12/4/2002 interconnect i – class 16 prerequisite reading - chapter 4
TRANSCRIPT
12/4/2002Interconnect: Adv
2
Outline Transmission line losses
DC losses in the conductorFrequency dependent conductor lossesFrequency dependent dielectric lossesEffect of surface roughnessDifferential line losses
Incorporating frequency domain parameters into time domain waveforms
Measuring Losses Variations in the dielectric constant
12/4/2002Interconnect: Adv
3
Focus This chapter focuses on subtle high speed
transmission characteristics that have been ignored in most designs in the past
These effects become critical in modern designsOlder BKM assumptions break downBecome more critical as speeds increase
As speeds increase, new effects that did not matter become significant
This increases the number of variables that must be comprehendedMany of these new effects are very difficult to understand
This chapter will outline several of the most prominent non-ideal transmission lines issues critical to modern design
12/4/2002Interconnect: Adv
4
Key Topics:
DC resistive losses in the conductorFrequency dependent resistive losses in the
conductorFrequency dependent dielectric resistive losses Effect of surface roughnessDifferential line resistive losses
Transmission Line Losses
12/4/2002Interconnect: Adv
5
Transmission Line Losses (cont’d) These losses can be separated into two categories
Metal losses Normal metals are not infinitely conductive
Dielectric lossesClassic model are derived from the alignment of Electric dipoles in the dielectric with the applied fieldDipoles will tend oscillate with the applied time varying field – this takes energy
Why do we care about losses?Losses degrade the signal amplitude, causing severe problems for long busesLosses degrade the signal edge rates, causing significant timing push-outsLosses will ultimately become a primary speed limiter of our current technology
12/4/2002Interconnect: Adv
6Incorporation Losses Into The Circuit Model
A series resistor, R, is included to account for conductor losses in both the power and ground plane
A shunt resistor, G, is included to account for Dielectric Losses
LR
C G
12/4/2002Interconnect: Adv
7
DC Resistive Losses
w
t
Reference Plane
Current flows throughentire cross section of signalconductor and ground plane
wt
L
A
LR
tioncrossDC
sec
At low frequencies, the current flowing in a conductor will spread out as much as possible DC losses are dominated by the cross sectional area & the resistively (inverse of
conductivity) of the signal conductor
The current in a typical ground plane will spread out so much that the DC plane resistance is negligible
The DC losses of FR4 are very negligible
12/4/2002Interconnect: Adv
8
AC Resistive Losses As the frequency of a signal increases, the current will tend to migrate towards the periphery or “skin” of the conductor - This is known as the “skin effect”.
This will cause the current to flow in a smaller area than the DC case
Since the current will flow in a smaller area, the resistance will increase over DC
Outer (Ground) conductor
Inner (signal) conductor
Areas of high current density
Coaxial Cable Cross Section at High Frequency
12/4/2002Interconnect: Adv
9
The Skin Effect Why? When a field impinges upon a conductor, the field will penetrate the conductor and be attenuated
remember the signal travels between the conductors The field amplitude decreases exponentially into the thickness of the conductor – skin depth is defined as the penetration
depth at a given frequency where the amplitude is attenuated 63% (e-1) of initial value
f
Skin Depth In Copper
0
1
2
3
4
5
6
7
8
9
10
0.E+00 1.E+09 2.E+09 3.E+09 4.E+09 5.E+09 6.E+09
Frequency, Hz
Sk
in D
ep
th, m
icro
ns
XAm
pli
tud
e
Penetration into conductor
Electromagnetic Wave
12/4/2002Interconnect: Adv
10
The Skin Effect – Spatial View
The fields will induce currents that flow in the metal Skin effect confines 63% (e-1) of the current to 1 skin depth – the current density will decease exponentially into the thickness of the conductor The total area of current flow can be approximated to be in one skin depth because the total area below the exponential curve can be equated
to the area of a square
Skin Depths
0
0.1
0.20.3
0.4
0.5
0.6
0.70.8
0.9
1
0 1 2 3 4 5 6
Cu
rren
t
111
00
eedeArea
1 hwArea
12/4/2002Interconnect: Adv
11
