3d componentpackaging at&s company in organicsubstrate ......presentation 3d componentpackaging...

www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | Fax +43 (0) 3842 200-216 | E-mail [email protected]

www.ats.net

AT&S Company Presentation

3D Component Packagingin Organic Substrate

Embedded Component

Mark BeesleyIPC Apex 2012, San Diego

� Introduction

� Embedded Component Technology

� Process capability – feature size

� Application examples

� Highlights

ThemesThemesThemesThemes

3D Component Packaging in Organic Substrate | Mark Beesley, AT&S | IPC Apex, San Diego 2012

Why Embedded Component?

Embedded Component is an interconnect-basedsolution that drives Miniaturization; Mobility and

Sustainability


WhatWhatWhatWhat isisisis EEEEmbedded mbedded mbedded mbedded ComponentComponentComponentComponent????

Embedding uses the space within a substrate foractive and passive components

Main providers of embedded component technology– Europe; Japan; Taiwan; Korea


HERMESHERMESHERMESHERMES

Largest EU funded project focussed on INDUSTRIALISATION – AT&S consortiumleader; 11 partners – driving Embedded Component technology

Embedded Embedded Embedded Embedded ComponentComponentComponentComponent ---- PrinciplePrinciplePrinciplePrinciple benefitsbenefitsbenefitsbenefits

SmartphoneTablet

Medical

Automotive

Security applications

Sensor

Aerospace/space

Data Storage


Wireless

ProductProductProductProduct familiesfamiliesfamiliesfamilies ---- Embedded Embedded Embedded Embedded ComponentComponentComponentComponent

6

SiBSystem in Board

_________________

SiPEmbedded

Component System in Package

_________________

MODULE technology

Embedded actives + passives + SMD

Mainboard technology

Embedded passives –resistors, capacitors, diodes, inductors …


�� Relative Market Demand ��

� Introduction




� Highlights



Laser- Drillingof fiducials + overlay

Dielectric Printing

Assembly

Layup & Pressing

Desmearing

Laser Drilling

Component

Mechanical Drilling

Imaging

Copper plating

Stripping + Etching

Automatic Inspection

Metallization

Onward Processing – Organic Substrate

ComponentPre-process

ProcessProcessProcessProcess OverviewOverviewOverviewOverview


Embedded uses the largest production format size of any packaging technique

Even with the advent of 18” super wafer and wafer level packaging concepts, panel packaging has a huge advantage

21” x 24” panel~ 504sqin

ECP Gen 2

18” x 24” panel~ 432sqin

ECP

18” wafer~ 254sqin

12” wafer~ 113sqin8” wafer

~ 50sqin

6” wafer~ 28sqin

Shown approximately to scale

8” strip~ 24sqin

Panel Panel Panel Panel sizesizesizesize


Wafer-based embeddables

� Pad finish: Cu plating needed for contacting with microvias = existingprocess for WLP components

� Pad pitch: adaptation to organicsubstrate design rule through RDL

� Wafer thinning: 100-150µm

Embedded Embedded Embedded Embedded ComponentComponentComponentComponent requirementsrequirementsrequirementsrequirements

Passive discrete components

� Use of thin components with copperterminations

� Capacitors and resistors available

� Other discretes (inductors) also in development

� Component thickness 100µm – 220µm

� Case sizes 0201; 0402; above


� 2µm primer-coated copper foil

� Low copper roughness RA < 1µm – high “etchability”

� High copper peel strength after multiple reflow cycle – supports fine-line fan out

� Easy handling - copper carrier

CopperCopperCopperCopper foilfoilfoilfoil

Image of continuous copper foil process line, source HERMES consortium


DielectricDielectricDielectricDielectric printingprintingprintingprinting

Printing of controlled dielectric under embedded device

Key outcome – void-free, feature size, shape and volume

� Novel 3D scanner for large panels

� Determines the thickness and uniformity of the dielectric

Dielectric screen printing using optically alignedequipment in cleanroom environment


ComponentComponentComponentComponent alignmentalignmentalignmentalignment

Optical alignment of copper plated component

� High resolution camera

� Pattern recognition of pad design

Design

� Pad diameter: 150µm

� Pitch: 175µm

� Chip size: 7 x 7 mm


ComponentComponentComponentComponent AssemblyAssemblyAssemblyAssembly

Screenshot showing multiple embeddeddevice types in one layer

� High speed component placement equipment

� Large production formats

� Fully flexible equipment

� Accuracy c.a. 10µm true position placement

� Ability to integrate different component types in one package


CopperCopperCopperCopper PlatingPlatingPlatingPlating

Semi-additive technology – single board processing

� Control of parameters for each panel

� Handling of thin panels

� Unique flow system

� Pulse plating for via filling

� Full traceability of process data

� Single piece flow for improved

� Flexibility

� Risk management


1) 0402 resistor, capacitor2) 0402 resistor3) Active component4) 0402 resistor

1

2 3

4

What it looks like … #1What it looks like … #1What it looks like … #1What it looks like … #1


