450 na, 9 khz op amp - microchip technologyww1.microchip.com/downloads/en/devicedoc/22257c.pdf ·...

MCP6441/2/4450 nA, 9 kHz Op Amp

Features:• Low Quiescent Current: 450 nA (typical)• Gain Bandwidth Product: 9 kHz (typical)• Supply Voltage Range: 1.4V to 6.0V• Rail-to-Rail Input and Output• Unity Gain Stable• Slew Rate: 3V/ms (typical)• Extended Temperature Range: -40°C to +125°C• No Phase Reversal• Small Packages

Applications:• Portable Equipment• Battery Powered System• Data Acquisition Equipment• Sensor Conditioning• Battery Current Sensing• Analog Active Filters

Design Aids:• SPICE Macro Models • FilterLab® Software• Microchip Advanced Part Selector (MAPS)• Analog Demonstration and Evaluation Boards• Application Notes

Description:The MCP6441/2/4 device is a single nanopoweroperational amplifier (op amp), which has lowquiescent current (450 nA, typical) and rail-to-rail inputand output operation. This op amp is unity gain stableand has a gain bandwidth product of 9 kHz (typical).These devices operate with a single supply voltage aslow as 1.4V. These features make the family of opamps well suited for single-supply, battery-poweredapplications.

The MCP6441/2/4 op amp is designed with Microchip’sadvanced CMOS process and offered in single(MCP6441), dual (MCP6442), and quad (MCP6444)configurations. All devices are available in theextended temperature range, with a power supplyrange of 1.4V to 6.0V.

Typical Application

Package Types

VDD

IDD

100 kΩ

1 MΩ

1.4VVOUT

Battery Current Sensing

10Ωto6.0V

IDDVDD VOUT–

10 V/V( ) 10Ω( )⋅------------------------------------------=

To load

MCP6441

5

4

123

VDD

VIN–VIN+VSS

VOUT

MCP6441SC70-5, SOT-23-5

5

123

VDD

VIN–VIN+VSS

VOUTA

MCP6442SOIC, MSOP

MCP6444SOIC, TSSOP

8 76

VOUTB

4 VINB+

VINA–

5

123

VDD

VIND+VIN+VSS

VOUTA

8 76

VOUTC

4VINB+

VINA–

9 10

14

12 11

13

VINB–VOUTB

VINC–VINC+

VIND–VOUTD

MCP64422x3 TDFN *

VIN+VIN–

VSS

VOUTBVINB–

1

234

8

765 VINB+

VDDVOUTA

EP9

* Includes Exposed Thermal Pad (EP); see Table 3-1.

© 2010-2012 Microchip Technology Inc. DS22257C-page 1

MCP6441/2/4
NOTES:
DS22257C-page 2 © 2010-2012 Microchip Technology Inc.

MCP6441/2/4

1.0 ELECTRICAL CHARACTERISTICS

1.1 Absolute Maximum Ratings †VDD – VSS ........................................................................7.0VCurrent at Input Pins .....................................................±2 mAAnalog Inputs (VIN+, VIN-)†† .......... VSS – 1.0V to VDD + 1.0VAll Other Inputs and Outputs ......... VSS – 0.3V to VDD + 0.3VDifference Input Voltage ...................................... |VDD – VSS|Output Short-Circuit Current ................................ContinuousCurrent at Output and Supply Pins ............................±30 mAStorage Temperature ....................................-65°C to +150°CMaximum Junction Temperature (TJ) .......................... +150°CESD Protection on All Pins (HBM; MM) ............... ≥ 4 kV; 200V

† Notice: Stresses above those listed under “AbsoluteMaximum Ratings” may cause permanent damage tothe device. This is a stress rating only and functionaloperation of the device at those or any other conditionsabove those indicated in the operational listings of thisspecification is not implied. Exposure to maximum rat-ing conditions for extended periods may affect devicereliability.†† See Section 4.1.2 “Input Voltage Limits”.

DC ELECTRICAL SPECIFICATIONSElectrical Characteristics: Unless otherwise indicated, VDD = +1.4V to +6.0V, VSS= GND, TA= +25°C, VCM = VDD/2,VOUT ≈ VDD/2, VL = VDD/2 and RL = 1 MΩ to VL. (Refer to Figure 1-1).

