15 february 2007dirk wiedner / lhcb1 radiation monitors for lhcb
TRANSCRIPT
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15 February 2007 Dirk Wiedner / LHCb 1
Radiation Monitors for LHCb
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15 February 2007 Dirk Wiedner / LHCb 2
Goals
• Radiation levels up to >10kGy predicted for 10 years of LHCb running
• Level of radiation has influence on detector and electronic performance
• Active radiation monitors give levels every second– Feedback during run possible ->background– Time correlation to electronics or detector
performance possible– Calibrate simulated radiation levels
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15 February 2007 Dirk Wiedner / LHCb 3
Radiation levels
Radiation level in Bending plane over
5 years 2x1032
+ 5 years 5x1032 [1/(cm2s)]
Radiation level after RICH2 versus x-coordinate Gloria Corti
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15 February 2007 Dirk Wiedner / LHCb 4
Radiation levels
• 103 to 104 Gy at silicon detectors
• 102 to 103 Gy at outer tracker and calorimeters
• 10 - >100 Gy at on detector electronics
• <10 Gy in bunker and balcony racks
Estimates for 10 years of running
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15 February 2007 Dirk Wiedner / LHCb 5
Active monitors
• Thin Oxide RadFET: 0.1 to 10 kGy
• Thick Oxide RadFET: 10-3 to 10 Gy
• High sensitive silicon diode 108 to 2x1012 1MeV equ. Neutrons/cm2
• Particle detector diode 1011 to 5x1014 1MeV equ. Neutrons/cm2
• Temperature sensor
• Chosen by RADMON group
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15 February 2007 Dirk Wiedner / LHCb 6
Position active monitors
• Detector acceptance– x-y cross section after
RICH2 at 50/100/180/280 mrad
– 3 additional sensors along z at 320 mrad
• Electronics– 12 sensors at major
FE-electronic areas (boxes and racks)
• Reference in D3
Beam
M1
280 mrad
180 mrad
100 mrad
50 mrad
ELMB
Beam
M1
280 mrad
180 mrad
100 mrad
50 mrad
ELMB
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15 February 2007 Dirk Wiedner / LHCb 7
Position top view
1 - 8
9
10
1112
13
15
16
17
18
1920
21
22
23
24
26
25
141, 3
2
4
5
ELMB
Electronics Radmon
Detector Radmon
1 - 8
9
10
1112
13
15
16
17
18
1920
21
22
23
24
26
25
141, 3
2
4
51 - 8
9
10
1112
13
15
16
17
18
1920
21
22
23
24
26
25
141, 3
2
4
5
ELMB
Electronics Radmon
Detector Radmon
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15 February 2007 Dirk Wiedner / LHCb 8
Package
• Small (few cm) package
• Low material budget– 250 μm PCB
• 4 sensors + PT100 + reference resistor
• Developed by RADMON group
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15 February 2007 Dirk Wiedner / LHCb 9
Measurement
• Threshold voltage for RadFETs• Forward Voltage PIN-diode• Leakage current detector diode• Readout system developed by
Ljubljana ATLAS group – ELMB has 64 ADC channels
– ELMB DAC for IBIAS
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15 February 2007 Dirk Wiedner / LHCb 10
Data logging
• ELMB has CANbus interface
• CAN to USB
• PVSS control
• 1Hz rate for radiation values
• Data archive: Condition DB
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15 February 2007 Dirk Wiedner / LHCb 11
Radmon box TS/LEA
• LHC machine radiation monitor
• 10 installed at point 8 (Cryogenics)
• Allows x-check with RadFETs and diodes
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15 February 2007 Dirk Wiedner / LHCb 12
Metal foil detector
• Aluminum foil sensor for inner Tracker – Developed by the Kiew group– 28 cells covering 75 mm x 110 mm each– Complementary to RadFET/Diodes
218
mm
535 mm
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15 February 2007 Dirk Wiedner / LHCb 13
Beam condition monitor
• Diamond sensors very close to the beam
• 3 stations with 8 sensors each
• Optical data transmission
• TELL1 DAQ board used
CFC boardCVD diamond
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15 February 2007 Dirk Wiedner / LHCb 14
Passive sensors
• Installation at active monitor positions for x-check
• Additional 20 sensors per calorimeter: SPD/PS, ECAL, HCAL
• See talk of Ch. Ilgner
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15 February 2007 Dirk Wiedner / LHCb 15
PositionsBeam Condition Monitor
Metal Foil Detector
TS/LEA boxes
Passive Radmon
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15 February 2007 Dirk Wiedner / LHCb 16
Radiation background signal
• Radiation background at detector for LHC
• Combination of BCM, TS/LEA RADMON, Al-foil and active monitors
• Technical implementation to be seen
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15 February 2007 Dirk Wiedner / LHCb 17
Next steps
• Lab setup with sensors, ELMB (DAC)
• Produce electronics for all 26 sensors
• Order 32 sets of sensors from RADMON group / M. Glaser
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15 February 2007 Dirk Wiedner / LHCb 18
Summary
• Radiation map with RadFETs and diodes at 26 positions, ATLAS readout
• Passive monitor radiation map
• Dedicated radiation monitoring for– Inner tracker – metal foil detector– Beam condition – diamond sensors– Cryogenics at point 8 – TS/LEA box
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15 February 2007 Dirk Wiedner / LHCb 19
Backup
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15 February 2007 Dirk Wiedner / LHCb 20
Sensor details
• Sensitive P-I-N CMRP 108–2×1012 cm-2
• High rate P-I-N BPW 34 2•1012-4•1014cm-2
• RadFET thick Oxide CNRS 10-3–10 Gy
• RadFET thin Oxide REM Oxford 0.1–10kGy
• PT100
• 10KOhm reference resistor
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15 February 2007 Dirk Wiedner / LHCb 21
Further sensors at LHCb
• Passive Dosimeters – Installation at same +additional positions for x-check– See talk of Ch. Ilgner
• Beam Condition Monitor – Diamond sensors very close to the beam
• RADMON box (TS/LEA)– LHC machine radiation monitor– 10 installed at point 8 (Cryogenics)
• Aluminum foil sensor for inner Tracker, – Developed by the Kiew group– Complementary, covers IT detector
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15 February 2007 Dirk Wiedner / LHCb 22
Metal foil detector
• 5 layers of Al foil– 2 shield– 2 acceleration– 1 sensor
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15 February 2007 Dirk Wiedner / LHCb 23
Metal foil principle
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15 February 2007 Dirk Wiedner / LHCb 24
Metal foil signal flow
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15 February 2007 Dirk Wiedner / LHCb 25
Metal foil sensor