2012 13th international conference on electronic packaging...
TRANSCRIPT
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IEEE Catalog Number: ISBN:
CFP12553-PRT 978-1-4673-1682-8
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012)
Guilin, Guangxi, China 13 – 16 August 2012
Pages 1-833
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Table of Contents
Session A: Advanced Packaging & System Integration
A-002 SOS Wafer Cu Pillar Bumping Process Development for Flip Chip Package Application ....... 1John, Zhiyuan Yang
A-003 Process Development of a Stacked Chip Module with TSV Interconnection ............................ 8Xiao Zhong, Shenglin Ma, Yunhui Zhu, Yuan Bian, Xin Sun, Qinghu Cui, Min Miao, Jing Chen, Yufeng Jin
A-004 Synthesis of Multiferroic Ba0.7Sr0.3TiO3-Based Thin Films for Memory Devices by ChemicalSolution Deposition......................................................................................................................... 12Bin Li, Chunqing Wang, Wei Liu, Ying Zhong, Zhixin Zhang
A-005 The study of testing scenario for a SIP microcomputer ............................................................. 15Liangliang Liu, Penglong Jiang, Xiongbo Zhao
A-006 Enhancing Overall System Functionality and Performance with the Right PackagingSolutions.......................................................................................................................................... 19Nozad Karim, Yida Zou, Shengmin Wen
A-007 Structural and Compositional Optimization of Advanced Fan-in WLCSPs Base on FEASimulation........................................................................................................................................ 25Guo Hong Yan, Qin Shun Jin, Zhang Li, Tan KH, Lai CM
A-008 Simulation and Modeling of Wafer Level Silicon-Base Spiral Inductor .................................... 29Bian Xinhai, Guo Hongyan, Zhang Li, KH Tan, CM Lai
A-009 Anodic bonding for Pyrex 7740 and nitride silicon for wafer level vacuum packaging ......... 32Minghai Xu, Xuefang Wang, Yuzhe Wang, Chunlin Xu, Chang Hu, Sheng Liu
A-010 Development and Thermo-mechanical Stress Analysis of TSVs filling with Sn-basedIntermetallics................................................................................................................................... 36Ran He, Chongshen Song, Fengwei Dai, Hong Wang, Daquan Yu
A-011 Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints............... 40Jiandong Zhu, Chunqing Wang, Chunjin Hang, Yanhong Tian
A-012 Deep wet etching process of Pyrex glass for vacuum packaging ............................................ 44Shuai Shi, Xuefang Wang, Minghai Xu, Yuzhe Wang, Jiaojiao Yuan, Sheng Liu
A-013 The development of low cost Through Glass Via (TGV) interposer using additive method forvia filling............................................................................................................................................ 49Yu Sun, Daquan Yu, Ran He, Fengwei Dai, Xiaofeng Sun, Lixi Wan
A-015 A Study of Novel Wafer Level LED Package Based on TSV Technology ................................. 52Dong Chen, Li Zhang, Ye Xie, KH Tan, CM Lai
A-016 Effect of Additives on Copper Electroplating Profile for TSV Filling ........................................ 56
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Yunhui ZHU, Yuan BIAN, Xin SUN, Shenglin MA, Qinghu CUI, Xiao ZHONG, Jing CHEN, Min MIAO, Yufeng JIN
A-017 Design and Optimization of a TSV 3D Packaged Pressure Sensor for High Temperature andDynamic Measurement ................................................................................................................... 60Zhenhua Liu, Xian Huang, Zhiyuan Zhu, Jing Chen, Yufeng Jin
A-018 Void free filling of TSV vias by bottom up copper electroplating for wafer level MEMSvacuum packaging .......................................................................................................................... 64Chunlin Xu,Xuefang Wang,Yuzhe Wang,Minghai Xu,Chang Hu,Sheng Liu
A-019 Patterned Die-To-Die Thin Film Bonding for 3D Chip Stacks with Integrated MicrofluidicCooling............................................................................................................................................. 68Yassir Madhour, Thomas Brunschwiler, Mario El Kazzi, John Richard Thome, Bruno Miche
A-021 Low Latency Compute Node Architecture Cooled by a Two Phase Fluid Flow ...................... 74Qidong Wang, Daniel Guidotti, Lixi Wan, Liqiang Cao, Jie Cui, Fujiang Lin, Guang Zhu, Qian Wang, Tianchun Ye
A-022 Implement of a 3D Stacked Module Using Edge-interconnect .................................................. 82Xiongbo Zhao, Penglong Jiang, Liangliang Liu
A-023 Comprehensive Analysis of Thermal Mechanical Stress induced by Cu TSV and its Impact onDevice Performance ........................................................................................................................ 85Chongshen Song, Ran He, Daquan Yu, Lixi Wan
A-024 A collaborative design from schematic to layout: based on MCP technology........................ 90Maoyun Pan, Fengman Liu, Liqiang Cao, Ziguan Zhou, Yang Li
A-026 System Integration for Miniature Node of Wireless Sensor Network (WSN)............................ 94Gaowei Xu, Enliang Song, Xiao Chen, Shuangfu Wang, Chunsheng Zhu, Jiaotuo Ye and Le Luo
A-027 Optical Vertical Interconnect and Integration Based on Silicon Carrier................................... 97Fengman Liu, Yanbiao Chu, Baoxia Li, Jian Song, Haidong Wang, Tianmin Du, Binbin Yang, Lixi Wan
A-029 A Study of Characteristics of Halogen-Free Prevented Solder Materials................................ 101Mu-Chun wang, Tien-Tsorng Shih, Bao-Yi Lin, Hsin-Chia Yang, Yaw-Dong Wu, Chuan-Hsi Liu
A-030 Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs .... 105Lingen Wang
A-031 Wafer level Tungsten-Glass Bonding with Photosensitive BCB ..............................................111Yi SHAN, Nannan LI, Yunhui ZHU, Yiming ZHANG, Suhui CHEN, Jin LUO, Jia HU, Jing CHEN, Yufeng JIN
A-033 Metal Wafer Bonding for 3D Interconnects and Advanced Packaging ................................... 114V. Dragoi1, E. Pabo, T. Wagenleitner, C. Flötgen, B. Rebhan, and K. Corn
A-034 Simulation-based Investigation in Effects of Design Parameters on Electrical Characters fora TSV-bump Combination............................................................................................................. 121Runiu Fang,Xin Sun,Min Miao,Yufeng Jin
A-035 Low temperature Al based wafer bonding using Sn as intermediate layer ........................... 127Zhiyuan Zhu, Min Yu,Yingwei Zhu, Peiquan Wang, Chenchen Liu, Wei Wang, Min Miao, Jing Chen, Yufeng Jin
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A-036 Thermal Measurement Method for Multi-Chip Packages.......................................................... 131GOO FU TAT, LEE HAN MENG@EUGENE LEE, GEE KOK PENG
A-038 Research On Microsystem Interposer Designer Software With Through Silicon Via ........... 137Yanzhu Lv,Min Miao, Xiaofei Wang, Huifen Liu, Xin Sun, Zhensong Li,Yuexia Zhang, Xiaoqing Zhang
A-039 Experiments of Adhesive Distribution Based on Two-phase Flow DispensingTechnology ..................................................................................................................................... 142Guiren Huang, Jinsong Zhang and Jianhua Zhang
A-040 Formic acid with Pt catalyst combined treatment process for Cu low temperature bonding......................................................................................................................................................... 147Wenhua Yang, Masatake Akaike, Masahisa Fujino and Tadatomo Suga
A-041 Development of Advanced Fan-out Wafer Level Package (embedded Wafer Level BGA)Packaging ...................................................................................................................................... 151Yonggang Jin, Jerome Teysseyre, Xavier Baraton,S.W. Yoon, Yaojian Lin and Pandi C. Marimuthu
A-042 High Temperature Resistant Joint Technology for SiC Power Devices Using Transient LiquidPhase Sintering Process .............................................................................................................. 157Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Nakagawa, Hiroshi Sato
A-044 Dual-Band Bandpass Filter Design Using Composite Right/Left-Handed Materials ............ 162Wang liuping , Wan lixi , Cao liqiang
A-045 Wafer Bonding for CMOS Integration and Packaging............................................................... 166V. Dragoi, F. Kurz, T. Wagenleitner, C. Flötgen and G. Mittendorfer
A-046 Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material.................... 171Shuangxi Sun, Wei Mu, Yan Zhang, Björn Carlberg, Lilei Ye and Johan Liu
Session B: Packaging Materials and Processes
B-001 Inkjet Printing of Silver Nano Particles doped PEDOT:PSS Thin Film ................................... 177Zhaoting Xiong, Changqing Liu, Xianglin Zhang
B-002 HSOP Package Mold Process Development .............................................................................. 182Jinmei Liu, Deguo Sun, Junhua Luo, Jinzhong Yao
B-003 Interfacial reaction of heat-sink during vacuum and reflow soldering in Space powerelectronics ..................................................................................................................................... 186Yarong Chen, Meng Yang, Binbin Zhang, and Rong An
B-004 Thermal Performance Improving for Small Form Factor BGA................................................. 189Simon Wang, Scott Chen, Coltrane Lee, Robin Cheng, TS Chen, Andy Tseng
B-005 The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints withBi and Cr additions during thermal aging .................................................................................. 194Guokui Ju, Wenzhen Bi, Fei Lin, Yongjiu Han, Xicheng Wei
B-006 Fabrication of interconnected silver flakes for conductive adhesives through
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dopamine-induced surface functionalization............................................................................. 200Yunxia Jin, Jun Yang, Yuanrong Cheng, Fei Xiao
B-007 TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder.................................... 203Manman Rui, Xiuzhen Lu, Si Chen, Lilei Ye and Johan Liu
