2012 11-27-masterclass-conductive-inks-kth
DESCRIPTION
Masterclass conductive printingTRANSCRIPT
Applications with Low-Cost Conductive Inks
iPack Center
Royal Institute of Technology (KTH) Stockholm, Sweden
Outline
Fundamental requirements for flexible electronic applications
Applications DC and RF interconnections & reliability Narrowband and wideband printed antennas Printed chipless RFID Printed wireless sensor Hybrid system for flexible electronics
Masterclass Future of Conductive Printing Nov 27, 2012
Fundamental Requirements of Low-cost Conductive Inks
Good printability/wettability on different substrate Good adhesion/reliability to substrates High conductivity
Typical sheet resistance < 0.1 Ohm/square for radio frequency application
Application-dependent (DC applications) Low sintering temperature: < 150-200℃ required for paper and
low-cost plastic substrate High printing resolution and line edge control
Masterclass Future of Conductive Printing Nov 27, 2012
DC and RF Interconnections Substrate-dependence: material, surface roughness, pore size Sintering temp and time strongly affect the sheet resistance
Masterclass Future of Conductive Printing Nov 27, 2012
100°C
4-point sheet resistance test pattern printed on PEL paper
Kordak Inkjet photo paper
Schoeller Inkjet photo paper
PEL Electronic grade paper for inkjet
UV Package paper from Korsnäs AB
PE Package paper from Korsnäs AB
[L. Xie et al., Mater. Lett. 2012]
DC and RF Interconnections
Coplanar Wave Guides (CPW) as RF interconnections No double side printing needed Easy to adjust the RF characteristic impedance on both plastic and paper substrate Characterized by VNA and TDR 50 impedance achieved, open the door for RF interconnection on paper
substrate
G S G G St
H
g Ws Wg Wg Ws
CPW CPS
(a) (b)
Masterclass Future of Conductive Printing Nov 27, 2012 [Y. Feng et al., Digital Fabrication 2011]
DC and RF Interconnections
CPW as RF testing vehicles to measure Line resistance, inductance, conductance and capacitance at microwave frequencies Conductance and capacitance are related to substrate properties
Measured CPW parameters Extracted AC properties
Electrical properties of the paper substrate
Masterclass Future of Conductive Printing Nov 27, 2012 [B. Shao et al., ESTC, 2008]
Interconnection Reliability
Interconnection reliability is always an important issue in applications Printed lines initially sintered all at 90 ℃ Aging the printed lines in 85℃/ 85%RH environment up to 6 weeks Monitor the resistance change Resistances decreased after one week and kept stable afterwards Results show that UV package paper shows better reliability than inkjet paper in
the aging test
Masterclass Future of Conductive Printing Nov 27, 2012
PEL paper UV package paper [L. Xie et al., Mater. Lett. 2012]
Printed Narrowband UHF RFID Antennas
UHF RFID Meander Line Antennas (866-868 MHz) Simulated by HFSS Printed by inkjet & flexo Experimentally measured in “dark” room Results match well with design High robustness Low ink-consumption
Masterclass Future of Conductive Printing Nov 27, 2012
[Y. Amin et al., J Electromagnet. Wave. 2012]
Printed Narrowband UHF RFID Antennas
UHF RFID Bowetie Antennas (860-960 MHz) Simulated by HFSS Printed by inkjet & screen Experimentally measured in “dark” room Results match well with design larger bandwidth
Measured Read Range Input Return Loss Masterclass Future of Conductive Printing Nov 27, 2012
[Y. Amin et al., Prog. Electromagn. Res. 2012]
Printed Wideband Antennas
Wideband Log-Spiral Antennas Log-spiral antennas inkjet printed on paper Experimentally measured in “dark” room Operational range of 0.8-3.0 GHz Accommodate several modules of wireless
sensing or other applications in addition to an RFID tag
Input Return Loss 2D Radiation Pattern Masterclass Future of Conductive Printing Nov 27, 2012
[Y. Amin et al., J Electromagnet. Wave. 2012]
Printed Wideband Antennas
Wideband Archimedean Spiral Antennas Archimedean spiral antennas inkjet printed on paper Experimentally measured in “dark” room Operational range of 0.8-3.0 GHz Simultaneously implementing a wide range of
different modules in addition to an RFID tag
Input Return Loss 2D Radiation Pattern Masterclass Future of Conductive Printing Nov 27, 2012
[Y. Amin et al., Prog. Electromagn. Res. 2012]
Printed Chipless RFID
Inkjet printed Chipless RFID on Paper Time doming reflection principle UWB impulse as interrogation signal 1.67 Gbps data rate Tapered microstrip line to overcome the relative
higher series resistance of inkjet printed lines
Masterclass Future of Conductive Printing Nov 27, 2012
[B. Shao et al., Micro. Opt. Techn. Let., 2011]
Printed Chipless RFID
Chipless RFID based on LC-tank Etched or Inkjet printed on plastic and paper substrate Sympathetic Oscillation Principle Possible to work for liquid-bearing applications
Masterclass Future of Conductive Printing Nov 27, 2012 [B. Shao et al., Micro. Opt. Techn. Let., 2012]
[Y. Feng et al., LOPE-C 2012]
Integration With Printed Sensors for Wireless Sensing
Printed Wireless Humidity Sensor f-MWCNTs as sensing material Passive sensor, fully-printable Design adapted for both UHF and UWB applications
Masterclass Future of Conductive Printing Nov 27, 2012
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5-150
-100
-50
0
50
100
150
200
Time (ns)
Volta
ge (m
V)
Interrogation UWB impulse
for UHF application, monitor return loss
for UWB application, monitor the reflected pulse energy
[Y. Feng et al., IEEE Sens. J., 2012]
[Y. Feng et al., IEEE Sens. Conf., 2011]
Hybrid system integration using Inkjet Printing
Hybrid Interconnection Platform Using adhesive to form a smooth step transition
between substrate and packaged components or bared Si IC dies
This smooth ensures that printed metal lines will not break when it crosses over the step difference
To connect bared
Si IC dies
To connect packged
components Masterclass Future of Conductive Printing Nov 27, 2012
[M. Mämtysalo et al., IEEE ECTC, 2012]
Hybrid System for Bio-Medical Applications
Bio-patch Implemented with SoC and Paper-based Inkjet Printing Bio-chip IC SoC Inkjet printed interconnection and electrodes Inkjet printed flexible cables Wearable Bio-patch on paper substrate
Printed Interconnects
Measured ECG signals and FFT using Printed Bio-Patch
Masterclass Future of Conductive Printing Nov 27, 2012
[G. Yang et al., IEEE T. Inf. Technol B., in Press]
Low Cost Conductive Ink for Flexible Cables for Wearable ECG Monotoring
Inkjet Printed Flexible Cable for ECG Monitoring
Inkjet printed flexible cable on paper for wearable ECG monitoring
The cable consists of printed metal lines and a shielding line in the middle
The experimental results show that a reliable performance with high quality ECG data is possible on the inkjet printed cable on flexible cable
Measured digitalized ECG signals @ 150 MHz Masterclass Future of Conductive Printing Nov 27, 2012 [Q. Wan et al., IEEE EPEPS, 2011]
Acknowledgements
• Thank you for the financial support from Vinnova (The Swedish Governmental Agency for Innovation Systems) through the Vinn Excellence centers program and the EU Commission under the FP7 CLIP (Conductive Low-cost Ink Project) project.
Masterclass Future of Conductive Printing Nov 27, 2012
Thank You!!
Questions?
Masterclass Future of Conductive Printing Nov 27, 2012