2sk3918
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MOS FIELD EFFECT TRANSISTOR
2SK3918
SWITCHING
N-CHANNEL POWER MOS FET
DATA SHEET
Document No. D17077EJ3V0DS00 (3rd edition)Date Published January 2005 NS CP(K)
Printed in Japan20
The mark shows major revised points.
ORDERING INFORMATION
PART NUMBER PACKAGE
2SK3918 TO-251 (MP-3)
2SK3918-ZK TO-252 (MP-3ZK)
DESCRIPTION
The 2SK3918 is N-channel MOS FET device that
features a low on-state resistance and excellent switching
characteristics, and designed for low voltage high current
applications such as DC/DC converter with synchronous
rectifier.
FEATURES
Low on-state resistance
RDS(on)1 = 7.5 m MAX. (VGS = 10 V, ID = 24 A)
Low Ciss: Ciss = 1300 pF TYP.
5 V drive available
ABSOLUTE MAXIMUM RATINGS (TA = 25C)
Drain to Source Voltage (VGS = 0 V) VDSS 25 V
Gate to Source Voltage (VDS = 0 V) VGSS 20 V
Drain Current (DC) (TC = 25C) ID(DC) 48 A
Drain Current (pulse)Note1
ID(pulse) 192 A
Total Power Dissipation (TC = 25C) PT1 29 W
Total Power Dissipation PT2 1.0 W
Channel Temperature Tch 150 C
Storage Temperature Tstg 55 to +150 C
Single Avalanche CurrentNote2
IAS 22 A
Single Avalanche EnergyNote2
EAS 48 mJ
Notes 1. PW 10 s, Duty Cycle 1%
2. Starting Tch = 25C, VDD = 12.5 V, RG = 25 , VGS = 20 0 V
(TO-251)
(TO-252)
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Data Sheet D17077EJ3V0DS2
2SK3918
ELECTRICAL CHARACTERISTICS (TA = 25C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Zero Gate Voltage Drain Current IDSS VDS = 25 V, VGS = 0 V 10 A
Gate Leakage Current IGSS VGS = 20 V, VDS = 0 V 100 nA
Gate Cut-off Voltage VGS(off) VDS = 10 V, ID = 1 mA 2.0 2.5 3.0 V
Forward Transfer AdmittanceNote
| yfs | VDS = 10 V, ID = 12 A 6 12 S
RDS(on)1 VGS = 10 V, ID = 24 A 5.9 7.5 mDrain to Source On-state ResistanceNote
RDS(on)2 VGS = 5.0 V, ID = 12 A 11 22.2 m
Input Capacitance Ciss 1300 pF
Output Capacitance Coss 310 pF
Reverse Transfer Capacitance Crss
VDS = 10 V
VGS = 0 V
f = 1 MHz220 pF
Turn-on Delay Time td(on) 13 ns
Rise Time tr 14 ns
Turn-off Delay Time td(off) 38 ns
Fall Time tf
VDD = 12.5 V, ID = 24 A
VGS = 10 V
RG = 10
14 ns
Total Gate Charge QG 28 nC
Gate to Source Charge QGS 5 nC
Gate to Drain Charge QGD
VDD = 20 V
VGS = 10 V
ID = 48 A10 nC
Body Diode Forward VoltageNote
VF(S-D) IF = 48 A, VGS = 0 V 0.98 V
Reverse Recovery Time trr IF = 48 A, VGS = 0 V 27 ns
Reverse Recovery Charge Qrr di/dt = 100 A/s 15 nC
Note Pulsed
TEST CIRCUIT 3 GATE CHARGE
VGS = 20 0 V
PG.
RG = 25
50
D.U.T.L
VDD
TEST CIRCUIT 1 AVALANCHE CAPABILITY
PG.
D.U.T.
RL
VDD
TEST CIRCUIT 2 SWITCHING TIME
RG
PG.
IG = 2 mA
50
D.U.T.