B-008 Research on Electroplating Process of SiC/Al Electronic Packaging Composites .............. 208WANG Kaikun, DU Jianquan, YANG Lei
B-009 A New Thermally Conductive Thermoplastic Die Attach Film ................................................. 212Yajun Duan, Lilei Ye, Huiwang Cui, Johan Liu
B-010 Mechanism of Low Temperature Cu-In Solid-Liquid Interdiffusion Bonding in 3D Package......................................................................................................................................................... 216Yanhong Tian, Ning Wang, Yang Li, Chunqing Wang
B-012 Effects of Sb Addition on Grain Ripening Growth at Interface of Sn-Ag-Cu-xSb/Cu in WettingReactions ........................................................................................................................................ 219Y. Tang, Y. C. Pang, J. X. Zhan, G. Y. Li
B-013 Low Temperature Bonding Method using Cu Micro Cones ..................................................... 224Qin Lu, Zhuo Chen, Anmin Hu, Ming Li, Dali Mao
B-014 Effect of Functionalization of Multi-walled Carbon Nanotubes with 4’-Allyloxy-biphenyl-4-olon Electrical Conductivity and Mechanical Properties of Silicon Resin Nanocomposites......................................................................................................................................................... 227Xue Gao, Dayong Gui, Wentao Zeng, Weiling Chen, Jianhong Liu
B-015 Low-Temperature Sintering of Nanoscale silver Paste for Double-Sided Attaching 9×9 mm2Chip ................................................................................................................................................ 232Jiaoyuan Lian, Yunhui Mei, Xu Chen, Xin Li, Gang Chen, Keqin Zhou
B-017 Synthesis and Characterization of a Novel Addition Silicone Resin for High Power LEDPackaging ...................................................................................................................................... 238Chuanxin He, Wentao Zeng, Xue Gao, Haijuan Zhao, Dayong Gui, Jianhong Liu
B-019 Oxidation and Corrosion of Au/Al and Cu/Al in Wire bonding Assembly ............................. 244Teck Kheng Lee, C.D Breach, Wee Ling Chongand Chwee Sim Goh
B-020 Preparation of antioxidative nano copper pastes for printed electronics application ......... 250Dunying Deng, Tianke Qi, Yuanrong Chen, Yunxia Jin, Fei Xiao
B-021 Carbon Aerogel /Polyaniline Composite as Supercapacitors Packaging Applications ....... 254Fengyin Chen, Dayong Gui, Sheng Ding, Yifeng Zhu,Jianhong Liu
B-022 Electroless plating copper cones on leadframe to improve the adhesion with epoxy moldingcompound....................................................................................................................................... 259Wenjing Zhang, Qin Lu, Tao Hang, Ming Li, Dali Mao
B-023 Benzoxazine-Modified Aluminum Polymer High Dielectric Composites ................................ 264Yuanrong Cheng, Tianke Qi, Yunxia Jin, Dunying Deng, Fei Xiao
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B-024 Failure Analysis of the Contamination on the Pins of the SOT Packages ............................. 267Mao Ru, Yuesheng Li, Fei Xiao, Wenhui Zhu, Jinbing Zhang, Dianlong Liu, Jun Cheng
B-025 The Preparation and Properties of BaTiO3-carbon Nanotube/Polyimide Three-phaseComposites by In-situ Polymerization for Flexible Package Circuit ....................................... 272Bo Zhang, Wen Yin, Yuan Lu, Lixi Wan
B-026 Inverse Analysis of Solder Joint Creep Properties ................................................................... 275E. Kamara, H. Lu, C. Bailey
B-027 Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures ......... 280HengGang Yin, Jun Shen, Qin Tang
B-028 Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy ..... 285Hongjun Ji, Qiang Wang, and Mingyu Li
B-029 Influence of Soldering Temperature and Dwelling Time on Morphological Evolution ofCu6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Interface.................................... 289Guang-Sui Xu, Jing-Bo Zeng, Min-Bo Zhou, Shan-Shan Cao, Xiao Ma, Xin-Ping Zhang
B-030 Tensile behaviors investigation of SWCNT-Ni with vacancies ................................................ 294Hengyou Liao, Fulong Zhu, Wei Zhang,Youkai Chen,Shao Song,Sheng Liu
B-031 Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Crthin film resistor............................................................................................................................. 298Lifei Lai, Rong Sun, Xianzhu Fu, Ruxu Du
B-032 Ultrasonic-induced Deformation Nanostructures in Coarse-grained Aluminum Wires atRoom Temperature........................................................................................................................ 302Hongjun Ji, Mingyu Li, and Chunqing Wang
B-034 Wettability Transition of Nickel Films with Micro-Nano Cones Array ..................................... 306Wenyan Geng, Haozhe Wang, Anmin Hu, Ming Li
B-035 Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by SinteredNano-silver Paste........................................................................................................................... 310Yunjiao Cao, Gang Chen, Yunhui Mei, Xin Li, Guo-Quan Lu, Xu Chen
B-037 A Comparative Study of Microstructure during Solidification within Ultrafine Interconnects ofDifferent Sizes and Geometries ................................................................................................... 318Zhiyong Wu, Zhiheng Huang, Dong Wu and Yong Zhang
B-038 The geometrical effects in a model coupled with microstructural evolution and mechanicalbehavior for small-scale solder joints......................................................................................... 324Hua Xiong, Zhiheng Huang, Dong Wu, and Yong Zhang
B-039 The Influences of Grain Size Distributions on Thermal-Stresses in Cu-TSV ......................... 330Yucheng Ma, Zhiheng Huang, Zhiyong Wu, Dong Wu and Yong Zhang
B-041 Effect of Dummy Via on the SIV Performance of Narrow-Wide Copper Interconnection ..... 336LIN Xiao-ling, LI Meng, XIAO Qing-zhong, Zhang Xiao-wen
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B-042 TEM study on interface of palladium coated copper wire bonding on aluminum metallization......................................................................................................................................................... 340Hui Xu, Ivy Qin, Ashish Shah, Horst Clauberg, Bob Chylak, and Viola L. Acoff
B-043 Effect of Palladium on Copper Aluminide Intermetallic Growth in Palladium Copper BondingWire ................................................................................................................................................. 346Johnny Yeung PH, Xu Hui, Effie Chew
B-044 Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi andMixed Rare Earth Elements .......................................................................................................... 352Jia-Qiang Huang, Min-Bo Zhou, Chang-Zheng Li, Xiao Ma, Xin-Ping Zhang
B-045 Study of Critical Factors Influencing the Solidification Undercooling Behavior ofSn-3.0Ag-0.5Cu (SAC) Lead-free Solder and SAC/Cu Joints ................................................... 356Xun-Ping Li, Jian-Min Xia, Hong-Bo Qin, Xiao-Qi He, Xin-Ping Zhang
B-046 The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactionswith Cu substrate........................................................................................................................... 361H. T Ma, J. Wang, L. Qu, L. L An, L. Y Gu, M. L Huang
B-048 Synthesis and Characterization of ZnO Nanowires by Solvothermal Method and Fabricationof Nanowire-based ZnO Nanofilms.............................................................................................. 366Yanbiao Chu, Lixi Wan, Xiehuan Wang, Jingwei Zhang
B-051 Study on the electrodeposition of Fe-Ni UBM films in modified watts bath .......................... 370Hao Zhang, Li Zhang, Zhenzhen Duan, Chi-Ming Lai, Zhi-Quan Liu
B-052 Spontaneous tin whisker growth from rare-earth tin alloys..................................................... 373Zhi-Quan Liu and Cai-Fu Li
B-053 Investigation of the optical properties of ZnO/epoxy resin nanocomposite: Application in theLED .................................................................................................................................................. 376Chongnan Peng, Guoping Zhang, Rong Sun
B-055 In-situ study on the formation and evolution behavior of voids at the interface duringsoldering process by synchrotron radiation real-time imaging technology.......................... 380H T Ma,L Qu ,H J Zhao,J Wang,L Y Gu ,L L An,M L Huang
B-056 Effects of Copper Plating Thickness of Ni/Fe Alloy Leadframe on the Thermal Performance ofSmall Outline Transistor (SOT) Packages .................................................................................. 385Weiqiang Li, Haibin Chen, Jiale Han, Ke Xue, Fei Wong, Ivan Shiu, Guangxu Cheng, Jingshen Wu
B-057 Study of 3-D Staking Assembly Based on the Package Material of PCB ............................... 389Yu-zhong Lu,Jian-guo Jiang,Xin-quan Lai,Xiu Wang,Zhan-wu Huang
B-058 Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu................................. 393H.T. Ma, L.L. An, L. Qu, J. Wang, L.Y. Gu, M.L. Huang
B-059 Investigate the Microstructure Changes in Cu Through-Silicon Vias (TSVs) under ThermalProcess ........................................................................................................................................... 398Zhaoqiang Zhang, Junwen Pang, Jun Wang, Chongshen Song, Daquan Yu
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B-060 Development of Large Die Assembly Process based on Simulation and Experiments ofUnderfill Materials Selection ........................................................................................................ 401Xiaoyang Liu, Xiaolong Wu, Ran He , Daquan Yu
B-061 SuperiorDrop Test Performance of BGA Assembly Using SAC105Ti Solder Spheres - Virtualfracture analysis ............................................................................................................................ 405Weiping Liu and Ning-Cheng Lee
B-064 Silver-based Thermal Interface Materials with Low Thermal Resistance............................... 410Hui Yu, Rui Zhang, Liangliang Li, Xiaofei Mao, Hongda Du