Parameters Sym Min Typ Max Units Conditions

Input OffsetInput Offset Voltage VOS -4.5 — +4.5 mV VCM = VSSInput Offset Drift with Temperature ΔVOS/ΔTA — ±2.5 — µV/°C TA= -40°C to +125°C,

VCM = VSSPower Supply Rejection Ratio PSRR 65 86 — dB VCM = VSSInput Bias Current and ImpedanceInput Bias Current IB — ±1 — pA

— 20 — pA TA = +85°C— 400 — pA TA = +125°C

Input Offset Current IOS — ±1 — pACommon Mode Input Impedance ZCM — 1013||6 — Ω||pFDifferential Input Impedance ZDIFF — 1013||6 — Ω||pFCommon ModeCommon Mode Input Voltage Range VCMR VSS-0.3 — VDD+0.3 VCommon Mode Rejection Ratio CMRR 60 76 — dB VCM = -0.3V to 6.3V,

VDD = 6.0VOpen-Loop GainDC Open-Loop Gain(Large Signal)

AOL 90 110 — dB VOUT = 0.1V to VDD-0.1VRL = 10 kΩ to VL

OutputMaximum Output Voltage Swing VOL, VOH VSS+20 — VDD–20 mV VDD = 6.0V, RL = 10 kΩ

0.5V input overdriveOutput Short-Circuit Current ISC — ±3 — mA VDD = 1.4V

— ±22 — mA VDD = 6.0VPower SupplySupply Voltage VDD 1.4 — 6.0 VQuiescent Current per Amplifier IQ 250 450 650 nA IO = 0, VDD = 5.0V


MCP6441/2/4

1.2 Test CircuitsThe circuit used for most DC and AC tests is shown inFigure 1-1. This circuit can independently set VCM andVOUT (see Equation 1-1). Note that VCM is not thecircuit’s Common Mode voltage ((VP + VM)/2), and thatVOST includes VOS plus the effects (on the input offseterror, VOST) of the temperature, CMRR, PSRR andAOL.

EQUATION 1-1:

FIGURE 1-1: AC and DC Test Circuit for Most Specifications.

AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF. (Refer to Figure 1-1).


AC ResponseGain Bandwidth Product GBWP — 9 — kHzPhase Margin PM — 65 — ° G = +1 V/VSlew Rate SR — 3 — V/msNoiseInput Noise Voltage Eni — 5 — µVp-p f = 0.1 Hz to 10 HzInput Noise Voltage Density eni — 190 — nV/√Hz f = 1 kHzInput Noise Current Density ini — 0.6 — fA/√Hz f = 1 kHz

TEMPERATURE SPECIFICATIONSElectrical Characteristics: Unless otherwise indicated, VDD = +1.4V to +6.0V and VSS = GND.


Temperature RangesOperating Temperature Range TA -40 — +125 °C Note 1Storage Temperature Range TA -65 — +150 °CThermal Package ResistancesThermal Resistance, 5L-SC70 θJA — 331 — °C/WThermal Resistance, 5L-SOT-23 θJA — 220.7 — °C/WThermal Resistance, 8L-MSOP θJA — 211 — °C/WThermal Resistance, 8L-SOIC θJA — 149.5 — °C/WThermal Resistance, 8L-2x3 TDFN θJA — 52.5 — °C/WThermal Resistance, 14L-SOIC θJA — 95.3 — °C/WThermal Resistance, 14L-TSSOP θJA — 100 — °C/WNote 1: The internal junction temperature (TJ) must not exceed the absolute maximum specification of +150°C.

GDM RF RG⁄=VCM VP VDD 2⁄+( ) 2⁄=

VOUT VDD 2⁄( ) VP VM–( ) VOST 1 GDM+( )+ +=Where:

GDM = Differential Mode Gain (V/V)VCM = Op Amp’s Common Mode

Input Voltage(V)

VOST = Op Amp’s Total Input Offset Voltage (mV)

VOST VIN– VIN+–=

VDD

RG RF

VOUTVM

CB2

CLRL

VL

CB1

100 kΩ100 kΩ

RG RF

VDD/2VP

100 kΩ100 kΩ

60 pF1 MΩ

1 µF100 nF

VIN–

VIN+

CF6.8 pF

CF6.8 pF

MCP6441


MCP6441/2/4

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF.

FIGURE 2-1: Input Offset Voltage.

FIGURE 2-2: Input Offset Voltage Drift.

FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V.

FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V.

FIGURE 2-5: Input Offset Voltage vs. Output Voltage.

FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0%

5%

10%

15%

20%

25%

30%

35%

-4.5

-3.5

-2.5

-1.5

-0.5 0.5

1.5

2.5

3.5

4.5

Input Offset Voltage (mV)

Perc

enta

ge o

f Occ

uren

ces

1700 SamplesVCM = VSS

0%

5%

10%

15%

20%

25%

30%

-10 -8 -6 -4 -2 0 2 4 6 8 10

Input Offset Voltage Drift (µV/°C)

Perc

enta

ge o

f Occ

uren

ces 1700 Samples

VCM = VSSTA = -40°C to +125°C

-500

0

500

1000

1500

2000

2500

3000

-0.5 0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

Common Mode Input Voltage (V)

Inpu

t Offs

et V

olta

ge (µ

V) VDD = 6.0VRepresentative Part

TA = +125°CTA = +85°CTA = +25°CTA = -40°C

-5000

5001000150020002500300035004000

-0.3

-0.1 0.1

0.3

0.5

0.7

0.9

1.1

1.3

1.5

1.7

Common mode input voltage (V)

Inpu

t Offs

et V

olta

ge (µ

V)

VDD = 1.4VRepresentative PartTA = +125°C

TA = +85°CTA = +25°CTA = -40°C

-1000-800-600-400-200

0200400600800

1000

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

Output Voltage (V)

Inpu

t Offs

et V

olta

ge (µ

V)

VDD = 6.0V

VDD = 1.4V

Representative Part

-2000-1600-1200-800-400

0400800

120016002000

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

Power Supply Voltage (V)

Inpu

t Offs

et V

olta

ge (µ

V) Representative PartTA = +125°CTA = +85°CTA = +25°CTA = -40°C


MCP6441/2/4
FIGURE 2-7: Input Noise Voltage Density vs. Frequency.

FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage.

FIGURE 2-9: CMRR, PSRR vs. Frequency.

FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature.

FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature.

FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage.

100

1,000

0.1 1 10 100 1000 10000Frequency (Hz)

Inpu

t Noi

se V

olta

ge D

ensi

ty

(nV/

Hz)

0.1 1 10 100 1k 10k

0

50

100

150

200

250

300

350

-0.5 0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5


Inpu

t Noi

se V

olta

ge D

ensi

ty

(nV/

Hz)

f = 1 kHzVDD = 6.0 V

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000Frequency (Hz)

CM

RR

, PSR

R (d

B)

CMRR

PSRR-

PSRR+

c

Representative Part

50556065707580859095

100

-50 -25 0 25 50 75 100 125Ambient Temperature (°C)

CM

RR

,PSR

R (d

B)

PSRR (VDD = 1.4V to 6.0V, VCM = VSS)

CMRR (VDD = 6.0V, VCM = -0.3V to 6.3V)

CMRR (VDD = 1.4V, VCM = -0.3V to 1.7V)

1

10

100

1000

25 45 65 85 105 125Ambient Temperature (°C)

Inpu

t Bia

s an

d O

ffset

Cur

rent

s (p

A)

Input Bias Current

VDD = 6.0V

Input Offset Current

1

10

100

1000

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0


Inpu

t Bia

s C

urre

nt (p

A)

VDD = 6.0V

TA = +125°C

TA = +85°C


MCP6441/2/4
FIGURE 2-13: Quiescent Current vs. Ambient Temperature.

FIGURE 2-14: Quiescent Current vs. Power Supply Voltage.

FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency.

FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage.

FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom.

FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.

200

250

300

350

400

450

500

550

600


Qui

esce

nt C

urre

nt

(nA

/Am

plifi

er)

VDD = 6.0V

VDD = 1.4V

0

100

200

300

400

500

600

700

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

7.0


Qui

esce

nt C

urre

nt

(nA

/Am

plifi

er)

TA = +125°CTA = +85°CTA = +25°CTA = -40°C

-20

0

20

40

60

80

100

120

1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05

Frequency (Hz)

Ope

n-Lo

op G

ain

(dB

)

-210

-180

-150

-120

-90

-60

-30

0

Ope

n-Lo

op P

hase

(°)

Open-Loop Gain

Open-Loop Phase

VDD = 6.0V

1m 10m 0.1 1 10 100 1k 10k 100k

60

70

80

90

100

110

120

130

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0


DC

Ope

n-Lo

op G

ain

(dB

)

RL = 10 kΩVSS + 0.1V < VOUT < VDD - 0.1V

120

130

B) VDD = 6.0V

110

120

ain

(dB DD

100

oop

Ga

VDD = 1.4V

80

90O

pen-

Lo

L Si l A70D

CO

RL = 10k

Large Signal AOL

600.00 0.05 0.10 0.15 0.20 0.25

02468

1012141618


Gai

n B

andw

idth

Pro

duct

(k

Hz)

0102030405060708090

Phas

e M

argi

n (°

)Gain Bandwidth Product

Phase Margin

VDD = 6.0V


MCP6441/2/4
FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature.

FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage.

FIGURE 2-21: Output Voltage Swing vs. Frequency.

FIGURE 2-22: Output Voltage Headroom vs. Output Current.

FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature.

FIGURE 2-24: Slew Rate vs. Ambient Temperature.

02468

1012141618


Gai

n B

andw

idth

Pro

duct

(k

Hz)

0102030405060708090

Phas

e M

argi

n (°

)

Gain Bandwidth Product

Phase Margin

VDD = 1.4V

0

5

10

15

20

25

30

35

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0


Out

put S

hort

Circ

uit C

urre

nt

(mA

)

TA = -40°CTA = +25°CTA = +85°CTA = +125°C

0.1

1

10

10 100 1000 10000Frequency (Hz)

Out

put V

olta

ge S

win

g (V

P-P)

VDD = 1.4V

VDD = 6.0V

10 100 1k 10k

0.1

1

10

100

1000

10 100 1000 10000Output Current (mA)

Out

put V

olta

ge H

eadr

oom

(mV)

VDD - VOH @ VDD = 1.4VVOL - VSS @ VDD = 1.4V


RL = 10 kΩ

0.01 0.1 1 10

0

5

10

15

20

25


Out

put V

olta

ge H

eadr

oom

V DD

- VO

H or

VO

L - V

SS (m

V)



0

1

2

3

4

5

6


Slew

Rat

e (V

/ms)

Falling Edge, VDD = 6.0VRising Edge, VDD = 6.0V

Falling Edge, VDD = 1.4VRising Edge, VDD = 1.4V


MCP6441/2/4
FIGURE 2-25: Small Signal Non-Inverting Pulse Response.

