1/20 passive components and circuits - ccp lecture 13
TRANSCRIPT
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Passive components and circuits - CCP
Lecture 13
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Content
Electronic packaging levels Manufacturing the Printed Circuit Boards PCB
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Packaging Is a domain which combine the engineering with manufacturing technologies needs to transform an electrical diagram in an operational product. This domain combines knowledge's from electronics, mechanics, materials and quality assurance.
Packaging of electronics microsystems include a set of fundamentals technologies: micro and nanoelectronics, photonics, micro-electro-mechanical systems (MEMS), radio frequency (RF) and wireless technologies.
In order to integrate all these functions in a system, the functions must be designed, manufactured and tested for assuring reliability and an adequate thermal regime.
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Level 0 : Interconnection on a silicon die
Level 1 : Chip encapsulation
Level 2 : Manufacturing of multi-chip modules
Level 3 : PCB
Level 4 : Interconnection of electronics and mechanics sub-assemblies
at a system level
Packaging levels
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Packaging levels
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Interconnections inside the silicon chip.
Level 0
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Single Chip Module (SCM)
In-line packages
Small outline packages
Quad packages
Array packages
Level 1
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Multi Chip Modules (MCM)
MCM-D – deposited MCM. The modules are deposited on the base substrate using thin film technology.
MCM-C – ceramic substrate MCMs (thick-film or cofired ceramic technology). A very good variant is LTCC – low temperature cofiread ceramic)
MCM-L – laminated MCM. The substrate is a multi-layer laminated PCB (organic laminate technology)
Level 2
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Printed Wiring Board (PWB)
Paul Esler from Germany invented this technology in 1943.
Actual production 45,250 mil $/ year, with an 11%/year increasing rate
The large producers made 250,000 m2/year, adding the small producers 50,000 m2/ year.
Level 3
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The final integration stage:
printed circuit boards PWB/PCB
Subassemblies: power supplies, micro-motors, etc.
User interfaces: displays, keyboards,etc.
Special components:transformers, fans, heaters, etc.
Cables
Boxes
Level 4
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Is the most important integration level in packaging
Assures the interconnection between components using Copper traces
Assures mechanical support for components
Printed Wiring Board (PWB) or Printed Circuit Board (PCB)
http://www.ett.bme.hu/vlab/start.html - PWB section
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Width of the interconnection traces
Resolution of traces/elements (pitch)
Number of pads for component connections per square cm
Metalized vias dimensions (passing holes)
Number of layers for the traces
PWB/PCB are characterized by:
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PCB technology evolution
Line Width
Year 1985 : 500 m
Years 90-95: 250 m
Years 95-2000 : 150 m
Years 2000-2005 : 100 m
Years 2003-2006 : 75 m
Years 2005-2008 : 50 m
Years 2008-2010 : 30 m
Tehnology
Single layer
Two layers
Multilayers
With micro via and high density
Substrate
Rigid
Flexible
Rigid-flexible
3-D board
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The most restrictive technological operation is the drilling operation
0
2
4
6
8
10
12
14
16
18
20
100 150 200 250 300 340
Hole diameter, microni
Co
stu
l/K
gău
ri,
$
Series1
0
5
10
15
20
25
30
35
40
45
1994 1996 1998 2000 2002
Anul
Co
stu
ri,
$
Costul găuririi
Costul plăcii
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Technological steps for Single Sided Board
1. Cutting of laminated board
2. Screen Printing – using photo technology or serigraphy
3. Etching
4. Roller Tinning - covering with safety tin
5. Drilling
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Technological steps for Double Sided Board1. Cutting of laminated board
2. Drilling
3. Plating through Holes
4. Traces printing (Dry film Imaging) – solid photo-resist technology
5. Tin plating
6. Stripping- elimination of photo-resist
7. Etching
8. Deposition of masks (soldering masks, Silkscreen mask)
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Technological steps for Multilayer BoardA. The internal layers are made
as single sided or double sided boards
B. Each internal layer is treated with adhesive and then are laminated together with external layers completely covered with Cu
C. Is made like a double sided board
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Double sided board -example
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Equipped boards - example
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Equipped boards - example