1 ott ibm eserver. total storage, on demand · 2008-02-29 · processors power density (w/cm2) chip...
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IBM eServerTM
10/7/2005 © 2005 IBM Corporation
IBM eServer™ Total Storage, On Demand
Bill Ott, Vice President, eServer xSeries & IntelliStation DevelopmentSystems and Technology Group
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IBM eServerTM
© 2005 IBM Corporation2 10/7/2005
IBM 2Q 2005 Business Status
Key Accomplishments– Operational Performance– PC Sale– Restructuring Actions– Microsoft Settlement
2Q Performance Highlights– Services Signings– Power5-based Servers and Storage– Key Middleware– Growth Initiative– Cash and Balance Sheet
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IBM eServerTM
© 2005 IBM Corporation3 10/7/2005
IBM 2Q05 Financial Summary
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IBM eServerTM
© 2005 IBM Corporation4 10/7/2005
IBM Revenue 1Q05 and 2Q05
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IBM eServerTM
© 2005 IBM Corporation5 10/7/2005
IBM Geographic Revenue
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IBM eServerTM
© 2005 IBM Corporation6 10/7/2005
Global Services
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IBM eServerTM
© 2005 IBM Corporation7 10/7/2005
Systems & Technology
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IBM eServerTM
© 2005 IBM Corporation8 10/7/2005
Software
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IBM eServerTM
© 2005 IBM Corporation9 10/7/2005
IBM Systems & Technology GroupWho Are We– #1 Systems Vendor
• $19B in 2004– Fastest growing vendor in
storage, UNIX servers and Intel-based servers
– Top blade-server vendor– 10,000 development
employees worldwide– 21 development sites World
Wide
What We Do– IBM eServer
• zSeries mainframe• iSeries midmarket• pSeries UNIX • xSeries Intel-based• BladeCenter• Systems Control Software
– IBM TotalStorage• Tape• Disk• Storage software
– Key Competitors:• HP, Sun, EMC
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IBM eServerTM
© 2005 IBM Corporation10 10/7/2005
IBM Technology Leadership
Server & StorageVirtualization
Partitioning
Core on demand Technologies
Linux open standards
Grid Computing
Autonomic Computing
Capacity on Demand
Systems Consolidation
POWER™
Architecture
Mainframe Servers
Core Products
Blade ServersDisk Storage
StorageNetworking
Tape and Optical Systems
Intel processor-based Servers
AMD processor-based Servers
Midrange Servers
Unix Servers
ClustersStorageSoftware
TotalStorage
IBM eServer
CoreTechnologies
Operating Systems
Processors VirtualizationEngine
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IBM eServerTM
© 2005 IBM Corporation11 10/7/2005
Momentum in High Growth Segments
IBM is – First in worldwide server revenue for the ninth consecutive
quarter– First in UNIX-based server revenue– First in blade server revenue.
IBM overtook the top position in UNIX-based server revenue, growing nearly seven points year-to-year
AND IBM led Blade server revenue for the eight consecutitvequarter ending 2Q05 with 40 percent of the revenue share
Source: IDC Worldwide Quarterly Server Tracker, 2Q05, issued on August 25, 2005
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IBM eServerTM
© 2005 IBM Corporation12 10/7/2005
IBM xSeries
Power, Packaging and Cooling Challenges
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IBM eServerTM
© 2005 IBM Corporation13 10/7/2005
The System Technology Challenge/Drivers
More Speed!
Higher Density!
More Data Capacity!
More Bandwidth!
Lower Cost!
Smaller!
More Portable!
More Open!
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IBM eServerTM
© 2005 IBM Corporation14 10/7/2005
Trends That Affect Power, Packaging, and Cooling 2000 2001 2002 2003 2004 2005 2006 2007
Technology DriversProcessors
Power Density (W/CM2)Chip Voltage (VDC)
IOPCI
PCI X 4x IB Cables/Switches 12x IB & IB Modules
10 Gb Enet
2 1
CoolingCooling Ability
W/CM2
U
Heat PipesChilled Air / Water1
15Technology Enables
2 17
3.3V, 5V, 12V 5V, 12V Hybrid
12V Distributed 12V Distributed
PowerPower Density (W/in3) 3
20
Market DriversIntel CPU / Rack (42U) 20
168 cores*
ServerPackaging
Tower Rack / Tower
Rack OptimizedModular Scalar Systems
Server Blade - High PowerServer Blade - Low Power
Media (HDD, CD, FDD)36 GB
600 GB
3.5" 2.5" SFF, SCSIHDD
244 cores*
PCI Express 40 Gb Enet
300 GB
2.5" SAS
Vapor Chamber
15 22
Chilled Air Rack
Multicore 2
FBD Memory
Multicore 8
3.5" SATA/ SAS
(single core)(dual core)
488 cores*(quad core)
( * blade servers)
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IBM eServerTM
© 2005 IBM Corporation15 10/7/2005
Challenges:Server designs have reached several limits:– Power supply density: cooling a bottleneck, continued push higher– Thermal: ability to move enough air to cool at server, rack and building levels– Accoustics: increased airfow = more noise
Ability to provide primary power, building and rack: over 30kW per rack– Higher power driving higher input currents
• Running out of AC ampacity with primary connector, C13/C14 must use C19/C20 and further as input connectors– Racks require more capacity than 60A 3-phase service
Energy Efficient Designs– "80 plus" desktop initiative gaining interest in Server market
Other technology drivers– Number of planar voltages is increasing.