FIGURE 2-26: Small Signal Inverting Pulse Response.

FIGURE 2-27: Large Signal Non-Inverting Pulse Response.

FIGURE 2-28: Large Signal Inverting Pulse Response.

FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal.

FIGURE 2-30: Closed Loop Output Impedance vs. Frequency.

Time (200 µs/div)

Out

put V

olta

ge (2

0 m

v/di

v)

VDD = 6.0VG = +1 V/V

Time (200 µs/div)

Out

put V

olta

ge (2

0 m

v/di

v)

VDD = 6.0VG = -1 V/V

0.00.51.01.52.02.53.03.54.04.55.05.56.0

Time (2 ms/div)

Out

put V

olta

ge (V

)

VDD = 6.0VG = +1 V/V

0.00.51.01.52.02.53.03.54.04.55.05.56.0

Time (2 ms/div)

Out

put V

olta

ge (V

) VDD = 6.0VG = -1 V/V

-1.0

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

Time (2 ms/div)

Inpu

t,Out

put V

olta

ge (V

)

VDD = 6.0VG = +2 V/V

VOUT

VIN

1

10

100

1000

10000

100000

1000000

1 10 100 1000 10000

Frequency (Hz)

Clo

sed

Loop

Out

put

Impe

danc

e (Ω

)

1 10 100 1k 10k 1

10

100

1k

10k

100k

1M

GN:101 V/V11 V/V1 V/V


MCP6441/2/4
FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS).

FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only).

1.E-121.E-111.E-101.E-091.E-081.E-071.E-061.E-051.E-041.E-03

-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0Input Voltage (V)

-I IN

(A)

1m100µ10µ

1µ100n

10n1n

100p10p1p

TA = -40°CTA = +25°CTA = +85°CTA = +125°C

60708090

100110120130140150

100 1000 10000Channel to Channel Separation

(dB)

Frequency (Hz)100 1k

Input Referred

Cha

nnel

to C

hann

el S

epar

atio

n(d

B)

1k100 10k


MCP6441/2/4

3.0 PIN DESCRIPTIONSDescriptions of the pins are listed in Table 3-1.

3.1 Analog Output (VOUT)The output pin is a low-impedance voltage source.

3.2 Power Supply Pins (VDD, VSS)The positive power supply (VDD) is 1.4V to 6.0V higherthan the negative power supply (VSS). For normaloperation, the other pins are at voltages between VSSand VDD.

Typically, these parts are used in a single (positive)supply configuration. In this case, VSS is connected toground and VDD is connected to the supply. VDD willneed bypass capacitors.

3.3 Analog Inputs (VIN+, VIN-)The non-inverting and inverting inputs are high-impedance CMOS inputs with low bias currents.

3.4 Exposed Thermal Pad (EP)There is an internal connection between the ExposedThermal Pad (EP) and the VSS pin; they must be con-nected to the same potential on the Printed CircuitBoard (PCB).

This pad can be connected to a PCB ground plane toprovide a larger heat sink. This improves the packagethermal resistance (θJA).

TABLE 3-1: PIN FUNCTION TABLEMCP6441 MCP6442 MCP6444

Symbol DescriptionSC70-5, SOT-23-5

SOIC, MSOP 2x3 TDFN SOIC,

TSSOP1 1 1 1 VOUT, VOUTA Analog Output (op amp A)4 2 2 2 VIN–, VINA– Inverting Input (op amp A)3 3 3 3 VIN+, VINA+ Non-inverting Input (op amp A)5 8 8 4 VDD Positive Power Supply— 5 5 5 VINB+ Non-inverting Input (op amp B)— 6 6 6 VINB- Inverting Input (op amp B)— 7 7 7 VOUTB Analog Output (op amp B)— — — 8 VOUTC Analog Output (op amp C)— — — 9 VINC- Inverting Input (op amp C)— — — 10 VINC+ Non-inverting Input (op amp C)2 4 4 11 VSS Negative Power Supply— — — 12 VIND+ Non-inverting Input (op amp D)— — — 13 VIND- Inverting Input (op amp D)— — — 14 VOUTD Analog Output (op amp D)— — 9 — EP Exposed Thermal Pad (EP);

must be connected to VSS


MCP6441/2/4
Notes:

MCP6441/2/4

4.0 APPLICATION INFORMATIONThe MCP6441/2/4 op amp is manufactured usingMicrochip’s state-of-the-art CMOS process, specificallydesigned for low power applications.