B-065 Study on Undercutting of Electroplated Micro-bumps with Different Etchants .................... 414Fengwei Dai, Daquan Yu, Wen Yin, Xiangmeng Jing, Lixi Wan
B-066 Warpage Resolution for Ball Grid Array (BGA) Package in a Fully Integrated Assembly.... 419Alvin B. Denoyo
B-067 Effect of Cu6Sn5 particles on microstructure formation and mechanical properties ofSn-58Bi solder................................................................................................................................ 423Xiaoying Liu, Mingliang Huang, Ning Zhao
B-068 Intermetallic compound formation in the interface between SAC305 solder and Cu-xZn-yNisubstrates ....................................................................................................................................... 426Ji Hwan Hwang, Young Min Kim, Tae Jin Kim, Young-Ho Kim, and Won Jong Lee
B-069 The Effect of Different TSV Electroplating Levelers on the Copper Residual Stress ........... 430Ciyan Wu, Xue Feng, Haiyong Cao, Huiqin Ling, Ming Li, Dali Mao
B-070 Investigation of Competitive Adsorption between Accelerator and Suppressor in TSV CopperElectroplating ................................................................................................................................. 434Yue Lu, Haiyong Cao, Qi Sun, Huiqin Ling, Ming Li, Jiangyan Sun
B-071 Liquid Optically Clear Adhesives for Display Applications ..................................................... 438Dr. D. Lu, Dr. J. Wang, Dr. C. Li, J. Yuan, J. Sawanobori, Dr. J. Lin, A. Litke, M. Levandoski
B-072 Development of Flexible Cu-MWCT Composite Thin Film for Functional Applications ....... 442R. Manu
B-073 Underfill Selection for Large Body (50x50mm) Lidded Flip Chip BGA Package with Low-K40nm Pb-free Bumps................................................................................................................... 1650Peng SUN, Vivian ZHANG, Rocky XU, Tonglong ZHANG
B-075 Ultra Thin Die Assembly Process for High Power RF Applications ........................................ 447M. Asis, A. Xiao, E. Del Rosario, F. Rabe, H. Thoonen
B-076 Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cusolder .............................................................................................................................................. 453Guoqiang Wei, Lei Wang
B-077 Size effect of BaTiO3 on the properties of epoxy/BaTiO3 composite film ............................. 457Suibin Luo, Shuhui Yu, Rong Sun, Xianwen Liang, Maobai Lai
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B-078 Advanced Underfill Materials ....................................................................................................... 461Qiaohong Huang, Tadashi Takano, Rose Guino, Ruihua Li
B-079 Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloyon the intermetallic growth with Cu substrate during isothermal aging ................................ 465L. C. Tsao, W. T. Huang, M. W. Wu, Sheng-Lung, Su
B-080 Analysis of new lead-free solder alloy microstructure ............................................................. 469Geng Zhiting, Heqing, Cheng Guohai, Ma Jusheng
B-081 Solder Extrusion Solution and Mold Adhesion to Die Surface Improvement with PI IsolationDesign for FCOL Exposed Die Technology................................................................................ 472Teck Siang Lim, CH Cheong, SH. Tan
B-082 Parametric Study, Modeling of Etching Process and Application for TaperedThrough-Silicon-Via....................................................................................................................... 477Shenglin MA, Xiao ZHONG, Yuan BIAN, Xin SUN, Yunhui ZHU, Jing CHEN, Min MIAO, Yufeng JIN
B-084 Copper Filling Process for Small Diameter, High Aspect Ratio Through SiliconVia (TSV) ......................................................................................................................................... 483Tiwei Wei, Jian Cai, Qian Wang, Ziyu Liu, Yinan Li, Tao Wang, Dejun Wang
B-085 Copper Chemical Mechanical Polishing and Wafer Thinning with Temporary Bonding forThrough Silicon Via Interconnect ................................................................................................ 488Ziyu LIU, Jian CAI, Qian WANG, Tao WANG, Tiwei WEI, Li LI
B-086 Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-StateAging ............................................................................................................................................... 494Ting Liu, Mingliang Huang, Ning Zhao
B-087 Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIGPads................................................................................................................................................. 499Fan Yang, Mingliang Huang, Ning Zhao
B-088 18um Pd- copper Wire Bonding Process Development............................................................ 503Ming-chuan Han , Xue-Song Xu, Liu-Chang Hu, J.Z. Yao, Mei-Jiang Song
B-089 Study of Cu wire bonding on NiPdAu pad of fine pitch low k C55nm technology for hightemperature automotive application ........................................................................................... 507Liuchang Hu, Xuesong Xu, Jinzhong Yao, Meijiang Song, Mingchuan Han
B-090 Suppression of Electro Chemical Migration Generation through Forming Parylene Coatingand Improving Adhesion Strength between Polyphthalamide Substrate Used for MoldedInterconnection Device and Coated Film.................................................................................... 511Yuji KIMURA, Sanae ISAWA and Mitsuru CHINO
B-091 A Quick Turn Packaging Solution and its Application.............................................................. 517Han Guo, Jian Cai, Yuanyuan Pu, Yu Chen, QianWang, Zhi Deng, Jing Jiang, Lingwen Kong
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B-092 The Effect of Gelatin on the Tin Electrodeposition ................................................................... 521Zi-Shou Zhao, Ai-Ping Xian
B-094 Numerical Simulation Of Reheating System Heat Transfer Coefficient With H63 Brass Alloy......................................................................................................................................................... 525WANG Kaikun, HE Qingluan, LI Xianhui
Session C: Packaging Design & Modeling
C-001 Comparison of copper, silver and gold wire bonding on interconnect metallization ........... 529Hu Guojun
C-002 Impact of Boundary Conditions, Glass Fiber Orientation and Stress-Free Temperature onthe Performance of a Plastic-Enclosed Electronic Product in a Thermal Cycling Environment......................................................................................................................................................... 534Shrikant N. Bhadri
C-004 Parameterized Modeling and Thermal Analysis of High-power LED package with GMSH andGetDP .............................................................................................................................................. 540Dai Weifeng, Li Yuesheng, Rumao; Zhou Yinyuan, Li Shuzhi, Ma Kejun
C-005 TSV Modeling and Thermal Analysis Based on 3D Package ................................................... 546Tian Wenchao, Wang Wenlong, Wang Hongming
C-006 Optimized design of signal crosstalk in high speed PCB ........................................................ 549Tian Wenchao, Shan Lei, Wang Wenlong, Zhu Yadi
C-007 Design and analysis of the embedded passive components based on organic substrate......................................................................................................................................................... 552Xiujiang Zhao, Shuhui Yu, Rong Sun
C-008 Thermal Simulation and Analysis of Intelligent Power Module (IPM) Package ..................... 556Peisheng Liu, Liangyu Tong, Jinxin Huang, Yujuan Tao, Haijun Shen
C-009 Thermal Modeling and Analysis of High Power Semiconductor laser Arrays ....................... 560Zhiyong Zhang, Pu Zhang, Xiaoning Li, Lingling Xiong, Hui Liu, Zhiqiang Nie, Zhenfu Wang, and Xingsheng Liu
C-011 Design of Die-Pad on Exposed Substrate (DOES) Leadframe Package for DDR3 InterfaceApplications ................................................................................................................................... 567Nansen Chen
C-012 Study of Magnetic Properties for Iron Core in A Closed Loop Hall Current Sensor ............. 575Xingguo Chenga,b, Zongyang Zhanga, Fuan Lic, Sheng Liua
C-014 Numerical Simulation on Heating Source of 3D Electronic Packaging .................................. 579WANG Kaikun, HE Qingluan, GAO Qi
C-015 An Equivalent Model of TSV Silicon Interposer......................................................................... 583AN Tonga, QIN Fei, WU Wei, YU Daquan, WAN Lixi, WANG Jun
C-016 Interfacial Delamination and Reliability Design of Exposed Pad Packages .......................... 588
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XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo
C-017 Effects of Solder Constitutive Models and FE Models on Fatigue Life of Dual-row QFNPackage........................................................................................................................................... 595XIA Guofeng, QIN Fei, ZHU Wenhui, GAO Cha, MA Xiaobo
C-018 Effects of Via Pitch on Silicon Stress in TSV Interposer .......................................................... 600AN Tong, QIN Fei, WU Wei, YU Daquan, WAN Lixi, WANG Jun
C-019 Interfacial Stress in Through Silicon Vias .................................................................................. 606LI Wei, QIN Fei, AN Tong, WU Wei, LIU Chengyan, WAN Lixi, YU Daquan, WANG Jun
C-022 Optimal Thermal Design of a High Power Package Using the Design of Experiment (DOE)......................................................................................................................................................... 611GAO Cha, QIN Fei, ZHU Wenhui, XIA Guofeng, MA Xiaobo
C-023 Comparative Analysis of Reliability between Dual-row and Conventional QFN Packages......................................................................................................................................................... 616XIA Guofeng, QIN Fei, ZHU Wenhui, MA Xiaobo, GAO Cha
C-024 Mechanical reliability characterization of 3D package.............................................................. 620Hiroshi Nakaido, Takuya Hatao
