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JRA2-SITRA status report

Z. Doležal, A. Savoy-Navarrofor JRA2-SITRA partners (LPNHE Paris, Ch.U. Prague, Helsinki, Santander) and associates (CNM Barcelona, HEPHY Vienna, IFIC Valencia, Obninsk):

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Milestones and Deliverables(Past)

MilestoneDeliverable

Deadline Status

Convection cooling system prototype

22 Ready

Motorised 3D table 24 Ready

Central tracker prototype 24 Ready

FE chip version 1 24 Ready

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Convection Cooling System Prototype (LPNHE +OSU+Torino U.)

Actual FEE results: ~ 0.6mWatt/chNo Power cycling included yetMain problem: power dissipation from neighbours

Eudet-Memo-2007-52

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Motorised 3D Table(Torino) suitable for testing Silicon sensors, pixel and

microstrips in a beam test, DUT can be moved and rotated with respect the beam

line. built in a modular way, so that it can arrange different

types of DUT, with alignment telescopes or without. 5 motors are controlled remotely via RS232, to set

positions and angles, via LabVieW application

Eudet-Memo-2007-59

5

6

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Central tracker prototype Several detecting module prototypes have

been assembled with sensors and electronics

Tested at Lab test bench Beam test at DESY and CERN

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Module prototype

2 HPK 6’ sensors FE chip 130 um

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Module prototype

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FE Chip version 1(LPNHE+Barcelona U.) After first prototype in 180 nm technology, 4-

channel SITR-130_4 chip was designed in 130 nm and produced

The chip was fully tested both standalone and with a strip sensor attached

Based on the test results version 2 has been designed and submitted

Version 1 documented in EUDET-Memo-2007-29

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12

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Milestones and Deliverables(Future)

MilestoneDeliverable

Deadline Status

Conduction cooling system prototype

36 In a good shape

Silicon tracking infrastructure 36 Move to 42?

Forward tracker prototype 36 Move to 42?

FE chip version 2 36 In a good shape

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Conduction Cooling System Prototype Designed by LPNHE and OSU Description, calculations and test results in Eudet-

Memo-2007-52 Conventional material prototype ready for October

2008 CERN beam test EUDET prototype will be built afterwards from

composite carbon fibre structures

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Conduction Cooling System Prototype: Principle

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Conduction Cooling System Prototype: Module box

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Composite materials

Honeycomb

Low material budget

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FE Chip version 2(LPNHE+U. Barcelona)

After successful tests of FE version 1 chip (SITR-130_4) 88-channel version was designed in 130 nm and submitted

Expected delivery from the foundry is September

After thorough testing chip will be assembled into detecting modules

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General view of the circuitGeneral view of the circuit

StripStorage & Input/Output interface

Waveforms

Counter

Wilkinson ADC

‘trigger’

Ch #

Digital ControlBias, threshold, calibration,

pipeline control ...

Analog samplers, slow

iVi > thSparsifierChannel n+1

Channel n-1

Time tag

Preamp +Shapers

resetreset

8x8 analog pipeline

Bias & Threshold Generator, Calibration

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Main features of new circuitMain features of new circuit

88 channels (1 test channel): Preamplier, shaper, sparsifier,analog pipeline (8x8 celles), 12 bits ADC

2D memory structure: 8x8/channels

Fully digital control:- Bias voltage(10 bits) and current (8 bits)- Power cycling (in optional)- Shaping time programable- Sampling frequency programable- Internal calibration- Sparsifier's threshold programable per channel - Event tag and time tag generation

......................

2 Trigger modes: Internal (Sparsification intergrated) External (LVTTL) for beam test

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LAYOUT VIEWLAYOUT VIEW

Submitted June 24th ‘08

Size: 5mmx10mm88 channels (105um pitch)105umx3.5mm/channel

Analog: 9.5mmx3.5mmDigital : 9.5mmx700um

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New readout circuit in 0.13 New readout circuit in 0.13 mm

BONDING DIAGRAM FOR CQFP208 PACKAGE

Package 208 pins- 50 analog input- 21 analog test out- 33 digital pin (22 test pins)- 107 supply pins

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Forward tracker prototype Detector modules equipped with special

alignment sensors IR Laser alignment will be performed These modules will be tested at October

CERN beam test this deliverable would benefit from

postponing the deadline from M36 to M42

24th Sept-8th October test beam will study

performance of new HPK alignment sensors

These are “standard” sensors with an Al-free

window in the backside (ohmic contact)

IR beam pseudotrack can be used to traverse

several sensors

Ohmic side:

Alignment

passage

Particle beam

IR beam

Alignment-friendly

sensors

Standard sensor

Standard sensor

Alignment prototype on beam

1) Show that the performance of the alignment friendly sensors is the same as

the standard ones

2) Compare track reconstructed geometry to IR beam reconstructed geometry

3) Shift only central alignment sensor and compare reconstructed

displacement with particle beam

and with IR beamParticle beam

IR beam

Alignment-friendly

sensors

IR bandpass filter

The same setup employed in the

test beam can be used as well as

an alignment monitor. We just need

an IR transparent window in the

front side of the cage (it can be a

small bandpass filter).

Alignment prototype on beam

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Silicon tracking infrastructure Various facilities needed for successful

detector testing Cooling Alignment 3D motion Tracking

Integration of the other deliverables Could be together by M36, but would be of

better quality if postponed to M48

LP-TPC: Silicon Envelope(HEPHY, IEKP Karlsruhe)

TPC Magnet

Beam

Rails Module

four silicon modules will be installed:- two in front and two behind the

TPC, with respect to the e--beam two independent support structures are needed

- on each side: one horizontal module consisting of two daisy-chained sensors

and one vertical module consisting of one sensor

movable support system is needed because it must be possible to scan the TPC

- the TPC and the magnet will move relative to the beam

- the sensors have to stay inside the beam line

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Memos+ReportsYear Memos Reports

2006 1

2007 9

2008 ~ 6 ~1

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Other SITRA/SiLC activities(not included in EUDET but necessary for successful EUDET accomplishment)

Si sensor development, production and testing Module construction (engineering, tooling) DAQ (FPGA, off-detector, TLU/EUDET integration) Lab and beam tests Simulations

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Si-sensors Dedicated SiLC strip sensors designed by

HEPHY and manufactured by HPK Test structures already tested in the beam

test (June 2008, CERN) Full-sized sensors with alignment treatment

will be tested at CERN in October VTT 3D structures

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HPK strip sensors

IV curves Depletion voltage

DUT with HPK test structures at CERN beam test

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Spatial resolution vs. strip geometry

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

0

1

2

3

4

5

6

7

8

9

10 Run 0001

Run 2718

Run 2719

Run 2720

Run 2721

Zone

Re

solu

tion

(µ

m)

0 intermediate

strip

1 intermediate

strip

2 intermediate

strips

50 m r/o pitch 0,1 or 2

intermediate strips)

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Beam tests 2008 (CERN):

June: Hamamatsu test structures Sep-Oct: Hamamatsu alignment sensors

2009 March: DESY, FE chip+HPK sensors Later: CERN (HE beam) Later: FNAL (combined)

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Conclusions Past deliverables: all completed 4 M36 deliverables:

2 almost complete Other 2: SITRA working with full speed

towards completion, but postponing the deadline to M42 or M48 would allow higher quality results