4.1 Rail-to-Rail Input

4.1.1 PHASE REVERSALThe MCP6441/2/4 op amp is designed to preventphase reversal, when the input pins exceed the supplyvoltages. Figure 2-29 shows the input voltageexceeding the supply voltage with no phase reversal.

4.1.2 INPUT VOLTAGE LIMITSIn order to prevent damage and/or improper operationof the amplifier, the circuit must limit the voltages at theinput pins (see Section 1.1, Absolute MaximumRatings †).

The Electrostatic Discharge (ESD) protection on theinputs can be depicted as shown in Figure 4-1. Thisstructure was chosen to protect the input transistorsagainst many, but not all, over-voltage conditions, andto minimize the input bias current (IB).

FIGURE 4-1: Simplified Analog Input ESD Structures.The input ESD diodes clamp the inputs when they tryto go more than one diode drop below VSS. They alsoclamp any voltages that go well above VDD; theirbreakdown voltage is high enough to allow normaloperation, but not low enough to protect against slowover-voltage (beyond VDD) events. Very fast ESDevents that meet the spec are limited so that damagedoes not occur.

In some applications, it may be necessary to preventexcessive voltages from reaching the op amp inputs;Figure 4-2 shows one approach to protecting theseinputs.

FIGURE 4-2: Protecting the Analog Inputs.A significant amount of current can flow out of theinputs when the Common Mode voltage (VCM) is belowground (VSS); see Figure 2-31.

4.1.3 INPUT CURRENT LIMITSIn order to prevent damage and/or improper operationof the amplifier, the circuit must limit the currents intothe input pins (see Section 1.1 “Absolute MaximumRatings †”).

Figure 4-3 shows one approach to protecting theseinputs. The resistors R1 and R2 limit the possiblecurrents in or out of the input pins (and the ESD diodes,D1 and D2). The diode currents will go through eitherVDD or VSS.

FIGURE 4-3: Protecting the Analog Inputs.

BondPad

BondPad

BondPad

VDD

VIN+

VSS

InputStage

BondPad

VIN–

V1

VDD

D1

V2

D2

MCP644XVOUT

V1R1

VDD

D1

min(R1,R2) >VSS – min(V1, V2)

2 mA

V2R2

D2

MCP644XVOUT

min(R1,R2) >max(V1,V2) – VDD

2 mA


MCP6441/2/4
4.1.4 NORMAL OPERATIONThe input stage of the MCP6441/2/4 op amp uses twodifferential input stages in parallel. One operates at alow Common Mode input voltage (VCM), while the otheroperates at a high VCM. With this topology, the deviceoperates with a VCM up to 300 mV above VDD and300 mV below VSS. The input offset voltage ismeasured at VCM = VSS – 0.3V and VDD + 0.3V, toensure proper operation.
The transition between the input stages occurs whenVCM is near VDD – 0.6V (see Figures 2-3 and 2-4). Forthe best distortion performance and gain linearity, withnon-inverting gains, avoid this region of operation.

4.2 Rail-to-Rail OutputThe output voltage range of the MCP6441/2/4 op ampis VSS + 20 mV (minimum) and VDD – 20 mV (maxi-mum) when RL = 10 kΩ is connected to VDD/2 andVDD = 6.0V. Refer to Figures 2-22 and 2-23 for moreinformation.

4.3 Capacitive LoadsDriving large capacitive loads can cause stabilityproblems for voltage feedback op amps. As the loadcapacitance increases, the feedback loop’s phasemargin decreases, and the closed-loop bandwidth isreduced. This produces gain peaking in the frequencyresponse, with overshoot and ringing in the stepresponse. While a unity-gain buffer (G = +1 V/V) is themost sensitive to the capacitive loads, all gains showthe same general behavior.

When driving large capacitive loads with theMCP6441/2/4 op amp (e.g., > 100 pF whenG = +1 V/V), a small series resistor at the output (RISOin Figure 4-4) improves the feedback loop’s phase mar-gin (stability) by making the output load resistive athigher frequencies. The bandwidth will be generallylower than the bandwidth with no capacitance load.

FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads.

Figure 4-5 gives the recommended RISO values for thedifferent capacitive loads and gains. The x-axis is thenormalized load capacitance (CL/GN), where GN is thecircuit's noise gain. For non-inverting gains, GN and theSignal Gain are equal. For inverting gains, GN is1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V).

FIGURE 4-5: Recommended RISO Values for Capacitive Loads.After selecting RISO for your circuit, double-check theresulting frequency response peaking and stepresponse overshoot. Modify RISO’s value until theresponse is reasonable. Bench evaluation andsimulations with the MCP6441/2/4 SPICE macromodel are very helpful.

4.4 Supply BypassThe MCP6441/2/4 op amp’s power supply pin (VDD forsingle-supply) should have a local bypass capacitor(i.e., 0.01 µF to 0.1 µF) within 2 mm for good highfrequency performance. It can use a bulk capacitor(i.e., 1 µF or larger) within 100 mm to provide large,slow currents. This bulk capacitor can be shared withother analog parts.