C-025 Stability Study of Thick-film Pressure Sensor on Steel Substrate.......................................... 625Zongyang Zhang, Xingguo Cheng, Run Chen, Xiaojie Chen, Sheng Liu
C-026 The Copper Stud Bump Bonding Process Analysis Based on Thermal-solid CoupledSimulation....................................................................................................................................... 629Zhang Shanshan, Zhang Jing
C-027 The effect of temperature on compressive mechanical behavior of SWCNT-Ni ................... 633Youkai Chen, Fulong Zhu, Hengyou Liao, Shao Song, Sheng Liu
C-028 Theoretical study on power factor of Si/Ge multi-layer thermoelectric micro-cooler........... 637Leilei Han, Chunqing Wang, Chunjin Hang
C-029 Study on Characteristics of Thermal Flow Sensor Designed by Different Shape Model ..... 641Youngbae Jeon, and Sheng Liu
C-030 Warpage Analysis on Package-on-Package (PoP) for Package Stacking Process............... 646Minshu Zhang, An Xie, Yu Chen and Yifei Huang
C-031 A Dynamic Model for Analyzing the Motion of Molten Solder During Self-Assembly......................................................................................................................................................... 649Lei Yang, Chunqing Wang, Wei Liu, Yanhong Tian
C-032 Stress-Strain Analysis of Double-Bump Solder Joints under Temperature Cycling LoadingUsing Finite Element Modeling .................................................................................................... 653Hegeng Wei, Chunyue Huang, Song Wu, Guangkuo Guo, Tianming Li
C-034 Simulation Research on Gold Stud Bump Forming .................................................................. 657CHENG Lei,ZHOU Dejian, WU Zhaohua, LIU Zhengwei
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C-036 FEA Study of the Evolution of Wafer Warpage During Reflow Process in WLP ................... 661Chunsheng Zhu, Wenguo Ning, Jiaotuo Ye, Gaowei Xu, Le Luo
C-037 Thermal resistance analysis by numerical method for power device packaging ................. 666Hao Wu, Ming Chen, Liming Gao, Ming Li
C-038 The Influences of Coating Alumina on the RF Characteristics of Packaged Surface AcousticWave Devices ................................................................................................................................. 671Zheng-dong Liu and Cheng Zhao
C-040 Improvement of Light Extraction Efficiency of White LEDs Using Microstructure Array onPhosphor Silicone Layer .............................................................................................................. 674Shan Yu, Run Hu, Mingxiang Chen, Sheng Liu
C-041 Packaging Optimization for Tire Pressure Monitoring System ............................................... 678Xiaojie Chen, Zongyang Zhang, Yi Leng, Zhang Luo, Sheng Liu
C-042 Modeling and Simulation of a Micromachined Gyroscope Using Differential FrequencyApproximate Match Method ......................................................................................................... 682Chang Hu,Xuefang Wang, and Sheng Liu
C-043 The Influence of Die Tilting on the Thermal Response and Die Attach Stress of a BottomExposed Package .......................................................................................................................... 685Cong Yue, Mingzhen Lu, Zhiqiang Niu
C-044 A novel shielding structure based on TSV 3D package ........................................................... 691Jun Li, Lixi Wan, Liqiang Cao
C-045 Preparation of Thermal Interface Material Filled with Micro-nano-Composite Particles into thePolymer ........................................................................................................................................... 695Rongrong Kuang, Dayong Gui, Lianggao Wu, Guangfu Zeng, Deqin Si, Jianhong Liu
C-048 Thermal Analysis and Heat Dissipation Optimization of 3D Packaging with TSV Interposer......................................................................................................................................................... 700He Ma, Daquan Yu, Jun Wang
C-049 ExperimentallyValidated Analysis and Parametric Optimizationof Monotonic 4-point BendTesting of Advanced BGA Packages .......................................................................................... 706Qiang Wang, Weidong Xie, Mudasir Ahmad
C-051 Influence of Thickness of Interfacial IMC Layer and Solder Mask Layer on MechanicalReliability of Micro-Scale BGA Structure Interconnects .......................................................... 714Hong-Bo Qin, Xun-Ping Li, Xing-Ping Zhang
C-052 Study on the warpage and thermal stress in wire bonding and C4 stacked chip package......................................................................................................................................................... 720Gong Yu-bing & Cen Chuan-sheng
C-053 The thermal stress analysis in 3D IC integration with TSV interposer ................................... 725Junwen Pang, Jun Wang
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C-054 Hybrid Modeling and Analysis on the Interfacial Characteristics of Cu/Al Interface Structuresin IC Packaging with Wire Bonding ............................................................................................. 731Liqiang Zhang, Dongjing Liu, Min Chen, Fangwei Xie, Xingang Yu, Xifu Song, Tao Xi, Yanfang Zhao,Ping Yang
C-055 Thermal Simulation for the Packaging Structures of Radio Frequency Power AmplifierChamber.......................................................................................................................................... 735Yanghai, Daoguo Yang, Yaoping Jia, Ke Jin
C-056 The Study of Thermal Mechanical Reliability of Different Copper Stud bump Solder Joints......................................................................................................................................................... 739Zhang Jing, Zhang Shanshan
C-057 Design and Analysis of 2D Embedded Passive Devices in Printed Circuit Boards .............. 745Jing Zhang,Baoxia Li, Lixiwan, Liqiang Cao
C-058 Experimental and Numerical Study of the Size Effect on Microstructure and MechanicalBehavior of Cu/Sn0.7Cu0.05Ni/Cu Joints with Very Small Solder Volume ............................ 749Wei Li, Min-Bo Zhou, Hong-Bo Qin, Xiao Ma, Xin-Ping Zhang
C-059 Analysis of Fatigue Life on Solder Joints of Compliant Wafer Level Packaging with MEMSAir-gap............................................................................................................................................. 755Li Peng, Pan Kai-lin, Wang Shuang-ping
C-060 Study on Thermal Placement Optimization of 3D High-power Microwave Module ............... 760WU Zhaohua
C-061 Thermo-mechanical characteristics of indium micro-joint under various low-temperatureexcursions ...................................................................................................................................... 766X.Cheng, C.Liu, V.V. Silberschmidt
C-062 Simulation Analysis for Interfacial Failure of A Poymer Sealed MEMS Device ................... 771Jing Zhou, Lixi Wan, Fengwei Dai, Xiangmeng Jing, Chongshen Song, Daniel Guidotti, Liqiang Cao, Daquan Yu
C-063 Thermal Analysis of DC/DC Power Module Based on Innovative Model with the Application ofActive Area Loading ...................................................................................................................... 778Pan Kai-lin, Liu Ganggang, He Xiaoqi,Zhou Bin
C-064 A GTLE and FDFD Algorithm for Analysis of Power Integrity in PCBs and Packages......... 783Yunyan Zhou, Lixi Wan, Liqiang Cao
C-065 Solder Constitutive Models and Failure CriteriaSelection inBoard Level Cyclic BendingSimulation....................................................................................................................................... 788Xiaoqing Li, Xingming Fu, Minyi Lou,Jianwei Zhou, Maohua Du and Myungkee Chung
C-068 Analysis and Reduction of Simultaneous Switching Noise in Multi-layer Package Substrate......................................................................................................................................................... 794SUN Ling, WANG Shenglong, SUN Haiyan, and YANG Lingling
C-069 Application of Finite Element Simulation on Package Failure Analysis and Problem Solving......................................................................................................................................................... 799Weidong Huang
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C-070 Multi-physics Modeling of LED-based Luminaires under Temperature and HumidityEnvironment ................................................................................................................................... 803Hongyu Tang, Daoguo Yang, G.Q. Zhang, Lili Liang, Hongliang Jia, Zhen Zhang, Miao Cai
C-071 Design of RF MEMS phase shifter packaging based on through glass via (TGV) interposer......................................................................................................................................................... 808Xiaofeng Sun, Yu Sun, Jing Zhang, Daquan Yu, Lixi Wan
C-072 Dynamic Analysis of Bare Printed Circuit Board under Impact .............................................. 811Ahmad H Youssef and Xuejun Fan
C-073 Study of the effect on die backside stress from coating of a nitride layer............................. 817J. Liao, S. H. Liu, Y. T. Yu, Y. Lin, G. Jin, G. Huang, Z. Z. Fu
C-074 Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints duringReflow ............................................................................................................................................. 823Xiaohui Wang, Mingliang Huang, Fan Yang, Ning Zhao
C-075 Vibration and drop analysis of 3D SiP with Through Silicon Via ............................................ 828Yang He,, Zhiyuan Zhu,GuanJiang Wang,, Yunhui Zhu, Guangyi Shi, Min Miao,3, Jing Chen, Yufeng Jin
C-076 Optimization of Electronic Packaging Structure Taking into Account of Its Life Cycle EnergyConsumption and Environmental Pollution ............................................................................... 834Z. P. Zhou, M. Cai, D. G. Yang, W. B. Chen
C-077 Millimeter-wave Performance of Various Interconnections Used for Si-based IC PackagingTechnologies .................................................................................................................................. 837Jie Cui, Qidong Wang, Guidotti.Daniel, Liqiang Cao, Lixi Wan
