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    The information in this document is subject to change without notice. Before using this document, pleaseconfirm that this is the latest version.Not all products and/or types are available in every country. Please check with an NEC Electronicssales representative for availability and additional information.

    MOS FIELD EFFECT TRANSISTOR

    2SK3918

    SWITCHING

    N-CHANNEL POWER MOS FET

    DATA SHEET

    Document No. D17077EJ3V0DS00 (3rd edition)Date Published January 2005 NS CP(K)

    Printed in Japan20

    The mark shows major revised points.

    ORDERING INFORMATION

    PART NUMBER PACKAGE

    2SK3918 TO-251 (MP-3)

    2SK3918-ZK TO-252 (MP-3ZK)

    DESCRIPTION

    The 2SK3918 is N-channel MOS FET device that

    features a low on-state resistance and excellent switching

    characteristics, and designed for low voltage high current

    applications such as DC/DC converter with synchronous

    rectifier.

    FEATURES

    Low on-state resistance

    RDS(on)1 = 7.5 m MAX. (VGS = 10 V, ID = 24 A)

    Low Ciss: Ciss = 1300 pF TYP.

    5 V drive available

    ABSOLUTE MAXIMUM RATINGS (TA = 25C)

    Drain to Source Voltage (VGS = 0 V) VDSS 25 V

    Gate to Source Voltage (VDS = 0 V) VGSS 20 V

    Drain Current (DC) (TC = 25C) ID(DC) 48 A

    Drain Current (pulse)Note1

    ID(pulse) 192 A

    Total Power Dissipation (TC = 25C) PT1 29 W

    Total Power Dissipation PT2 1.0 W

    Channel Temperature Tch 150 C

    Storage Temperature Tstg 55 to +150 C

    Single Avalanche CurrentNote2

    IAS 22 A

    Single Avalanche EnergyNote2

    EAS 48 mJ

    Notes 1. PW 10 s, Duty Cycle 1%

    2. Starting Tch = 25C, VDD = 12.5 V, RG = 25 , VGS = 20 0 V

    (TO-251)

    (TO-252)

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    Data Sheet D17077EJ3V0DS2

    2SK3918

    ELECTRICAL CHARACTERISTICS (TA = 25C)

    CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT

    Zero Gate Voltage Drain Current IDSS VDS = 25 V, VGS = 0 V 10 A

    Gate Leakage Current IGSS VGS = 20 V, VDS = 0 V 100 nA

    Gate Cut-off Voltage VGS(off) VDS = 10 V, ID = 1 mA 2.0 2.5 3.0 V

    Forward Transfer AdmittanceNote

    | yfs | VDS = 10 V, ID = 12 A 6 12 S

    RDS(on)1 VGS = 10 V, ID = 24 A 5.9 7.5 mDrain to Source On-state ResistanceNote

    RDS(on)2 VGS = 5.0 V, ID = 12 A 11 22.2 m

    Input Capacitance Ciss 1300 pF

    Output Capacitance Coss 310 pF

    Reverse Transfer Capacitance Crss

    VDS = 10 V

    VGS = 0 V

    f = 1 MHz220 pF

    Turn-on Delay Time td(on) 13 ns

    Rise Time tr 14 ns

    Turn-off Delay Time td(off) 38 ns

    Fall Time tf

    VDD = 12.5 V, ID = 24 A

    VGS = 10 V

    RG = 10

    14 ns

    Total Gate Charge QG 28 nC

    Gate to Source Charge QGS 5 nC

    Gate to Drain Charge QGD

    VDD = 20 V

    VGS = 10 V

    ID = 48 A10 nC

    Body Diode Forward VoltageNote

    VF(S-D) IF = 48 A, VGS = 0 V 0.98 V

    Reverse Recovery Time trr IF = 48 A, VGS = 0 V 27 ns

    Reverse Recovery Charge Qrr di/dt = 100 A/s 15 nC

    Note Pulsed

    TEST CIRCUIT 3 GATE CHARGE

    VGS = 20 0 V

    PG.

    RG = 25

    50

    D.U.T.L

    VDD

    TEST CIRCUIT 1 AVALANCHE CAPABILITY

    PG.

    D.U.T.

    RL

    VDD

    TEST CIRCUIT 2 SWITCHING TIME

    RG

    PG.

    IG = 2 mA

    50

    D.U.T.

    RL

    VDD

    IDVDD

    IASVDS

    BVDSS

    Starting Tch

    VGS

    0

    = 1 sDuty Cycle 1%

    VGSWave Form

    VDSWave Form

    VGS

    VDS

    10%0

    0

    90%

    90%

    90%

    VGS

    VDS

    ton toff

    td(on) tr td(off) tf

    10% 10%

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    Data Sheet D17077EJ3V0DS 3

    2SK3918

    TYPICAL CHARACTERISTICS (TA = 25C)

    DERATING FACTOR OF FORWARD BIASSAFE OPERATING AREA

    TOTAL POWER DISSIPATION vs.CASE TEMPERATURE

    dT-PercentageofRatedP

    ower-%

    0

    20

    40

    60

    80

    100

    120

    0 25 50 75 100 125 150 175

    TC - Case Temperature - C

    PT-TotalPowerDissipation-W

    0

    5

    10

    15

    20

    25

    30

    35

    0 25 50 75 100 125 150 175

    TC - Case Temperature - C

    FORWARD BIAS SAFE OPERATING AREA

    ID-DrainCurrent-A

    0.1

    1

    10

    100

    1000

    0.1 1 10 100

    PW = 100 s

    1 ms

    10 ms

    Power Dissipation Limited

    TC = 25C

    Single pulse

    ID(pulse)