4.5 PCB Surface LeakageIn applications where low input bias current is critical,Printed Circuit Board (PCB) surface leakage effectsneed to be considered. Surface leakage is caused byhumidity, dust or other contamination on the board.Under low humidity conditions, a typical resistancebetween nearby traces is 1012Ω. A 5V difference wouldcause 5 pA of current to flow, which is greater than theMCP6441/2/4 op amp’s bias current at +25°C (±1 pA,typical).

VIN

RISOVOUT

CL

–

+MCP644X

1000

10000

100000

1000000

1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06Normalized Load Capacitance; CL/GN (F)

Rec

omm

ende

d R

ISO (Ω

)

GN: 1 V/V 2 V/V ≥ 5 V/V

10p 100p 1n 10n 0.1µ 1µ 1k

10k

100k

1M


MCP6441/2/4
The easiest way to reduce surface leakage is to use aguard ring around sensitive pins (or traces). The guardring is biased at the same voltage as the sensitive pin.An example of this type of layout is shown inFigure 4-6.
FIGURE 4-6: Example Guard Ring Layout for Inverting Gain.1. Non-inverting Gain and Unity-Gain Buffer:

a) Connect the non-inverting pin (VIN+) to theinput with a wire that does not touch thePCB surface.

b) Connect the guard ring to the inverting inputpin (VIN–). This biases the guard ring to theCommon Mode input voltage.

2. Inverting Gain and Transimpedance GainAmplifiers (convert current to voltage, such asphoto detectors):a) Connect the guard ring to the non-inverting

input pin (VIN+). This biases the guard ringto the same reference voltage as the opamp (e.g., VDD/2 or ground).

b) Connect the inverting pin (VIN–) to the inputwith a wire that does not touch the PCBsurface.

4.6 Application Circuits

4.6.1 BATTERY CURRENT SENSINGThe MCP6441/2/4 op amp’s Common Mode InputRange, which goes 0.3V beyond both supply rails,supports their use in high-side and low-side batterycurrent sensing applications. The low quiescent current(450 nA, typical) helps prolong battery life, and therail-to-rail output supports detection of low currents.

Figure 4-7 shows a high side battery current sensorcircuit. The 10Ω resistor is sized to minimize powerlosses. The battery current (IDD) through the 10Ωresistor causes its top terminal to be more negativethan the bottom terminal. This keeps the CommonMode input voltage of the op amp below VDD, which iswithin its allowed range. The output of the op amp willalso be below VDD, within its Maximum Output VoltageSwing specification.

FIGURE 4-7: Battery Current Sensing.

Guard Ring VIN– VIN+ VSS

VDD

IDD

100 kΩ

1 MΩ

1.4VVOUT

10Ωto6.0V

IDDVDD VOUT–

10 V/V( ) 10Ω( )⋅------------------------------------------=

To load

MCP6441


MCP6441/2/4
4.6.2 PRECISION HALF-WAVE
RECTIFIERThe precision half-wave rectifier, which is also knownas a super diode, is a configuration obtained with anoperational amplifier in order to have a circuit behavinglike an ideal diode and rectifier. It effectively cancels theforward voltage drop of the diode in such a way thatvery low level signals can still be rectified, with minimalerror. This can be useful for high-precision signalprocessing. The MCP6441/2/4 op amp has high inputimpedance, low input bias current and rail-to-railinput/output, which makes this device suitable forprecision rectifier applications.

Figure 4-8 shows a precision half-wave rectifier and itstransfer characteristic. The rectifier’s input impedanceis determined by the input resistor R1. To avoid theloading effect, it must be driven from a low-impedancesource.

When VIN is greater than zero, D1 is OFF, D2 is ON, andVOUT is zero. When VIN is less than zero, D1 is ON, D2is OFF, and VOUT is the VIN with an amplification of-R2/R1.

The rectifier circuit shown in Figure 4-8 has the benefitthat the op amp never goes in saturation, so the onlything affecting its frequency response is theamplification and the gain bandwidth product. .

FIGURE 4-8: Precision Half-Wave Rectifier.

4.6.3 INSTRUMENTATION AMPLIFIERThe MCP6441/2/4 op amp is well suited for condition-ing sensor signals in battery-powered applications.Figure 4-9 shows a two op amp instrumentationamplifier, using the MCP6441/2/4 device, that workswell for applications requiring rejection of CommonMode noise at higher gains. The reference voltage(VREF) is supplied by a low-impedance source. In sin-gle supply applications, VREF is typically VDD/2.

FIGURE 4-9: Two Op Amp Instrumentation Amplifier.

VOUT

R2

D1

D2

R1VIN

VOUT

VIN

-R2/R1

Transfer Characteristic

Precision Half-Wave Rectifier

MCP6441

VOUT V1 V2–( ) 1R1R2------

2R1RG---------+ +⎝ ⎠

⎛ ⎞ VREF+=

VREF R1 R2 R2 R1 VOUT

RG

V2

V1

1/2 MCP6442 1/2 MCP6442


MCP6441/2/4

5.0 DESIGN AIDSMicrochip provides the basic design tools needed forthe MCP6441/2/4 op amp.

5.1 SPICE Macro ModelThe latest SPICE macro model for the MCP6441/2/4op amp is available on the Microchip web site atwww.microchip.com. The model was written and testedin the official OrCAD (Cadence®) owned PSpice®. Forthe other simulators, translation may be required.