C-078 Molecular Dynamics Simulation of the Heat Transfer Coefficient at the Interface betweenCNTs and Water in the Carbon Nano-Tubes Micro-channel Cooler........................................ 841Min Huang, Gaoan Qi, Xiaojing Wang, Chunyang Zang, Bing Wu, Jia Wang
C-079 Thermal Design and Analysis of High Power LED with LTCC Packaging.............................. 845Yang Hai, Daoguo Yang, Dejin Yan, Wanchun Tian
C-080 The Heat Transfer Performance of the Carbon Nano-Tubes Micro-Channel Cooler in 3-DStacked Package ........................................................................................................................... 849Gaoan Qi, Min Huang, Xiaojing Wang, Bing Wu, Chunyang Zang, Dianxiao Wang
C-081 Modeling of Delamination in IC Packages .................................................................................. 854Andrew A. O. Tay
Session D: High Density Substrate & SMT
D-001 Investigation of Reflow Soldering under Nitrogen Atmosphere.............................................. 861Xulong Gui, Zongyang Zhong, Ling Xu, Sheng Liu
D-002 On Reflow Soldering Process and Reflow Profile ..................................................................... 866Xulong Gui, Zongyang Zhong, Ling Xu, Sheng Liu
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D-003 Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during LiquidIsothermal Aging at and above the Solder’s Melting Temperature ......................................... 872Min-Bo Zhou, Jing-Bo Zeng, Xiao Ma, Xin-Ping Zhang
D-004 Impact of Soldering Terminal Solderability of Component and PCB on Solder Joint Interface......................................................................................................................................................... 877Yuming Wang, Beibei Wang, Jian Cai, Tianxi Wang
D-005 Study on the optimization and analysis of the Mixed Reflow soldering with lead andlead-0free solder in the high density assembly ......................................................................... 884Huang Yinglei, Wu Zhaohua, Liu Zhengwei
D-007 Effects of Ni/Ag coating on the wettability of Sn-3Ag-0.5Cu alloy on Cu substrates at differenttemperatures .................................................................................................................................. 890Mali Zhao, Jun Shen, Jie Chen, Boyi Wu
D-008 Research of Reflow Soldering on Al-SiC Composite Material and Thick Film CeramicSubstrates ...................................................................................................................................... 896Ningning Wang, Binbin Zhang, Rong An, Meng Yang
D-009 A highlight processing technology for SMT solder joint gray image ..................................... 899Liang Tianshou, Zhou Dejian, Liu Zhengwei
D-010 Effect of Sampling Rate on the Accuracy of Strain Gage Measurement during Printed CircuitBoard Functional Test................................................................................................................... 903Hongbin Shi, Cuihua Tian, Rui Zhang, Daquan Yu, Toshitsugu Ueda
D-013 Research on Shear creep properties of SAC305 Solder Bumps in Ball Grid Array .............. 909Wenfei Zhang, Bing An, Wei Guo, Shen Chai, Yiping Wu
D-015 Compliant Pin Interconnect Challenging and Reliability after RoHS Exemption .................. 914David He, Yu Xiang, DF Chung, Dr. Paul Wang
Session E: Advanced Manufacturing Technologies & Packaging Equipment
E-001 Carrierless thin wafer handling for 3D integration .................................................................... 922Zhicheng LV, Jiaojiao Yuan, Jing Fang, Liang Yan, Xuefang Wang, ShengLiu
E-003 TSV Interposer with Au-Au Diffusion Bonding Technology for Wafer Level Fabrication......................................................................................................................................................... 926Xiao Chen, Jiaotuo Ye, Gaowei Xu, Le Luo
E-005 Ceramic Column Grid Array: A High-reliability Approach for Area Array Packaging........... 930Yingzhuo Huang, Xueming Jiang, Pengrong Lin, Yusheng Cao, Binhao Lian, Quanbin Yao
E-006 A new flux clean method of using DI water to replace organic solvent ................................. 934Tong Zhao, Ting Li, He Q.C, Hans Zhang, Li Xian Ma
E-007 Advanced Packaging Stepper for 300mm Wafer Process........................................................ 936Zhou Chang, Li Zhongyu, Zhang Lei
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E-008 Study of Factors Influencing Tin Whisker Growth .................................................................... 940Jiaojiao Yuan, Xuefang Wang, Zhicheng Lv, Shuai Shi, Yuzhe Wang, Sheng Liua
E-010 Integrated Wafer Thinning Process with TSV Electroplating for 3D Stacking ....................... 945Cao Li, Shengjun Zhou, Run Chen, Tao Peng, Xuefang Wang, Sheng Liu
E-011 Introducing FCA, a New Alloy for Power Systems on a Chip and Wafer Level MagneticApplications ................................................................................................................................... 949Trifon Liakopoulos, Amrit Panda, Matt Wilkowski, Ashraf Lotfi,KH Tan, Li Zhang, Chiming Lai, Dong Chen
E-012 Finite Element analysis of wire clamp for wire bonding........................................................... 955Dengke Fan, Fuliang Wang
E-013 A Comprehensive Analysis of the Thermal Cycling Reliability of Lead-Free Chip ScalePackage Assemblies with Various Reworkable Board-Level Polymeric ReinforcementStrategies........................................................................................................................................ 959Hongbin Shi, Cuihua Tian, Daquan Yu, and Toshitsugu Ueda
E-015 On the precision synthesis of the bonder in flip-chip equipment ........................................... 971Dawei Zhang, Meifa Huang, Zhiyue Wang, Bing Kuang, Mengmeng Xiao
E-017 An improved mean filter algorithm based on gray-scale difference and its application inX-ray detection system ................................................................................................................. 975Peng Wang, Weiwen Lv, Wenfei Zhang, Bing An, Yiping Wu
E-018 Challenges and Feasibility of Copper Wire bonding for Non-hermetic Packaging............... 980Jing-en Luan
E-019 A buffered distributed spray MOCVD reactor design ............................................................... 986Shaolin Hu, Zhiyin Gan, Han Yan, Sheng Liu
E-022 A Thick Film Accelerometer based on LTCC-Technology ....................................................... 990Shichao Guo, Min Miao, Runiu Fang, Duwei Hu, Yufeng Jin
E-024 Fabrication of a glass microfluidic device integrated with ultrasonic resonators ................ 993Wenlin Kuai, Jintang Shang, Wenlong Wei, Shunjin Qin, Tingting Wang, Jie Chen, Li Zhang, Lai CM
E-025 Thick Film Resistors on Alumina Substrate as Sensing Elements ......................................... 997Xiaojie Chen, Zongyang Zhang, Sheng Liu
E-026 The Challenge of Grinding Technology for TSV and BSI Device .......................................... 1000Liew Loy Seng
E-027 THz Filters Embedded in LTCC Multi-layer Substrate............................................................. 1003Xiaoqing Zhang, Min Miao, Zhensong Li, Yuexia Zhang,Yanzhu Lv,Yating Yao
E-028 Topology optimization of Swing-arm in LED Die Bonder ....................................................... 1006Meifa Huang, Dawei Zhang, Zhiyue Wang, Weichuang Quan
E-029 Mechanism Design and Dynamic Simulation of Die Bonding Machines.............................. 1010Zhanlun Cao, Xiaohong Wu, Jian Gao, Yongjun Jiang, and Xin Chen
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E-030 Optimal design of work stage mounting system of precision packaging equipment ........ 1015Hui Jing, Cong Li, Fuyun Liu, Bing Kuang
E-031 Research on Thermal Field of Giant Magnetostrictive Jetting Dispenser............................ 1019Pengfei Dan, Can Zhou, Shijun Zhang, Guiling Deng
E-032 Design of the temperature control system for the fluid jet-dispenser .................................. 1024Hui Li, Can Zhou, Shijun Zhang, Guiling Deng
E-033 A Primer to Applying Real Time Dispatching in Semiconductor Test Operations.............. 1027Ng Yuh Lin
E-034 Effects of Sulfide on Silver-Plated Lead Frame on Wire Bonding Quality ........................... 1030H.M Zhang, F. Zong, M. Hu, D.H Ye, Q.C He
E-035 Structural Optimization Design of Swing Arm Based on HyperWorks ................................. 1034Bing Kuang, Zhaolin Liu, Xiaohua Wu
Session F: Quality & Reliability
F-002 Cell Balancing Technology in Battery Packs ........................................................................... 1038Laura Yang, Eden W. M. Ma, Michael Pecht
F-003 Influence of Parameter Initialization on Battery Life Prediction for Online Applications... 1042Yinjiao Xing, Eden W. M. Ma, K-L. Tsui, Michael Pecht
F-004 Investigation on Surface Contamination caused by human on Phase Shifter Chip ........... 1047Zhenzhen Rao, Shengxiang Bao, Jianhai Ye, Zhang Xiaowen, Wang Zuwen
F-005 Reliability and Failure Analysis of Lithium Ion Batteries for Electronic Systems............... 1051Nick Williard, Wei He, Dr. Michael Osterman, Professor. Michael Pecht
F-006 Stress Monitoring in Flip Chip Packaging Process................................................................. 1056Chengjie Jiang, Fei Xiao, Chuanguo Dou, Heng Yang
F-007 The effect of Voids on Thermal Conductivity of Solder Joints .............................................. 1061Hailong Li, Chunqing Wang, Meng Yang, Ningning Wang, Rong An, Yanjun Xu
F-008 A Novel Current Sensor Based on Dual Hall Chips................................................................. 1065Xingguo Cheng, Zongyang Zhang, Fuan Lic, Sheng Liu
F-009 The effects of thermal cycling on electromigration behaviors in lead-free solder joints....................................................................................................................................................... 1068Zuo Yong, Limin Ma, Lu Yue, Sihan Liu, Fu Guo
F-010 Microstructure and Mechanical Properties of Lead-free PV Ribbon..................................... 1072Xuewei Wu, Dongyan Ding, Bai Han, Dali Mao