Microstrip Frequency Dependent Resistance Skin effect causes the current to flow in a smaller area Frequency dependent losses can be approximated by modifying DC equations to comprehend current flow
Approximation assumes that the current is confined to on skin depth, and it ignores the current return path
The current will be concentrated in the lower portion of the conductor due to local fields
w
fL
fw
L
w
L
A
LR
flowcurrentAC
_
wt E-fields
12/4/2002Interconnect: Adv
12
The total resistance curve will stay at approximately the DC value until the skin depth is less than the conductor thickness, then it will vary with
f
Example of frequency dependent resistance
0
5
10
15
20
25
30
35
40
0.E+00 1.E+09 2.E+09 3.E+09 4.E+09 5.E+09 6.E+09Frequency, Hz
Res
ista
nce
, Oh
ms
Microstrip Frequency Dependent Resistance Estimates
R tot R DC R AC Frequency
R R0 Rs fTline parameter terms
R0 ~ resistance/unit length Rs ~ resistance/sqrt(freq)/unit length
12/4/2002Interconnect: Adv
13
Microstrip Return Path Resistance
The return current in the reference plane also contributes to the frequency dependent losses
2)/(1
1)(
HDH
IDI O
wt
The area that the return current will flow in will allow an effective width to be estimated
H
D
effectiveeffectiveground w
L
A
LR
(Current Density in plane)
12/4/2002Interconnect: Adv
14
Microstrip Return Path Resistance
oo
H
H
o II
dDHDH
I795.0)3(tan
2
)/(1
1 13
32
The current density formulae can be integrated to get the total current contained within chosen bounds
This shows that 79.5% of the current is contained in a distance +/- 3H (W of 6H) from the conductor center
Assuming a penetration of 1 skin depth, the ground return resistance can be approximated as follows
lengthH
F
HAR
groundgroundac /
66_
12/4/2002Interconnect: Adv
15
Total Microstrip AC Resistance
The total resistance is approximately the sum of the signal and ground path resistance
lengthHw
FH
F
w
FRtotal /
6
11
6
groundsignaltotalAC RRR _
This is an excellent “back of the envelope” formula for microstrip AC resistance
12/4/2002Interconnect: Adv
16More exact Formula – Microstrip (From Collins)
This formula was derived using conformal mapping techniques The formula is not exact should only be used for estimates
101.0)(03.08.5
5.01
105.00062.0132.094.0
4ln
11
2
2
H
wfor
w
F
wHHw
HwR
H
wforLR
H
wfor
H
w
H
wLR
w
F
t
wLRR
ground
signal
12/4/2002Interconnect: Adv
17
Stripline Losses In a stripline, the fields are referenced to two planes The total current will be distributed in both planes, and in the upper and lower portion
of the signal conductor
2)/(1
1)(
HDDI
2)/(1
1)(
HDDI
For example: In a symmetrical stripline,the area in which current will travel increases by a factor of 2 and the resistance decreases by a factor of 2
This inspires the parallel microstrip model
12/4/2002Interconnect: Adv
18
Calculating Stripline Losses
The skin effect resistance of a stripline can be approximated as follows: where the resistances are calculated from the microstrip formulae at the appropriate heights
)_2()_1(
)_2()_1(_
microHmicroH
microHmicroHstripac RR
RRR
wt
H1
H2
12/4/2002Interconnect: Adv
19
Surface Resistance for Microstrip The surface resistance (Rs) is often used to evaluate the resistive properties of a metal Observation of AC loss equations show the resistance is proportional to the square root
of Frequency
sHw
LR
fRFHw
LR
S
SAC
6
11
6
11
Rs is a constant that scales the square root behavior Is caused by the skin loss phenomena Used in specialized T-line models (i.e.,W-Element)
12/4/2002Interconnect: Adv
20
Surface Roughness alters Rs The formulae presented assumes a perfectly smooth
surface The copper must be rough so it will adhere to the laminate Surface roughness can increase the calculated resistance
10-50% as well as frequency dependence proportionsIncrease the effective path length and decreases the area
Skin-Depth
Plane
Trace
Tooth structure(4-7 microns)
12/4/2002Interconnect: Adv
21
Surface Roughness Effects Frequency Dependence
Surface roughness is not a significant factor until skin depth approaches the tooth size (typically 100 MHz – 300 MHz)
At high frequencies, the loss becomes unpredictable from regular geometric object because it is heavily dependent on a random tooth structure.
No longer varies with the root of frequency – something else
12/4/2002Interconnect: Adv
22
do not equal
PCB PerformancePCB Performance
PCB ModelingPCB Modeling
2 right turns a right and a left.
