phenolic

POM

POM

POM

PMMA

PMMA

PMMA

PET

PET

PET

PA66

PA66PA66

HDPE

HDPE

HDPE

LDPE

LDPE no break

LDPE

0.5

PS PS

PSSAN

SAN

SAN

ABS

ABS

ABS

PTFE

PTFE

PTFE

PI

PI

PI

UP

UP

UP

20.0

1.5

1.0

HIPSPP

PC

PVC

Epoxy

Phenolic

POM

PMMA

PET

PA66

HDPELDPE0.5 PS

SANABS

PTFE

PI

UP

5.0

10.0

15.0

Market price $/lb(February 2003)

Data useful for comparison between materials

BUT NOT USEFUL FOR DESIGN!!!

What kind of data should be used for design?

Creep data (Time dependent)