F-011 Failure Mechanism Diagnosis on Plastic Package Integrated Circuit Basing on Fault TreeAnalysis ........................................................................................................................................ 1076Yuan Chen, Xiaoqi He, Ping Lai
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F-012 Effect of Grain Orientation on Electromigration Degradation in Lead-free Solder Joints . 1080Yanhong Tian, Jingkai Qin, Xiaobin He, Chunqing Wang
F-013 A Global Supply Chain Collaboration to Synergize Technology Achievement for Green QFNQualification ................................................................................................................................. 1083Jeffrey ChangBing Lee, Graver Chang, Cherie Chen, ChengChih Chen ,Jandel Lin
F-014 Ant-Algorithm-Annealing-Algorithm-based Optimization Approach for MCM InterconnectTest ................................................................................................................................................ 1089Chen Lei
F-015 MCM Interconnect Test Scheme based on Particle Swarm Optimization Algorithm .......... 1093Chen Lei
F-018 Reliability of Fine Pitch Wafer Level Packages........................................................................ 1097Donglun Yang, Xiaotong Ye, Fei Xiao, Dong Chen, Li Zhang
F-019 Failure Analyse of the Welding Point in Flip-Chip BGA Packages in The Drop-Free ......... 1102Yuan Guozheng, Bai Chuang, Shu Xuefeng
F-020 Reliability experiment of high power cm-bar arrays ............................................................... 1106Lu Guo-guang, Lei Zhi-feng, Huang Yun, En Yun-fei
F-021 Investigation of Palladium Coverage on Free Air Balls of Palladium-Coated Copper Wires........................................................................................................................................................1110Haonan Pu, Tawei Lo, Techun Wang, Jiaji Wang
F-022 Experimental and FEM Study of Hygro-Thermo Reliability of FCPBGA................................1114Li Weijia, Gong Yonghui, Su Fei
F-023 Solderability of Eco-friendly OSP Surface Finish.................................................................... 1120Shijun Lu, Yeqing Tao, Dongyan Ding,Yu Hu
F-024 A Novel Type of Stacked Cylindrical PoP Package ................................................................. 1124Li-ye Cheng, Ling-feng Shi, Cheng-shan Cai, Chen Meng, Xin-quan Lai
F-025 Thermal Fatigue Life Optimization of QFN Package Based on Taguchi Method................. 1128WU Wei, QIN Fei, GAO Cha, ZHU Wenhui , XIA Guofeng
F-027 Effects of Micro Stamping Process on Optical Performance of Lead Frame LED Module....................................................................................................................................................... 1133Tao Peng, Zhaohui Chen, Chuangang Ji,FeiWang, KaiWang, Sheng Liu
F-029 Comprehensive Analysis for LED Airport Runway Centerline Lamp ................................... 1138Fei Wang, Tao Peng, Chuangang Ji, Xiaogang Liu, Xiang Gao, Sheng Liu
F-030 Investigation on Electromigration Failure of Phase Shifter ................................................... 1141Zhenzhen Rao, Shengxiang Bao, Xiaowen Zhang , Zuwen Wang , Weiming Lai
F-031 Tin Whisker Growth on Bright Sn Films Supported by Lead-frame Alloy Substrates ........ 1145Ting Liu, Dongyan Ding, Yiqing Wang, Yu Hu, Yihua Gong, Klaus-Peter Galuschki
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F-032 Reliability of Pb-free BGA solder joints under random vibration.......................................... 1150Fengjiang Wang, Dayun Tang, Huabing Wen, Mingfang Wu
F-033 Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics ........... 1155Hengyou Liao, Fulong Zhu, Wei Zhang,Youkai Chen,Shao Song, Sheng Liu
F-034 Assembly Technology by Multi-pin、HDF of PCB electrical connectors in Aerospaceelectronic products ..................................................................................................................... 1159Binbin Zhang, Wei Zhang, Meng Yang, Yarong Chen
F-035 Warpage measurement of silicon wafer of various junction surface area ........................... 1164Wei Zhang, Fulong Zhu, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu
F-036 Random Vibration Simulation and Analysis of PoP Solder Joints with Different StructureParameters ................................................................................................................................... 1168Tang Haili, Wu Zhaohua, Lui Zhengwei
F-037 Fracture Properties of Cu-EMC Interfaces at Harsh Conditions............................................ 1172M.Sadeghinia, K. M. B. Jansen, L. J. Ernst, H. Pape
F-038 A Numerical Method on Thermal and Vapor Pressure Effects on Void Growth in ElectronicPackaging ..................................................................................................................................... 1176Yue Mei, Xiaoqing Zhang, Xiangxin Zeng
F-039 Investigation for the Response of PCB Assembly with Five POP Packages during Dropping....................................................................................................................................................... 1180Yu Peng, Fan Zerui, Yao Xiaohu
F-040 Dimension Optimization of Through Silicon Via (TSV) through Simulation and Design ofExperiment (DOE) ........................................................................................................................ 1185Xiang Gao, Run Chen, Cao Li, Sheng Liu
F-041 Failure Analysis of Electroplating on Sliver Termination in Multilayer Ceramic Capacitors(MLCCs) ........................................................................................................................................ 1190Long Gui, Shengxiang Bao, Xiaowen Zhang, Zuwen Wang, Chengshi Zhang , Guanghua Shi
F-042 Process Control in Plasma Decapsulation: Preventing Damage to the Copper Wire Bonds &Controlled Removal of Si3N4 Passivation Layer ..................................................................... 1194J. Tang, J.B.J. Schelen, C.I.M. Beenakker
F-043 Relationship between crack propagation trends and grains in SnAgCu interconnects....................................................................................................................................................... 1200C.Q. Wang, Y. Zhong, J.F.J.M. Caers, X.J. Zhao, B.Li
F-044 Key Failure Modes of Solder Joints on ENIG PCBs and Root Cause Analysis ................... 1205Yao Bin, Zou Yabing
F-045 Isothermal Low Cycle Fatigue Behavior of Nano-Silver Sintered Single Lap Shear Joint....................................................................................................................................................... 1209Xin Li, Xu Chen, Guo-Quan Lu
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F-046 The Sub-Model Method for Analysis of BGA Joint Stress and Strain During RandomVibration Loading ........................................................................................................................ 1216Xie Haijun,Zhou Dejian,,Liu Zhengwei
F-047 Automated IP Quality Qualification for Efficient System-on-chip Design ............................ 1222Li-wei Wang, Hong-wei Luo
F-048 Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps....................................................................................................................................................... 1226Qinghua Zhao, Jinglin Bi, Anmin Hu, Ming Li, Dali Mao
F-049 An Assessment Method of Electronic Packaging Reliability Based on Rough Set Theory..................................................................................................................................................... 1230Ronghong Cui, Yuting He, Wenjun Shu, Hua Ding, Hou Bo
F-050 Dimensional change in micro-scale solder joint induced by evolution of IMCs ................. 1234Zhiwen Chen, Bing An, Yiping Wu, Changqing Liu, Rob Parkin
F-052 Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates....................................................................................................................................................... 1240Yucheng Liu, Tingbi Luo, Anmin Hu, Shangyuan Li, Weizhen Wang, Ming Li
F-053 Three-Dimensional Finite Element Analysis of Mechanical and Fracture Behavior ofMicro-Scale BGA Structure Solder Joints Containing Cracks in the Intermetallic CompoundLayer.............................................................................................................................................. 1244Hong-Bo Qin, Xing-Ping Zhang
F-054 The Irradiation Effect of DC-DC Power Converter under X-ray.............................................. 1250HE Yujuan, LUO Hongwei
F-055 Non-destructive testing of through silicon vias by using X-ray microscopy.................... 1254Xiangmeng Jing, Daquan Yu, Wei Wang, Guoqing Yu, Lixi Wan
F-057 Analysis of POP Solder Ball Thermal Cycling Fatigue Life Based on Stress Strain........... 1258Chen Liu,Xinquan Lai, Yuanming Xiao, Lingfeng Shi, Jianguo Jiang
F-058 Reliability evaluation of GaN based light-emitting diodes under high-temperature stressing....................................................................................................................................................... 1262Meijuan Fu,, Luqiao Yin, Fei Weng, Lianqiao Yang, Jianhua Zhang
F-059 An Innovative Way to Improve the Reliability of Gold Wire in Lighting Emitting Diodes (LEDs)....................................................................................................................................................... 1266Run Chen, Xiang Gao, Xiaogang Liu, Cao Li, Sheng Liu
F-060 Failure Analysis of Assembly Defect with IR-OBIRCH from Backside ................................. 1271Li Tian, Miao Wu, Chunlei Wu, Diwei Fan, Gaojie Wen, Dong Wang
F-061 Investigation on FBGA Block Warpage by Finite Element Simulation ................................. 1275Jinrui LI, Lin TAN, Qian WANG, Jian CAI, Guoliang YU, Shuidi WANG,Xiyun CHENG
F-062 Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube
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....................................................................................................................................................... 1280Chengshi Zhang, Shengxiang Bao, Xiaowen Zhang, Zuwen Wang, Peng Li, Long Gui
F-063 Research on BGA Solder Joint Two-dimensional Quality Information Extraction ............. 1284Zhao Huihuang, Wang Yaonan, Sun Yaqi