The model covers a wide aspect of the op amp'selectrical specifications. Not only does the model covervoltage, current and resistance of the op amp, but italso covers the temperature and the noise effects onthe behavior of the op amp. The model has not beenverified outside of the specification range listed in theop amp data sheet. The model behaviors under theseconditions cannot ensure it will match the actual opamp performance.

Moreover, the model is intended to be an initial designtool. Bench testing is a very important part of anydesign and cannot be replaced with simulations. Also,simulation results using this macro model need to bevalidated by comparing them to the data sheetspecifications and characteristic curves.

5.2 FilterLab® SoftwareMicrochip’s FilterLab software is an innovative softwaretool that simplifies analog active filter design using opamps. Available at no cost from the Microchip web siteat www.microchip.com/filterlab, the FilterLab designtool provides full schematic diagrams of the filter circuitwith component values. It also outputs the filter circuitin SPICE format, which can be used with the macromodel to simulate the actual filter performance.

5.3 Microchip Advanced Part Selector (MAPS)

MAPS is a software tool that helps semiconductorprofessionals efficiently identify the Microchip devicesthat fit a particular design requirement. Available at nocost from the Microchip website atwww.microchip.com/ maps, the MAPS is an overallselection tool for Microchip’s product portfolio thatincludes Analog, Memory, MCUs and DSCs. Using thistool, you can define a filter to sort features for aparametric search of devices and export side-by-sidetechnical comparison reports. Helpful links are alsoprovided for Data Sheets, Purchase and Sampling ofMicrochip parts.

5.4 Analog Demonstration and Evaluation Boards

Microchip offers a broad spectrum of AnalogDemonstration and Evaluation Boards that aredesigned to help you achieve faster time to market. Fora complete listing of these boards and theircorresponding user’s guides and technical information,visit the Microchip web site atwww.microchip.com/analogtools.

Some boards that are especially useful are:

• MCP6XXX Amplifier Evaluation Board 1• MCP6XXX Amplifier Evaluation Board 2• MCP6XXX Amplifier Evaluation Board 3• MCP6XXX Amplifier Evaluation Board 4• Active Filter Demo Board Kit• 5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2

5.5 Application NotesThe following Microchip Analog Design Note andApplication Notes are available on the Microchip website at www.microchip.com/appnotes, and arerecommended as supplemental reference resources.

• ADN003 – “Select the Right Operational Amplifier for your Filtering Circuits”, DS21821

• AN722 – “Operational Amplifier Topologies and DC Specifications”, DS00722

• AN723 – “Operational Amplifier AC Specifications and Applications”, DS00723

• AN884 – “Driving Capacitive Loads With Op Amps”, DS00884

• AN990 – “Analog Sensor Conditioning Circuits –An Overview”, DS00990

• AN1177 – “Op Amp Precision Design: DC Errors”, DS01177

• AN1228 – “Op Amp Precision Design: Random Noise”, DS01228

• AN1297 – “Microchip’s Op Amp SPICE Macro Models”, DS01297

• AN1332: “Current Sensing Circuit Concepts and Fundamentals”’ DS01332

These application notes and others are listed in thedesign guide:

• “Signal Chain Design Guide”, DS21825


http://www.microchip.com/maps/main.aspx???

http://www.microchip.com/maps/main.aspx???

www.microchip.com

www.microchip.com/filterlab

www.microchip.com/filterlab

www.microchip.com/analogtools

www.microchip.com/analogtools

http://www.microchip.com/wwwcategory/TaxonomySearch.aspx?show=Application%20Notes&ShowField=no

http://www.microchip.com/wwwcategory/TaxonomySearch.aspx?show=Application%20Notes&ShowField=no

MCP6441/2/4
NOTES:

MCP6441/2/4

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Example:

Legend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, itwill be carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.

3e

3e

Example:5-Lead SOT-23 (MCP6441)

5-Lead SC70 (MCP6441)

Example:

DG25

XXNN WU25

8-Lead MSOP (MCP6442)

6442E211256


MCP6441/2/4

Legend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information.