What it looks like … #2What it looks like … #2What it looks like … #2What it looks like … #2


Minimum SYSTEM footprintthrough 3D STACKING

Embedded SiP/SiB

WhatWhatWhatWhat itititit lookslookslookslooks likelikelikelike … #3… #3… #3… #3


� Introduction




� Highlights



Design Design Design Design RuleRuleRuleRule evolutionevolutionevolutionevolution

Design Rule When Volume Line / space(µm)

Componentpad (µm)

Minimumpitch (µm)

Comp toComp(µm)

ECP® Corethicknessover Cu

(µm)

V1 NOWSeries 50 / 50 200 250 200 250

Proto 25 / 25 150 175 200 200

V2 IndustrialisationSeries 25 / 25 150 175 200 200

Proto 20 / 20 130 150 200 160

V2.1 DevelopmentSeries 20 / 20 130 150 100 160

Proto 15 / 15 110 125 100 130

V3 ResearchSeries 15 / 15 110 125 100 130

Proto 10 / 10 90 100 100 100

V4 ResearchSeries 10 / 10 90 100 100 100

Proto < 10 / 10 < 75 < 85 < 75 < 75


As complexity evolves – yield must be maintained at close to 100% due to device impact on cost of scrap

� Introduction




� Highlights



Embedded RFID

Chip: 400µm □

Via: 50µm Ø

ValueValueValueValue addedaddedaddedadded = System in Board= System in Board= System in Board= System in Board


Multiple devices can beembedded in a PCB

Passive devices can be assembled on an inner layer in the PCB ….

Results ��

� High performance – short, low resistance copper connections

� Smallest PCB form factor – integrated design

� Secure against reverse engineering

� Integrated RFID - a “trace-able” PCB – from first process to “in the field”

� Industrial application

� 4 embedded MOSFETs with double side interconnection

� Logic devices and passives mounted on top

� 50µm dielectric thickness− Reduction of thermal resistance

− High breakdown voltage

− 50% footprint reduction

1000µm

Industrial Power ModuleIndustrial Power ModuleIndustrial Power ModuleIndustrial Power Module


� High end automotive application

� Embedded processor - 416 I/O

� Stacked copper filled via

� 25µm line/space on all layers

� Active and passive SMDs

� 3D routing from front to back

EngineEngineEngineEngine ControlControlControlControl ModuleModuleModuleModule

Fanout over embedded processor usingorganic substrate redistribution


DigitalDigitalDigitalDigital AmplifierAmplifierAmplifierAmplifier

� Parasitics affecting battery life and audio quality due to long wire-bond connections

� Solution = Embed digital audio amplifier -eliminate wire-bonding

� Maximum output power: 50 W

� 4 layer construction

� Prototype level

� Device pad pitch = 100µm (no RDL)


Application Package Size

X,Y Reduction

Package concept

Embedded Component advantage

Voltage Convertor 7mm2 40%Smallest footprint 600mA DC DCconvertor on the Market

Charge Management 20mm2 40%Stacked silicon package for advancedLi-ion battery charge management

Media module 20mm2 30%Integrated module – discrete passivesstacked on eWLP

Silicon microphone 5mm2 > 50%Superior performance MEMS withsmallest form factor

Mobile TV 20mm2 50%Single device solution for mobile TV tuner

Identification 60mm2 New feature Integrated biometric sensing

Position sensor 60mm2 50%High accuracy Hall effect sensor –advanced micro joystick application

Wireless module 20mm2 40%Stacked package for smallest footprintsolution

RampingRampingRampingRamping Smartphone Smartphone Smartphone Smartphone ApplicationsApplicationsApplicationsApplications


� Introduction




� Highlights



� Embedded component (can) dramatically reduce Package and PCB form factor – attractive to smartphone; tablet; medical; mobile device segments

� Other technology benefits include performance upgrade; reliability; integrated (modular) product --- further Market ramps expected

� The technology is thrusting in to commercialisation due to capacityavailability AND leverage of existing technologies (WLP; SMT; etc)

� Design automation is available from the mainstream providers

� Supply chain is not optimised – but big strides are being made and initialproducts launched because benefits outweigh disadvantages …

� For sure a technology to watch in 2012!

HighlightsHighlightsHighlightsHighlights


www.ats.net Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | Fax +43 (0) 3842 200-216 | E-mail [email protected]

www.ats.net

AT&S Company Presentation

Thank you for your attention!

Mark Beesley - COO Advanced Packaging, AT&S

3D Laminate Component Packaging

@ATS_ECP

e-mail [email protected]

cell +43 676 8955 5669

web ecp.ats.net

3d componentpackaging at&s company in organicsubstrate ......presentation 3d componentpackaging...

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