F-064 Research on SMT Solder Joint Image Segmentation.............................................................. 1287Sun Yaqi, Liu Yu
F-066 The study of impacts on long-term storage reliability caused by IC packages and preventingmeasurements.............................................................................................................................. 1290Zhang Qian, Hu Kaibo
F-067 Effect of Ni-W Alloy Barrier Layer on Copper Pillar/Sn IMCs Evolution ............................... 1294Chao Li, Anmin Hu, Ming Li, Jiangyan Sun
F-068 Loading Rate and Size Effect on the Fracture Behavior of BGA StructureCu/Sn-3.0Ag-0.5Cu/Cu Interconnects ....................................................................................... 1298Xun-Ping Li, Hong-Bo Qin, Yun-Fei En, Jian-Min Xia, Xin-Ping Zhang
F-070 Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/NiInterconnects with a Small Thickness during Isothermal Aging ........................................... 1303Jing-Bo Zeng, Guang-Sui Xu, Min-Bo Zhou, Xiao Ma, Xin-Ping Zhang
F-072 Moisture diffusion and integrated stress analysis in LED module ....................................... 1308Gong Yu-bing, Xu Jia-bing
F-074 Study on the delamination between adhesive film and silicon in stacked-die packaging....................................................................................................................................................... 1314Yinxing Liao, Xiao Li, Jun Wang
F-078 Study on Interfacial Behavior and Shear Strength of Lead-free Micro-interconnect Bump afterSnPb Reballing............................................................................................................................. 1317Zhou Bin, Zhou Qing, En Yun-fei
F-079 Influences of the Initial Thickness of the Interfacial IMC Layer on Electromigration Behaviorof Cu/Sn/Cu Microscale Joints................................................................................................... 1320Wu Yue, Hong-Bo Qin, Min-Bo Zhou, Guang-Sui Xu, Shan-Shan Cao, Xiao Ma, Xin-Ping Zhang
F-080 Environmental reliability of nano-structured polymer-metal composite thermal interfacematerial ......................................................................................................................................... 1326Xiuzhen Lu, Mengke Zhuang, Lei Zhang, Lilei Ye,Johan Liu
F-081 Thermo-mechanical Behaviour Analysis of Micro-solder Joints by Finite Element Modelling....................................................................................................................................................... 1329X. Zha, C. Liu, V.V. Silberschmidt
F-082 Accelerated test and life evaluation method of microwave tube in short vacuum tube....................................................................................................................................................... 1333Fang fang Song, Yun fei En, Sha jin Li, Xiao Hong, Xiao-bao Su, Shi-ji Yu
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F-083 The Study of infrared radiation thermal imaging technology for temperature testing ....... 1336Fang fang Song, Xiaoqi He, Ping Lai, Ren wang
F-084 Extraction of Anand Model Parameters for Mixed Solder Material by Tensile Test ............ 1340Zhou Bin, Zhou Qing, Pan Kailin, Liu Ganggang
F-086 Degradation Detecting of Solder Joints by Time Domain Reflectometry Technology ....... 1344Yu-Dong Lu
F-088 Failure Localization and Mechanism Analysis in System-on-Chip (SOC) using AdvancedFailure Analysis Techniques ...................................................................................................... 1348Yuan Chen, Hui Chen, Xiaowen Zhang, Ping Lai
F-089 Study on Signal Transmission Performance of Microwave Multi-chip Modules InterconnectVia Hole Structure........................................................................................................................ 1352WU Zhaohua
F-090 The Reliability Evaluation of the Bonding Wire in the DC/DC Power Under the Environment ofHumidity........................................................................................................................................ 1357Zhang XiaoWen, He xiaoqi
F-091 Reliability of HTS and HH/HT Tests Performed in Chips and Flex Substrates Assembled By aThermosonic Flip-Chip Bonding Process ................................................................................ 1360Cheng-Li Chuang, Jong-Ning Aoh, Min-Yi Kang
F-094 Energy Density Estimation of Crack Initiation in Sn-Ag-Cu(Ni) Solder Bump by Nano-impact....................................................................................................................................................... 1367Z.MA, S.BELHENINI, D.JOLY, F.CHALON, R.LEROY, N.RANGANATHANF.Qin,F.Doisseul
F-096 Electrochemical Migration and Electrochemical Corrosion Behaviors in 3wt.% NaCl Solutionof 64Sn-35Bi-1Ag Solder with In doping for Micro-nanoelectronic Packagings ................. 1372L. Hua, W. Dai, L. S. Duan, C. Y. Zhong
F-097 Statistical Analysis of the Impacts of Refinishing Process on the Reliability ofMicroelectronics Components ................................................................................................... 1377C. Y. Yin, C. Best, C. Bailey, S. Stoyanov, M. O. Alam
F-098 Equivalent moisture distribution calculation for fast moisture sensitivity level analysis(MSLA)........................................................................................................................................... 1382Xiaosong Ma, D.G.Yang, G.Q.Zhang
F-099 Decapsulation methods for Cu interconnection packages .................................................... 1387Xiaosong Ma, D.G.Yang, G.Q.Zhang
F-100 A Study of Ultrasonic Bonding Flip Chip Process and its Reliability for Low TemperatureInterconnection ............................................................................................................................ 1392Yo-Han Song, Sang-woon Seo, Gu-Sung Kim
F-104 Failure mode of SAC305 lead-free solder joint under thermal stress ................................... 1395Chao Huang, Daoguo Yang, Boyi Wu, Lili Liang, Yu Yang
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F-106 Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under CurrentStressing....................................................................................................................................... 1399Song Pan, Mingliang Huang, Ning Zhao, Shaoming Zhou, Zhijie Zhang
F-107 Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-AgBased Solder Joints .................................................................................................................... 1403Qiang Zhou, Mingliang Huang, Ning Zhao, Zhijie Zhang
F-108 Abnormal phase segregation induced by void formation in Cu/Sn-58Bi/Cu solder joint duringcurrent stressing ......................................................................................................................... 1407Hongwen He, Guangchen Xu, Fu Guo
F-109 Research on LED Temperature Characteristic and Thermal Analysis at Low Temperatures....................................................................................................................................................... 1411Yu Guo, Kai-lin Pan, Guo-tao Ren,Shu-jing Chen,Fei Yuan
Session G: Solid State Lighting Packaging and Integration
G-002 Impact of Sn3.0Ag0.5Cu Solder Powder Size on the Reliability of Solder Joints in HighDensity LED Packages ................................................................................................................ 1416Xinxin Wang, Limin Ma, Ya Qi, Jianping Liu, Fu Guo, Li Liu
G-003 Design of One Novel LED Airport Runway Centerline Light Suitable for Various Applications....................................................................................................................................................... 1421Chuangang Ji, Mengxiong Zhao, Tao Peng, Fei Wang, Cao Li, Sheng Liu
G-004 Thermal characterization of high power LED array in Aluminum Base Copper Clad Laminatepackage......................................................................................................................................... 1425Chunjin Hang, Jingming Fei, Hong Wang, Chunqing Wang
G-005 Development of a new die-attach process and related bonding tool for multi-chip LEDmodule .......................................................................................................................................... 1429Chunjin Hang, Hong Wang, Jingming Fei, Chunqing Wang
G-006 Research on eutectic bonding processes and interfacial damage features in high power LEDpackage......................................................................................................................................... 1432W. Liu, P. Jin
G-007 Thermal Design of a LED Multi-chip Module for Automotive Headlights ............................. 1435Qi Lin, Wang Chunqing, Tian Yanhong
G-008 Effects of Solder Layer on the Thermal Performance of LED Chip Array Package ............ 1439Xiaogang Liu, Run Chen, Fei Chen, Sheng Liu
G-010 Study on Mechanical Behavior and Interfacial Strength of YAG Phosphor-Filled Silicone....................................................................................................................................................... 1443Xing Chen, Simin Wang, Fei Chen, Huai Zheng, Sheng Liu
G-011 Phosphor Concentration in Silicone and Its Effect on the Mechanical and InterfacialProperties of Phosphor-Filled Silicone..................................................................................... 1447
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Xing Chen, Simin Wang, , Xiaogang Liu, Sheng Liu
G-012 Comprehensive Studies on Interfacial Properties and Microstructures of Silicone Used inLED Packaging............................................................................................................................. 1451Simin Wang, Xing Chen, Xiaogang Liu, Fei Chen, Bin Cao, Sheng Liu
G-015 Robustness of Point Light Source Approximation in Lens Design for Light-Emitting DiodePackages....................................................................................................................................... 1455Run Hu, Zhili Zhao, Sheng Liu, and Xiaobing Luo
G-016 A Novel LED Un-symmetrical Lens for Road Lighting with Super Energy Saving.............. 1459Zhili Zhao, Run Hu, Kai Wang, Fei Chen, Shang Wang, Sheng Liu