3e

3e

14-Lead TSSOP (MCP6444) Example:

14-Lead SOIC (150 mil) (MCP6444) Example:

8-Lead SOIC (150 mil) (MCP6442) Example:

NNN

MCP6442ESN^^ 1211

2563e

8-Lead TDFN (2x3x0.75 mm)(MCP6442) Example:

AAX21125

MCP6444E/SL ^^

12112563e

YYWWNNN

XXXXXXXX 6444E/ST1211256


MCP6441/2/4

!"!#$!!% #$ !% #$ #&! ! !#"'(

)*+ ) #&#,$ --#$##

.# #$#/!- 0 #1/%##!###+22---2/

3# 44" " 4# 5 56 7

5$8%1 5 (1# 9()*6,:# ; < !!1/ / ; < #!%% < 6,=!# " ; !!1/=!# " ( ( (6,4# ; (.#4# 4 94! / ; < 94!=!# 8 ( <

D

b

123

E1

E

4 5e e

c

LA1

A A2

- *9)


MCP6441/2/4

.# #$#/!- 0 #1/%##!###+22---2/

5-Lead Plastic Small Outline Transistor (LT) [SC70]


MCP6441/2/4

!

!"!#$!!% #$ !% #$ #&! ! !#"'(

)*+ ) #&#,$ --#$##

.# #$#/!- 0 #1/%##!###+22---2/

3# 44" " 4# 5 56 7

5$8%1 5 (4!1# ()*6$# !4!1# )*6,:# < (!!1/ / ; < #!%% < (6,=!# " < !!1/=!# " < ;6,4# < .#4# 4 < 9.## 4 ( < ;.# > < >4! / ; < 94!=!# 8 < (

φ

Nb

E

E1

D

1 2 3

e

e1

A

A1

A2 c

L

L1

- *)


MCP6441/2/4

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging


MCP6441/2/4



MCP6441/2/4

" #$%!&'()*

.# #$#/!- 0 #1/%##!###+22---2/


MCP6441/2/4



MCP6441/2/4

" +,%-./# 0!0&()+,

.# #$#/!- 0 #1/%##!###+22---2/


MCP6441/2/4



MCP6441/2/4

.# #$#/!- 0 #1/%##!###+22---2/


MCP6441/2/4



MCP6441/2/4
NOTES:

MCP6441/2/4

APPENDIX A: REVISION HISTORY

Revision C (April 2012)The following is the list of modifications:

1. Added new package type (8-Lead 2x3 TDFN)for MCP6442, and the related informationthroughout the document.

2. Updated Table 3-1 with TDFN package pinouts.3. Updated Section 6.0, Packaging Information.4. Updated the Product Identification SysteM

section.

Revision B (March 2011)The following is the list of modifications:

1. Added the MCP6442 and MCP6444 packageinformation.

2. Updated the ESD protection value on all pins inSection 1.1, Absolute Maximum Ratings †.

3. Added Figure 2-32.4. Updated Table 3-1.5. Updated the package markings information and

drawings.6. Updated the Product Identification SysteM

section.

Revision A (September 2010)• Original Release of this Document.


MCP6441/2/4
NOTES:

MCP6441/2/4

PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: MCP6441T: Single Op Amp (Tape and Reel)(SC70, SOT-23)

MCP6442: Dual Op Amp (Tube)(SOIC, MSOP)

MCP6442T: Dual Op Amp (Tape and Reel)(SOIC, MSOP, 2x3 TDFN)

MCP6444: Quad Op Amp (Tube)(SOIC, TSSOP)

MCP6444T: Quad Op Amp (Tape and Reel)(SOIC, TSSOP)

Temperature Range:

E = -40°C to +125°C (Extended)

Package: LT = Plastic Package (SC70), 5-leadMNY* = Thin Plastic Dual Flat (2x3 TDFN), 8-leadMS = Plastic MSOP, 8-leadOT = Plastic Small Outline Transistor (SOT-23), 5-leadSL = Plastic SOIC, (3.99 mm body), 14-leadSN = Plastic SOIC, (3.99 mm body), 8-leadST = Plastic TSSOP (4.4 mm body), 14-lead

* Y = Nickel palladium gold manufacturing designator. Only available on the TDFN package.

PART NO. -X /XX

PackageTemperatureRange

Device

T

Tape and Reel

Examples:a) MCP6441T-E/LT: Tape and Reel,

Extended Temperature5LD SC70 Package

b) MCP6441T-E/OT: Tape and Reel,Extended Temperature5LD SOT-23 Package

c) MCP6442T-E/MNY: Tape and Reel,Extended Temperature8LD 2x3 TDFN Package

d) MCP6442T-E/MS: Tape and Reel,Extended Temperature8LD MSOP Package

e) MCP6442-E/MS: Tube,Extended Temperature8LD MSOP Package

f) MCP6442T-E/SN: Tube,Extended Temperature8LD SOIC Package

g) MCP6442-E/SN: Tube,Extended Temperature8LD SOIC Package

h) MCP6444T-E/SL: Tape and Reel,Extended Temperature14LD SOIC Package

i) MCP6444-E/SL: Tube,Extended Temperature14LD SOIC Package

j) MCP6444T-E/ST: Tape and Reel,Extended Temperature14LD TSSOP Package

k) MCP6444-E/ST: Tube,Extended Temperature14LD TSSOP Package


MCP6441/2/4
NOTES:

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

© 2010-2012 Microchip Technology Inc.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV

== ISO/TS 16949 ==

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2010-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62076-244-8

DS22257C-page 45

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.


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