RL
VDD
IDVDD
IASVDS
BVDSS
Starting Tch
VGS
0
= 1 sDuty Cycle 1%
VGSWave Form
VDSWave Form
VGS
VDS
10%0
0
90%
90%
90%
VGS
VDS
ton toff
td(on) tr td(off) tf
10% 10%
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Data Sheet D17077EJ3V0DS 3
2SK3918
TYPICAL CHARACTERISTICS (TA = 25C)
DERATING FACTOR OF FORWARD BIASSAFE OPERATING AREA
TOTAL POWER DISSIPATION vs.CASE TEMPERATURE
dT-PercentageofRatedP
ower-%
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
TC - Case Temperature - C
PT-TotalPowerDissipation-W
0
5
10
15
20
25
30
35
0 25 50 75 100 125 150 175
TC - Case Temperature - C
FORWARD BIAS SAFE OPERATING AREA
ID-DrainCurrent-A
0.1
1
10
100
1000
0.1 1 10 100
PW = 100 s
1 ms
10 ms
Power Dissipation Limited
TC = 25C
Single pulse
ID(pulse)
RDS(on) Limited
(at VGS = 10 V)
ID(DC)
VDS - Drain to Source Voltage - V
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
rth(t)-TransientThermal
Resistance-C/W
0.01
0.1
1
10
100
1000
Rth(ch-A) = 125C/W
Rth(ch-C) = 4.31C/W
Single pulse
PW - Pulse Width - s
100 1 m 10 m 100 m 1 10 100 1000
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Data Sheet D17077EJ3V0DS4
2SK3918
DRAIN CURRENT vs.DRAIN TO SOURCE VOLTAGE
FORWARD TRANSFER CHARACTERISTICS
ID-DrainCurrent-A
0
50
100
150
200
0 1 2 3
VGS = 10 V
Pulsed
5.0 V
VDS - Drain to Source Voltage - V
ID-DrainCurrent-A
0.01
0.1
1
10
100
1000
0 1 2 3 4 5 6
Tch = 55C
25C
75C125C
150C
VDS = 10 V
Pulsed
VGS - Gate to Source Voltage - V
GATE CUT-OFF VOLTAGE vs.CHANNEL TEMPERATURE FORWARD TRANSFER ADMITTANCE vs.DRAIN CURRENT
VGS(off)-GateCut-offVoltage-V
0
1
2
3
4
-100 -50 0 50 100 150 200
VDS = 10 V
ID = 1 mA
Tch - Channel Temperature - C
|yfs|-ForwardTransferAdmittance-S
0.1
1
10
100
0.1 1 10 100
VDS = 10 V
Pulsed
Tch = 55C
25C
75C
125C
150C
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs.DRAIN CURRENT
DRAIN TO SOURCE ON-STATE RESISTANCE vs.GATE TO SOURCE VOLTAGE
RDS(on)-DraintoSourceOn-stateResistance-m
0
5
10
15
20
1 10 100 1000
10 V
Pulsed
VGS = 5.0 V
ID - Drain Current - A
RDS(on)-DraintoSourceOn-stateResistance-m
0
5
10
15
0 5 10 15 20
Pulsed
ID = 24 A
VGS - Gate to Source Voltage - V
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Data Sheet D17077EJ3V0DS 5
2SK3918
DRAIN TO SOURCE ON-STATE RESISTANCE vs.CHANNEL TEMPERATURE
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
RDS(on)-DraintoSourceOn-stateResistance-m
0
5
10
15
-100 -50 0 50 100 150 200
ID = 24 A
Pulsed
VGS = 10 V
Tch - Channel Temperature - C
Ciss,Coss,Crss-Capacitance-pF
100
1000
10000
0.01 0.1 1 10 100
VGS = 0 V
f = 1 MHz
Ciss
Coss
Crss
VDS - Drain to Source Voltage - V
SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS
td(on),tr,td(off),tf-SwitchingTime-ns
1
10
100
1000
0.1 1 10 100
tr
td(off)
td(on)
tf
VDD =12.5 V
VGS = 10 V
RG = 10
ID - Drain Current - A
VDS-DraintoSourceVoltage-V
0
5
10
15
20
25
30
0 10 20 300
2
4
6
8
10
12
VDS
VDD = 20 V
12.5 V
5 V
ID = 48 A, 42 A (at VDD = 5 V)
VGS
QG - Gate Charge - nC
VGS-GatetoSourceVoltage-V
SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs.DIODE FORWARD CURRENT
IF-DiodeForw
ardCurrent-A
0.01
0.1
1
10
100
1000
0 0.5 1 1.5
VGS = 10 V
0 V
Pulsed
VF(S-D) - Source to Drain Voltage - V
trr-ReverseRecoveryTime-ns
1
10
100
1000
1 10 100
di/dt = 100 A/s
VGS = 0 V
IF - Diode Forward Current - A
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2SK3918
The information in this document is current as of January, 2005. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
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