G-018 Fabrication of YAG Glass Ceramic and Its Application for Light Emitting Diodes ............. 1463Liang Yang, Mingxiang Chen, Shan Yu, Zhicheng Lv, Sheng Liu
G-019 Establishment of the Coarse Grained parameters for epoxy-copper Interfacial Separation....................................................................................................................................................... 1467Cell K. Y. Wong,, Stanley Y. Y. Leung, Rene H. Poelma, Kaspar M. B. Jansen, Cadmus C. A. Yuan, Willem D. van Driel,
Guoqi Zhang
G-021 A Method to Design Freeform Lens for Uniform Illumination in Direct-Lit LED Backlight withHigh Distance-Height Ratio ........................................................................................................ 1474Run Hu, Huai Zheng, Chuangang Ji, Sheng Liu, Xiaobing Luo
G-022 Optical Study of Phosphor Converted Light Emitting Diodes with Given Correlated ColorTemperatures ............................................................................................................................... 1479Xing Fu, Huai Zheng, Sheng Liu, Xiaobing Luo
G-023 Angular Color Uniformity Improvement for Phosphor-converted White Light-Emitting Diodesby Optimizing Remote Coating Phosphor Geometry.............................................................. 1483Huai Zheng, Xing Fu, Run Hu, Sheng Liu and Xiaobing Luo
G-024 Angular Color Uniformity Enhancement of Phosphor Converted White LEDs Integrated withCompact Modified Freeform TIR Components ........................................................................ 1487Shuiming Li, Kai Wang, Fei Chen, Shuang Zhao, Zhili Zhao, Sheng Liu
G-026 Optical design of LED packaging for concentrated and uniform lighting............................ 1491Shuang Zhao, Kai Wang, Fei Chen, Sheng Liu
G-027 Reliability Assessment of LED Luminaires Based on Step-stress Accelerated DegradationTest ................................................................................................................................................ 1495Rongbin Ren, Daoguo Yang, Miao Cai, Ming Gong
G-028 Analysis on the Failure Modes and Mechanisms of LED Packaging .................................... 1500Liu Xin, Fang Wenxiao
G-030 The Simulation Analysis of LED Luminaires for Indoor Lighting .......................................... 1503Wanchun Tian, Daoguo Yang, Miao Cai, Zhen Zhang, Ming Gong, Yu Yang
G-031 The design of LED driving power based on Current-double synchronous rectifier ZVZVS
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....................................................................................................................................................... 1508Xing Xue, Weikang Chen, Baoqiang Li
G-032 Rapid thermal cycling by eddy current inducted heating on optical property andthermostability of high power LED............................................................................................ 1512Jibing Chen Wei Guo Yinong Liu Wenfei Zhang Bing An Yiping Wu
G-033 Study on Packaging Structure of High Power Multi-Chip LED .............................................. 1516Peng Huang, Kailin Pan, Shuangping Wang, Shujing Chen
G-034 A structure design in HP-LED chip for higher reliability ........................................................ 1521Shuangping Wang, Kailin Pan, Peng Huang, Fei Yuan
G-035 Research on thermal shock test for the optical and electrical properties of white LEDs....................................................................................................................................................... 1526Yinong Liu, Jibing Chen, Wei Guo, Wenfei Zhang, Yiping Wu, Bing An
G-036 Stress Analysis of LED Bulb under Thermal and Humid Environment ................................ 1530Lili Liang, Daoguo Yang, Chao Huang, Fengze Hou, Hongyu Tang, Miao Cai, Zhen Zhang
G-040 Thermal analysis of phosphor in high brightness LED .......................................................... 1535H. Ye, Sau Koh, C.A.Yuan, G. Q. Zhang
G-041 Determination of Driving Current of RGB LEDs for White Light Illumination...................... 1540Huishan ZHAO, S. W. Ricky Lee
G-043 Reliability Assessment for LED Luminaires Based on Step-Stress Accelerated Life Test....................................................................................................................................................... 1546Ming Gong, Xiaosong Ma, Daoguo Yang, Miao Cai, Zheng Zhang, Rongbin Ren, Yu Yang
G-045 Thermal Analysis of High-Powered Devices Using Analytical and Experimental Methods....................................................................................................................................................... 1550J.H.L. Ling, A.A.O. Tayand K.F. Choo
G-046 Influence of Die Attach Materials to Optical and Thermal Performance of High Power LEDs....................................................................................................................................................... 1556Pengzhi Lu, Hua Yang, Huaiwen Zheng, Bin Xue, Xiaotong Wang, Linlin Wang, XiaoYan Yi, Lixia Zhao, Junxi Wang,
Guohong Wang, Jinmin Li
G-047 An Effective Prediction Method for LED Lumen Maintenance............................................... 1560H. B. Fan, X. P. Li, J. X. Shen, M. Chen
Session H: Emerging Technologies
H-001 Mechanism of Glass-Frit Fracture in MEMS Packaging.......................................................... 1564Hu Guojun
H-003 Wet etching of vias for wafer level packaging of GaAs based image sensor ...................... 1569
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Wang Shuangfu, Han Mei, Xu Gaowei, Luo le
H-004 Experimental and Numerical Investigations on the Performance and Reliability of CNT Finsfor Micro-Cooler ........................................................................................................................... 1573Yan Zhang, Hui-feng Lv, Jing-yu Fan, Di Jiang, Johan Liu
H-005 The effects of isothermal aging on sandwich structural of p- and n- TE/Ni/SBA/Cujoints.............................................................................................................................................. 1578Li Shen, Fu Guo, Nan Zheng, Ran Zhao
H-006 A Steel Pressure Sensor Based on Micro-fused Glass Frit Technology .............................. 1582Zongyang Zhang, Xingguo Cheng, Xulong Gui, Xiaojie Chen, Sheng Liu
H-007 Microstructure Evolution of 1100 Al Alloy Multi-foils during Ultrasonic AdditiveManufacturing .............................................................................................................................. 1586Hongjun Ji, Junzhao Wang, and Mingyu Li
H-009 A Novel Lens for High-luminance LED Direct Backlight ........................................................ 1590Chuangang Ji, Mengxiong Zhao, Run Hu, Tao Peng, Zong Qin and Sheng Liu
H-010 Sinter-Attach of High-Temperature Sensors for Deep-Drilling Monitoring .......................... 1594Julian Kähler, Andrej Stranz, Erwin Peiner, and Andreas Waag
H-011 A study of electrical character of 3D high-density junction capacitor for SiP..................... 1600Huijuan Wang, Daquan Yu, Ran He, Liqiang Cao, Lixi Wan
H-012 Embedded Active Device Packaging Technology Based on Organic Substrate................. 1604Xia Zhang, Jason Chan, Liqiang Cao, Xueping Guo,Yongjun Huo, Pinghua Bao, Linwen Kong, Lixi Wan
H-013 Mechanical Strength and Interface Characteristics of Glass-to-Glass Laser Bonding usingGlass Frit....................................................................................................................................... 1609Zunmiao Chen, Yuneng Lai, Lianqiao Yang, Jianhua Zhang
H-014 A combined fabrication methodology of the through wafer via for wl-package of GaAs imagesensors ......................................................................................................................................... 1614Jiaotuo Ye, Shuangfu Wang, Gaowei Xu, Chunsheng Zhu, Le Luo
H-015 Molecular Dynamics Investigation on Temperature-dependent Thermal Expansion andElastic Properties of Gallium Nitride Nanorods ....................................................................... 1617Han Yan, Zhiyin Gan, Sheng Liu
H-016 Influence of Strains on the Optical Properties of Non-polar and Semi-polar Gallium NitrideBased LEDs .................................................................................................................................. 1620Han Yan,Zhiyin Gan, Sheng Liu
H-018 Microstructural evolution of Sn single grain microbumps for 3D-TSV high density solderinterconnection under thermal aging tests .............................................................................. 1624Xing Shen, Bo Wang, Wenfei Zhang, Bing An, Yiping Wu
H-019 A Nanostructure Patterned Heat Spreader for On-Chip Thermal Management of HigH-0PowerLEDs .............................................................................................................................................. 1628
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Zhen Sun, Xiaodan Chen, Huihe Qiu
H-020 Direct robust active bonding between Al heat sink and Si substrate ................................... 1635L. C. Tsao, S. Y. Chang, Meng-Syuan, Huang, C. S. Chen
H-021 Fabrication of Wafer-Level Spherical Rb Vapor Cells for Miniaturized Atomic Clocks by aChemical Foaming Process........................................................................................................ 1639Wenlong Wei, Jintang Shang, Wenlin Kuai,Shunjin Qin, Tingting Wang, Jie Chen
H-022 Thermo-mechanical Design and Optimization of Micro Copper Pillar Bump for ElectricalInterconnection in 2.5D IC Integration ...................................................................................... 1642Shunjin Qin, Jintang Shang, Hongyan Guo, Li Zhang, Lai CM
H-023 Preparation of VACNT TIM by a Novel Metallization and Chemical Bonding Process ....... 1646Tingting Wang, Jintang Shang, Jingdong Liu
H-024 Electrical Characterization of Novel Material for High-density Capacitors .......................... 1655Wenbin Chen, Miao Cai, Ming Gong, Bingbing Zhang, Yu Yang, Zhen Zhang, Kailin Pan, Daoguo Yang
H-025 Highly Accelerated Life Testing of LED Luminaries................................................................ 1659M. Cai, W. B Chen, L. L Liang, M, Gong, W.C Tian, H. Y, Tang, S. Koh, C. A Yuan, Z. Zhang, G. Q. Zhang, D. G Yang