2012 microsystem open-lab

7/30/2019 2012 Microsystem Open-Lab

1/12

MICROSYSTEMSLABORATORY

:


2/12

:

Degree University Year

B. S.Department of Mechanical Engineering,

Chung-Ang Univ.1997.02

M. S.Department of Mechanical Engineering,

Chung-Ang Univ.1999.02

Ph. D. School of Engineering Osaka University2002.03

Degrees

Position Organization Period

T. A. School of Engineering, Osaka University 1999.10 ~ 2000. 7

R. A.Collaborative Research Center for Advanced

Science and Technology, Osaka University2000. 8 ~ 2001. 3

Research Fellow School of Engineering, Osaka University 2002. 4 ~ 2002.10

Designated Professor School of Engineering, Osaka University 2002.11 ~ 2003.12

Assistant Professor School of Engineering, Osaka University 2004. 7 ~ 2004. 8

Associate ProfessorSchool of Mechanical engineering, Chung-Ang

University2004. 9 ~ Present

Experience


3/12

[email protected]

[email protected]

[email protected]

[email protected]

[email protected]


4/12

MICROSYSTEMS LABORATORY

Microsystems

Fundamental

Technology

Material Assembly

Design

Manufacturing

Evaluation

Automobile

Ship & Marine

Space & Aircraft

Home electronics &Information Apparatus

Medical

Industry

Applications

System Integration

Technology


5/12

MICROELECTRONIC PACKAGING Field

MICRO SENSOR and ACTUATOR Field

ETC.

MICRO-, NANO ~ Field

Hybrid Interconnection Using Low-Melting-Point Alloy Thermo-Sonic Bonding Technique

3D Stack-Up by Using Solderable ECA

Micro- and Nano-bubble solution and its application

Capacitive Micromachined Ultrasonic Transducer

Micro-mirror


6/12


Hybrid Interconnection Using Low-Melting-Point Alloy

Redu

ctant

A

Polymer

Substrate

Lead

Cu

electrode

Conduction path

Hybrid Interconnection

Combined with

Metallurgical interconnection (Soldering)

Low process temperature, Simple

process, Fine pitch capability (ECA)

Using Low-Melting-Point Alloy Filler

Bonding process

Wetting test Cross section of solderable ECA joint


7/12


Thermo-Sonic Bonding Technique

Heating Plate

Flexible substrate

Pad

(a) Flexible substrate fixing on heating plate

Conduction

particleACF

HeatingPlateFlexible substrate

Binder

(b) ACF pre-bonding Flexible substrate

HeatingPlateFlexible substrate

Sichip

Bump

Heating

(c) Chip alignment and pre-heating

Low

Pressure

Ultrasonic vibration

Heating Plate

LCD panel

Si chip

(d)Apply the heating, pressure and Ultrasonic

Heating

Merits of this process

Low process temperature

Reduction of process time

Decreased bonding pressure

Bump

Si chip

Electrode

Substrate Conductive particle

Bonding process

Cross section of bonding joint


8/12


3D Stack-up by using Solderable ECA

ECA paste

Si wafer

Reflow

Squeegee & Alignment Complete

Substrate

Flip chipPolymer

Polymer (Underfill)

3D Stack-up

Solder

Merits of this process

Low process temperature

Simplify the whole process

Fast filling time

Underfill between the stacked

substrates


9/12


Capacitive Micromachined Ultrasonic Transducer

0.0

0.0

Displacement, m

-2.5

0.0

-0.5-1.0

-1.5

-2.0

x10-7Displacement, m

-2.7

(a) 0 V (b) 23 V

Thickness of Post B

Height of Vacuum Gap

Width of Post A

Radius of Plate B

Radius of Plate ARadius of Post B

Thickness of Plate A

Thickness of Plate BRadius of Plate

Thickness of Plate

Heightof Vacuum Gap

Width of Post

Conventional design Novel design

FEM results


10/12


Micro-mirror

1861.4 Hz 2644.0 Hz

y

x

Fabricated micro-mirror

FEM results

(a) Natural frequency (b) Air-film damping pressure


11/12

Micro-, Nano- Fields

Micro- and Nano-bubble solution and its application

(c) Concentration and DO meter

of the Oxyzen bubble

(a) Recording image of the bubble (b) Particle size distribution

Bubble

Wide range of application

Medicine

Water treatment

Energy

Agriculture

Food


12/12

THANK YOU FOR YOUR ATTENTION

WELCOME TO

MICROSYSTEMSLAB.

2012 microsystem open-lab

Documents