2016 ieee international ultrasonics symposium
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FRANCETOURS
IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society
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ieee INTERNATIONAL ULTRASONICS SYMPOSIUMGeneral Chair
Ayache Bouakaz, Université F. Rabelais de Tours,
Inserm, France Technical Chair
Ton van der Steen, Biomedical engineering,
Erasmus MC, Rotterdam, The NetherlandsFinances Chairs
Christelle Vibrac, Université F. Rabelais de Tours and
Dan Stevens Treasurer IEEEExhibits Chairs
Oliver Keitmann, Siemens AS, Denmark and
Jean Luc Gennisson Institut Langevin, Paris
Short courses ChairsNico de Jong,
Erasmus MC, Rotterdam and Lori Bridal, LIB Paris
Communication - Sponsor Chairs Nicolas Felix,
VERMON Tours and Cyril Lafon, LabTAU, Lyon
Audio - Video Chair Jean-Marc Grégoire,
Université F. Rabelais de ToursLocal / student / Travel / Visa
arrangements Chair Jean-Michel Escoffre,
Université F. Rabelais de Tours and H. Liebgott, CREATIS Lyon
Publication Chair Steve Freear,
University of Leeds, Leeds, United Kingdom
http://ewh.ieee.org/conf/ius_2016
September 18-21, 2016, TOURS, FRANCE
The annual 2016 IEEE International Ultrasonics Symposium will be held at the VINCI Convention Center, TOURS, FRANCE, from September, 18-21, 2016. Oral and poster presentation formats will be used at the symposium. Papers are solicited for this conference describing original work in the field of ultrasonics from the following subject classifications:·Group 1: Medical UltrasonicsMBB Medical Beamforming and Beam SteeringMBE Biological Effects & DosimetryMBF Blood Flow MeasurementMCA Contrast AgentsMEL ElastographyMIM Medical ImagingMPA Medical PhotoacousticsMSD System & Device DesignMSP Medical Signal ProcessingMTC Medical Tissue CharacterizationMTH Therapeutics, Hyperthermia, and Surgery·Group 2: Sensors, NDE & Industrial ApplicationsNAF Acoustics MicrofluidicsNAI Acoustic ImagingNAM Acoustic MicroscopyNAS Acoustic SensorsNDE General NDE MethodsNEH Energy HarvestingNFM Flow MeasurementNMC Material & Defect CharacterizationNPA PhotoacousticsNPC Process ControlNSP Signal ProcessingNTD Transducers: NDE and IndustrialNUA Underwater AcousticsNWP Wave Propagation
·Group 3: Physical AcousticsPAT Acoustic Tweezers and Particle ManipulationPNL Nonlinear AcousticsPGP General Physical AcousticsPOA Opto-acousticsPPN PhononicsPTF Thin FilmsPMI Magnetic/Electromagnetic InteractionsPUM Ultasonic Motors & Actuators·Group 4: Microacoustics: SAW, FBAR, MEMSADA Device ApplicationsADD Device DesignADM Device ModelingAMP Materials & PropagationAMS Microacoustic Sensor Devices & Applications·Group 5: Tranducers & Transducer MaterialsTMC Materials Fabrication and CharacterizationTMO Modeling (Analytical & Numerical)TFT Thin and Thick Piezoelectric FilmsTMU Micromachined Ultrasonic TransducersTMI Biomedical Diagnostic and Imaging
TransducersTTT Biomedical Therapeutic TransducersTHF Front-end and Integrated ElectronicsTFI High Frequency TransducersTPF Applications of Piezoelectrics &
Ferroelectrics
SUBMISSION SYSTEM OPEN MARCH 1, 2016SUBMISSION DEADLINE APRIL 1, 2016
ACCEPTANCE NOTIFICATION MAY 30, 2016
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