    RDS(on) Limited

    (at VGS = 10 V)

    ID(DC)

    VDS - Drain to Source Voltage - V

    TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH

    rth(t)-TransientThermal

    Resistance-C/W

    0.01

    0.1

    1

    10

    100

    1000

    Rth(ch-A) = 125C/W

    Rth(ch-C) = 4.31C/W

    Single pulse

    PW - Pulse Width - s

    100 1 m 10 m 100 m 1 10 100 1000

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    Data Sheet D17077EJ3V0DS4

    2SK3918

    DRAIN CURRENT vs.DRAIN TO SOURCE VOLTAGE

    FORWARD TRANSFER CHARACTERISTICS

    ID-DrainCurrent-A

    0

    50

    100

    150

    200

    0 1 2 3

    VGS = 10 V

    Pulsed

    5.0 V

    VDS - Drain to Source Voltage - V

    ID-DrainCurrent-A

    0.01

    0.1

    1

    10

    100

    1000

    0 1 2 3 4 5 6

    Tch = 55C

    25C

    75C125C

    150C

    VDS = 10 V

    Pulsed

    VGS - Gate to Source Voltage - V

    GATE CUT-OFF VOLTAGE vs.CHANNEL TEMPERATURE FORWARD TRANSFER ADMITTANCE vs.DRAIN CURRENT

    VGS(off)-GateCut-offVoltage-V

    0

    1

    2

    3

    4

    -100 -50 0 50 100 150 200

    VDS = 10 V

    ID = 1 mA

    Tch - Channel Temperature - C

    |yfs|-ForwardTransferAdmittance-S

    0.1

    1

    10

    100

    0.1 1 10 100

    VDS = 10 V

    Pulsed

    Tch = 55C

    25C

    75C

    125C

    150C

    ID - Drain Current - A

    DRAIN TO SOURCE ON-STATE RESISTANCE vs.DRAIN CURRENT

    DRAIN TO SOURCE ON-STATE RESISTANCE vs.GATE TO SOURCE VOLTAGE

    RDS(on)-DraintoSourceOn-stateResistance-m

    0

    5

    10

    15

    20

    1 10 100 1000

    10 V

    Pulsed

    VGS = 5.0 V

    ID - Drain Current - A

    RDS(on)-DraintoSourceOn-stateResistance-m

    0

    5

    10

    15

    0 5 10 15 20

    Pulsed

    ID = 24 A

    VGS - Gate to Source Voltage - V

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    Data Sheet D17077EJ3V0DS 5

    2SK3918

    DRAIN TO SOURCE ON-STATE RESISTANCE vs.CHANNEL TEMPERATURE

    CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE

    RDS(on)-DraintoSourceOn-stateResistance-m

    0

    5

    10

    15

    -100 -50 0 50 100 150 200

    ID = 24 A

    Pulsed

    VGS = 10 V

    Tch - Channel Temperature - C

    Ciss,Coss,Crss-Capacitance-pF

    100

    1000

    10000

    0.01 0.1 1 10 100

    VGS = 0 V

    f = 1 MHz

    Ciss

    Coss

    Crss

    VDS - Drain to Source Voltage - V

    SWITCHING CHARACTERISTICS DYNAMIC INPUT/OUTPUT CHARACTERISTICS

    td(on),tr,td(off),tf-SwitchingTime-ns

    1

    10

    100

    1000

    0.1 1 10 100

    tr

    td(off)

    td(on)

    tf

    VDD =12.5 V

    VGS = 10 V

    RG = 10

    ID - Drain Current - A

    VDS-DraintoSourceVoltage-V

    0

    5

    10

    15

    20

    25

    30

    0 10 20 300

    2

    4

    6

    8

    10

    12

    VDS

    VDD = 20 V

    12.5 V

    5 V

    ID = 48 A, 42 A (at VDD = 5 V)

    VGS

    QG - Gate Charge - nC

    VGS-GatetoSourceVoltage-V

    SOURCE TO DRAIN DIODE FORWARD VOLTAGE REVERSE RECOVERY TIME vs.DIODE FORWARD CURRENT

    IF-DiodeForw

    ardCurrent-A

    0.01

    0.1

    1

    10

    100

    1000

    0 0.5 1 1.5

    VGS = 10 V

    0 V

    Pulsed

    VF(S-D) - Source to Drain Voltage - V

    trr-ReverseRecoveryTime-ns

    1

    10

    100

    1000

    1 10 100

    di/dt = 100 A/s

    VGS = 0 V

    IF - Diode Forward Current - A

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    2SK3918

    The information in this document is current as of January, 2005. The information is subject to

    change without notice. For actual design-in, refer to the latest publications of NEC Electronics data

    sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not

    all products and/or types are available in every country. Please check with an NEC Electronics sales

    representative for availability and additional information.

    No part of this document may be copied or reproduced in any form or by any means without the prior

    written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may

    appear in this document.

    NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual

    property rights of third parties by or arising from the use of NEC Electronics products listed in this document

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    granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.

    Descriptions of circuits, software and other related information in this document are provided for illustrative

    purposes in semiconductor product operation and application examples. The incorporation of these

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    M8E 02. 11-1