• To conserve planar area, VRMs & SIPs need to be more common / smaller– Lower load voltages, 1.8V, 1.5V, 1.2V, etc., coupled with high dynamic loads continues to drive "point-of-load"
VRs.– Power Management
• Growing need to monitor currents and power• Dynamic voltage adjustments
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IBM eServerTM
© 2005 IBM Corporation16 10/7/2005
Thermal - Power Requirements Watts / U
1U Max Power
Blade Max Power
Dashed lines are projected
**When 20% of Racks are at 31.8kW (6 BladeCenters), Then high density data center limits are reached.80% of racks must be at 5KW or below.
2003 2004 2005 20060
200
400
600
800
1000
Range of cooling capability in typical data centersRaised and Non-Raised Floor
High Density**Data Center
5,000 W per Rack
10,000 W per Rack
15,000 W per Rack
31,800 W per Rack
34000 W per Rack
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IBM eServerTM
© 2005 IBM Corporation17 10/7/2005
Power Supply Roadmap
GENERAL– N+N bulk power required for redundancy– 12V distribution within the chassis drives VRM / VRD input, DASD, PCI, FANS– High efficiency converter technologies– Design for future power increases (mech. package, connectors)– Focus on quality and reliability– Voltage and current monitoring circuitry
LOW END– Density pressure will continue driving lower number of output voltages
• Facilitates denser power supply packaging trend• Improved power supply efficiency• Requires more use of VRDs and VRMs CBBs
ISSUES– Power supply densities limited at system level by cooling– Connector ratings / dc power distribution– AC Power distribution
• need more power than 60A 3-phase can provide
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IBM eServerTM
© 2005 IBM Corporation18 10/7/2005
Technical Challenges and SolutionsWhat We Need– Higher Reliability - MTBF– Higher Power Density– Higher Transient Response - di/dt– Higher Efficiency– Lower Voltage - Higher Current– Voltage/Current Distribution – Increased Number Of Voltage
Domains– Ability to Hot Swap– Lower Cost– Shorter Development Cycles– Best Industry Quality– Error and Status Reporting– Power measurement capabilities
How We Get There– More Integration– Higher Switching Frequencies– Lower Switching and Conduction
Losses – Topology Influences
• RES/ZVS/ZCS– Better EMI Design– Innovative Design – Lower Output Impedance– Thermal Management– Component Improvements
• Integrated• Battery Technology• Power Semiconductors• Capacitors• Interconnect
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IBM eServerTM
© 2005 IBM Corporation19 10/7/2005
Backup
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IBM eServerTM
© 2005 IBM Corporation20 10/7/2005
xSeries MetricsDate Updated:08/27/04
History
PS Density W / ci. in.
PS Cost $ /W
2002 2003 2004 2005 2006 2007Year
$0.00
$0.02
$0.04
$0.06
$0.08
$0.10
$0.12
Cos
t
cost
Cost
2007200620052004200320022001Year
0
5
10
15
20
25
W/c
u in
Density
Density
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IBM eServerTM
© 2005 IBM Corporation21 10/7/2005
Server Load Power Proportions
32.6%
8.6%
11.3%17.7%
29.8%
Rack Optimized
22.1%
4.6%
7.3%
10.5%
55.5%
BladeCenter
PowerCooling
I/ O Subsystem Memory Processors
BladeCenter vs Rack Opt imized
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IBM eServerTM
© 2005 IBM Corporation22 10/7/2005
AC Power Distribution Challenge
xSeries customers are almost at the same AC input requirements as the Mainframes (60A 3-phase required for many applications)
mainframe timeline
20061995 x-i-p series timeline 2002
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IBM eServerTM
© 2005 IBM Corporation23 10/7/2005
Momentum in High Growth Segments
Source: IDC and Systems and Technology Group Market Intelligence
0%
10%
20%
30%
40%
50%
60%
70%
Q201 Q401 Q202 Q402 Q203 Q403IBM HP Dell
8-way+ Revenue Marketshare Blade Revenue Marketshare
0%
10%
20%
30%
40%
50%
60%
Q202 Q302 Q402 Q103 Q203 Q303 Q403
IBM HP Dell
31%
24%
67%
44%