4._12001230_0_3d ic si interposer_semicon taiwan 2011

8/3/2019 4._12001230_0_3D IC Si Interposer_Semicon Taiwan 2011

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3D-IC Si Interposer

LED

[email protected]


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20202020


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PVPVPVPVSEMI & LEDSEMI & LEDSEMI & LEDSEMI & LED PRINTING & SHOEPRINTING & SHOEPRINTING & SHOEPRINTING & SHOE

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(VOC) &


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c sunc sunc sunc sun


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Outline:

LED Introduction

LED Applications

Challenges for SSL: Brightness and Thermal Management

Wafer Level Package Solutions for LED Si Submount


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1. LED Introduction


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1. LED Introduction


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CIE1931

RGB Color modelSource: Wikipedia

1. LED Introduction


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2. LED Applications-


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2. LED Applications- 3C


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2. LED Applications


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2. LED Applications-


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3. Challenges for SSL LED Manufacturing , Overall Performance

Source: Yole Development


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2. LED Applications LED Market Forecast , by LED type (packaged LEDs)


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2. LED Applications Sales revenue of packaged LED to 2020, split by type



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Source: DOE Manufacturing Workshop consensus

2. LED Applications Projected LED Luminaire Cost Track


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Source: Proceedings of the IEEE, August 2009

3. Challenges for SSL LED Manufacturing , Overall Performance


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3. Challenges for SSL Overall LED Efficiency



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3. Challenges for SSL Manufacturing challenges

THERMAL

Package thermalresistance

must be


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THERMAL


must be


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LED

1., ~90%;,~10-20%

2., light extractiona. Substrate material

b. Geometrically deformed

c. Light scattering and Diffraction

( )

:

:

:

:

:

,

,efficiencyPlug-Wall;,efficiencyRadiant

opt

rad

inj

v

ext

voptradinj

vextwp

wpR

=

=

=

.

.

,(2006)


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35.45GaN SiO2

54.55SiO2 Sapphire

32.68ITO Air

47.73GaN ITO

23.58GaN Air

45.4GaN Sapphire

34.18Sapphire Air

The critical angle between various kinds of materials

1.451.852.51.781Refractive

Index (n)

SiO2ITOGaNSapphir

eAirMaterials

LED - Refraction

Phys. Stat. Sol.(b) Vol. 277, No.1, 1-43, (2001)

,

(2008)


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Depth>for light scattering and diffraction

GaNofR.I.isn;n4

1

PSSscattering and diffraction


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9.3 E8 cm-2 4.5 E8 cm-2

,(2007)

PSSGaNdislocation top view


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PSS

Wafer start PR coating Exposure Dry etchingDeveloping


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c sunMask Aligner for PSS PR Profile

Contact mode

PR profile

Proximity mode

PR profile


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A facet will develop,=m

Brian N. Chapman, Glow Discharge Processessputtering and plasma etching, John Wiley & Sons, Inc.,1980,

PSS profile angle


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Contact mode

Etched profile

c sunICP for PSS dry etching result

Proximity mode

Etched profile


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Electrical

Input power

5WCurrent 1.5A

Optical

100-150 lm/W

Encapsulation

No shrink

CostPhosphor

Epoxy

Heat Sink

EPI

Wafer processes

Substrate

THERMAL


must be


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4. Solutions Package


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4. Solutions Flip chip

Air PCB MCPCB Epoxy Al2O3Solder

(80%Au-20%Sn)

Si AlN Al 6061 Cu

Thermalconductivity

(W/m-K)

0.024 0.36 2 2.2 28 57 130 160 160 385


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Q is the heat flowing from hot to cold, through the LED

Tj is the junction temperature in the device

Tc is the temperature at its case

Th is the temperature where the heat sink is attached

Tamb is the ambient air temperature

Rjc is the device's thermal resistance from junction to caseRch is the thermal resistance from the case to the heat sinkR

ha is the thermal resistance of the heat sink

)(

)(

44

=

=

=

TTAQ

TThAQ

dX

dTkAQ

sradiation

sconvection

conduction

heatfor;Q

)T(TR

yx

xy

=

efor;I

VR =

hachjcja RRRR ++=

Summation of Series Thermal Resistances:

4. Solutions Theory Single chip in one package


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jhnjh2jh1jh R

1....

R

1

R

1

R

1+++=

Summation of Parallel Thermal Resistances:

4. Solutions Theory Multi chips in one package


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Heat flow

TIM poor xy thermalconductivity (0.3W/m-K)

TIM good xy thermalconductivity (3 W/m-K)

4. Solutions Theory


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4. Solutions Wafer Level Packaging


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S l i W f L l P k i


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4 S l ti C SUN W f L l P k i S l ti f LED Si S b t


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4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount

WVL-M12WVL-A8/A12

4 S l ti C SUN W f L l P k i S l ti f LED Si S b t


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DryFilm

Wafer

Roller Laminator Vacuum laminator

Dry

Film

Roller

Wafer

Air bag


4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount


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66.538um

21.257um

Dry Film : DuPont PerMX 3050

Equipment:CSUN WVL-M12


4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount


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Lens

Phosphor

LED Die

Interposer

Spacer

PerMX7000 Series Epoxy PermanentDFR

Back Side Heat Sink ModuleWBR2000 Series Thick DFR for CuPlatingEKC162/265 Stripper / Cleaner

Reflecting MaterialWBR2000 Series Electroless Ag Plating*Reflective PasteWB3000 Series Lift-off Process

RDLWLP1000 Series Ultra-high ResolutionCu/Ni/Au PlatingEKC162/265 Stripper / Cleaner

TSVWLP1000 Series DRIE Process

EKC162/265 Stripper / CleanerPassivation

WPR1000 Series

UBM / Solder Bump

WLP1000 Series Ultra-high Resolution

EU/LF/Pillar Plating


Example of c sunDF Laminator,ADRIE TSV process and Du Pont DFRfor LED Si Submount

4 Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:


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Etching-through DRIE Si Via

fabricated by c sunADRIE moduleand Du Pont WLP1020, with highetching selectivity (DFR/Si=1/115).

4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:a. TSV formation



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Selective plated Cu/Ni/Ag layer withTSV structure through applying DuPont WLP1050 DFR and EKC162stripping chemical.

Seed Layer Sputtering

Double Sides DFR

Cu/Ni/Au or Ag Electroplating

Stripping and Seed Layer Etching

InterposerInterposer

InterposerInterposerInterposer



4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:b. Selective Plating



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WB3075 Lift-Off process

Double Sides DFR

Ti/Al Sputtering

Stripping and Lift-off

Residual Metal Film

Lift-off Part


DFR


DFR


4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:c. Lift-Off Reflection Layer

4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:


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Ultra-thick DFR Lamination

Photo Process for Pattern Define



4. Solutions C SUN Wafer Level Packaging Solution for LED Si Submount:d. Spacer


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Cost Effective Solutions from C SUN:

1. PSS Turn key for light extraction:a. Mask Aligner

b. ICP Etcher

2. WLP with Si Interposer for thermal management:a. Si DRIE Etcherb. DF roller and vacuum type laminator


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Thank You

4._12001230_0_3d ic si interposer_semicon taiwan 2011

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