3d circuitry on thermoplastics creating molded …...3d circuitry on thermoplastics creating molded...
TRANSCRIPT
1 © 2013
3D Circuitry on Thermoplastics Creating Molded Interconnect Devices with Laser Direct Structuring
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Shane Stafford Creative Marketing Specialist LPKF Laser & Electronics North America Stephan Schmidt President LPKF Laser & Electronics North America Don Porter Global Account Manager LPKF Laser & Electronics North America
Our presenters
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Questions
• Submit questions via…
- Your GoTo Webinar panel - Twitter: @LPKF_USA
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What’s on slate for today
1. The rise, fall, and rise of MIDs
2. MID manufacturing methods
3. An analysis of the laser direct structuring process
4. Applications
5. Next steps
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Molded Interconnect Device (MID)
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Circuit board Housing Connector Cable
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MID features
• Fewer components/parts
• Saves space, reduces weight,
lowers cost • 3D workspace opens up design
possibilities
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MID history
• Broke onto the scene in the 1980s
• Despite early fanfare, didn’t catch
on - High threshold for entry
• In recent years, demand for MIDs
has picked up - Miniaturization - New methods lower threshold
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MID apps
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What’s important about MIDs? • Stephan: 3D workspace
• Don: Reducing components
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Common MID manufacturing methods
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Method Parts Moldings App. size Circuit design Manufacturing volume
Two-shot molding
- 1 platable plastic part, 1 non-platable plastic part
- Complex - Large - Medium
- Tied to molding of part - Ideal for simple designs
- Large batch
Laser direct structuring
- 1 platable plastic part - Simple - Medium - Small - Micro
- Independent of molding - Ideal for complex designs
- Large batch - Small batch - Prototyping
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What is laser direct structuring (LDS)?
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• 3-step physiochemical process for
creating 3D circuitry on MIDs
1. Injection molding 2. Laser activation 3. Metallization
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Injection Molding
• 1-shot injection molding of doped
thermoplastics
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Result - Injection Molding
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Laser activation
• Physiochemical reaction etches the
wiring pattern on the plastic and prepares material for selective metallization
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Laser activation
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Laser radiation
Metal Nitrogen Oxygen
polymer + metal-organic complex
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metal seeds
polymer + metallorganic complex
Laser activation
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organic ligands
metal atom
Metal Nitrogen Oxygen
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Laser activation
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Micro-etched, laser activated surface
Smooth, unactivated surface
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Animation
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Result - Laser Activation
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Metallization
• Electroless copper plating
- Metallization only in the laser activated areas
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Metallization
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Immersion Au 0.1µm
Ni 3 µm
Cu 5 µm
Modified polymer
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Result - Selective Metallization
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Applications
• Telecommunications
- You probably have an LDS antenna in your pocket right now!
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Applications
• Automotive
- Steering wheel
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Applications
• Automotive
- Motorcycle handlebar
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Applications
• Automotive
- Motorcycle handlebar
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Applications
• Medical
- Hearing aids
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Applications
• Security
- Drill shield
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Applications
• Fine pitch capabilities
- 6 mil trace/6 mil space or smaller
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Applications
• RFID
- Transponder
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• Sensors
- Pressure sensor
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Source: VTI Oy
Applications
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Why should you consider MIDs?
• Fewer components
• Lighter parts • 3D workspace/design versatility
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Why should you consider LDS?
• Ideal for high mix manufacturing
environments • Complex circuitry
• Cost-effective entry into the world of
MIDs
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Where to go from here?
If you’re interested in laser direct structuring… We can help you… • Find an LDS service provider
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Where to go from here?
Or… • Start working with LDS yourself
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LPKF Laser & Electronics · 503-454-4219
www.lpkfusa.com · [email protected]
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Thank you for your attention!
LPKF Laser & Electronics · 503-454-4208 www.lpkfusa.com · [email protected]