PCB X-sectionPOOL Stackup
FiberglassBundles
Example of Surface Roughness
Tooth Structure
Measurements indicate that the surface roughness may cause the AC resistance to deviate from F0.5
12/4/2002Interconnect: Adv
23
Dielectric Losses
Classic model of dielectric losses derived from damped oscillations of electric dipoles in the material aligning with the applied fields• Dipoles oscillate with the applied time varying field – this takes energy
Dielectric constant becomes complex with losses PWB board manufacturers specify this was a parameter called
“Loss Tangent” or Tan
'
'''''
Tanj
''21
F
dielectricdielectric
The real portion is the typical dielectric constant, the imaginary portion represents the losses, or the conductivity of the dielectric
12/4/2002Interconnect: Adv
24
Glass Weave Effects High Speed Signals
Resin Material
Glass Material
9 0 6 3
9 6 3
Er varation at 604 MHz of DDR sample #3
3.2
3.25
3.3
3.35
3.4
3.45
3.5
3.55
1 6 11 16 21 26 31 36 41 46 51 56 61
trace #
Er
Dielectric ConstantVariation – from different sample board
Data shows that Fiber Weave Effect cannot be ignored for High Speed signals
57
58
59
60
61
62
Impedance
5 10 15 20 25 30 35 40 45 50 55 60 65 70 Sample
Avg=58.92 LCL=58.34
UCL=59.51
Cut16
0
2
4
6
8
10
1 5 9 13 17 21 25 29 33 37 41 45 49 53 57 61
TraceWea
ve A
lign
men
tT
race
Zo
Epoxy trough
Glass Weave
12/4/2002Interconnect: Adv
25
Current Distribution and Differential Losses
•Ports matched to diff. mode impedance•Current distributions effect the loss•Evidence of a “sweet spot” where the loss is smallest
1 2 Zdiff
Zodd
4.5
Vary52
Zdiff Varies
10 GHz
5 GHz
Trace Separation (mils)
Lo
ss, 1
-|S
(2,1
)|
Differential Single LineTransitional
12/4/2002Interconnect: Adv
26
Microstrip losses as a function of frequency and loss tangent assuming smooth conductor(5/5/5; Circuit on page x)
Differential Microstrip Loss Trends - Tan
Differential Microstrip Loss Trends - Tan
• Model indicates linear behavior past 2.5 - 4 GHz
y = -1E-09x - 1.1925R2 = 0.9992
y = -5E-10x - 1.2079R2 = 0.9953
-25
-20
-15
-10
-5
0
0 5 10 15 20 25Frequency, GHz
Lo
ss,
dB
tand=0.01
tand=0.03
12/4/2002Interconnect: Adv
27
microstrip diffe loss, w=5, er=4.2, h=4.5, tand=0.03, Zodd over spacing = 50 +/- 5 ohms
-1.8
-1.6
-1.4
-1.2
-1
-0.8
-0.6
-0.4
1.00E+08 2.00E+08 3.00E+08 4.00E+08 5.00E+08 6.00E+08 7.00E+08
Frequency
loss
, dB
Low Freq. Differential Loss Trends - Spacing
Low Freq. Differential Loss Trends - Spacing
• Losses at low frequency are greater for narrow spaced diff. microstrip • Model predicts that loss curves for wide and narrow spaces intersect at:
700MHz when Tand=0.03, 3 GHz when Tand=0.01
W/S/W=5/15/5
W/S/W=5/5/5
Curves Intersect
12/4/2002Interconnect: Adv
28
microstrip differential loss, w=5, er=4.2, h=4.5, tand=0.03, Zodd over spacing = 50 +/- 5 ohms
-30
-25
-20
-15
-10
-5
0
0 2 4 6 8 10 12 14 16 18 20Frequency, GHz
Los
s, d
B
5-5
5-10
5-15
5-20
High Freq. Microstrip Loss Trends - SpacingHigh Freq. Microstrip Loss Trends - Spacing
• Model predicts losses at high frequencies are greater for wide spacing • Phenomenon is exacerbated with high values of Tand (Don’t ask why yet … wait a few slides)
12/4/2002Interconnect: Adv
29
Narrow Spacing Wide SpacingCurrent Distributions
E-Fields
Conductor Loss Concepts – S vs Spacing
Conductor losses increase due to skin effect & proximity effect
In absence of dielectric losses, narrow spacing will produce higher losses due to proximity effect – area of current flow determines losses (approx. root F behavior)
12/4/2002Interconnect: Adv
30Dielectric Loss Concepts – S vs Spacing Dielectric losses increase due to damped
response of electric dipoles with frequency of applied oscillating electric field
Tan losses increase linear w/ freq. (assuming homogeneous media)
Why does narrow spacing have the highest losses at low frequencies but the lowest loss at high frequencies?
At low frequencies, Tan losses are small and losses are dominated by skin and proximity effects;
Narrow spacing = smaller area for current = high loss At high frequencies, Tan losses dominate;
Smaller spacing leads to more E-fields fringing through the air and less through the lossy dielectric
12/4/2002Interconnect: Adv
31
Does Not Apply for Homogeneous Dielectric
Does Not Apply for Homogeneous Dielectric
stripline differential loss, w=5, er=4.2, B=18, tand=0.03, Zodd over spacing = 51 +/- 5 ohms
-40
-35
-30
-25
-20
-15
-10
-5
0
0 2 4 6 8 10 12 14 16 18 20Frequency, GHz
S=10 through 20
S=5
• Narrow spacing remains the highest loss configuration in a stripline over freq.• Since the dielectric media is homogeneous, all the fields are contained within the lossy material
• Since no fields fringe into a loss-free dielectric, the only conductor losses are affected by spacing