5 packaging intro
DESCRIPTION
MEMS MOEMS Nano. Workshop. 5 Packaging Intro. Ken Gilleo PhD ET-Trends LLC. 44%. the. DEVICE. DEVICE. Reworkability. Enable repair. WIRING. WIRING. JOINING. JOINING. Automated Handling. Easy Testability. Easy Assembly. PROTECTION. Package. Chip to PCB Compatibility. - PowerPoint PPT PresentationTRANSCRIPT
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5 Packaging Intro
•Ken Gilleo PhD•ET-Trends LLC
44%
2
the
PackagePackage
DEVICEDEVICE JOIN
ING
JOIN
INGW
IRIN
GW
IRIN
G
PROTECTIONStandardization
PerformanceEnhancement
ThermalManagement
EasyTestability
AutomatedHandling
EasyAssembly
Enablerepair
Reworkability
PROTECTION
Chip to PCBCompatibility
Rerouting
Selective Accessto Environment
Enable MechanicalMovement
LowStress
MEMSMEMS
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Packaging Change Drivers
Packaging Change Drivers
1. Miniaturization Area Height Weight
2. Performance
High lead count
High frequency; processors, RF
3. MEMS/MOEMS/Nano; a new technology cluster
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DevicesDevices
TIME
PE
RF
OR
MA
NC
E
Solid State
MEMS
MOEMS
Nano
~50 Years
~50 Years
Vacuum
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• Base; platform; chip carrier
• 1st Level Interconnect (to chip)
• Routing (can be optional)
• 2nd Level Interconnect (to substrate/PCB)
• Enclosure; encapsulant
• Special features Thermal management Ports, windows, other
Basic Package Elements
Basic Package Elements
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Packages Element – cont.Packages Element – cont.• Substrate/Platform/Enclosure
Rigid organic; BT, etc. Flexible organic; polyimide Ceramic/glass Metal with insulation Protection; enclosure, encapsulation, passivation
• Chip Connections (1st level) Wire bond TAB Integrated TAB DCA; Flip Chip
• PCB Assembly (2nd level) Fusible: solder spheres/balls/bumps Non-fusible: leads, pins, pads
DIE
DIELECTRICSDIELECTRICS
CONDUCTORSCONDUCTORS
CONDUCTORSCONDUCTORS
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Lead FramesLead Frames• Metal – free standing or pre-inserted into dielectric
• Framing structure removed later
• Ceramic hermetic; used for MEMS
• Plastic Near-hermetic; limited use for MEMS
• Finishes for die attach/bonding Ag Pd Au Ni Multiple
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Chip CarriersChip CarriersChip Carrier: a packaging system for electronic chips (IC’s) that provides protection and a practical means of connecting to circuitry.
Fan Out: 2nd Level interconnect fans outward from 1st level
Fan In:
Conductor and Dielectric
First - 1964A flex-based package
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Area Array Packages
Area Array Packages
• Flip Chip
• LGA (Land Grid Array); leadless chip carrier, QFN
• PGA (Pin Grid Array)
• BGA (Ball Grid Array)
• Micro-BGA (CSP)
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Advanced Packaging Types
Advanced Packaging Types
• Advanced BGAs
• Flex-Based
• MultiChip
• CSP
• Array Molded
• Wafer-Level CSP and FC
PRODUCTIVITY
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Flip ChipFlip Chip
• Perimeter for small I/O count
• Area Array is much more effective
MEMS potentialSelective underfill
MEMS
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• Cofired
• Cast
• Molded
• Open (non-hermetic); chip carrier
Ceramic PackagesCeramic PackagesUsed for MEMS
Hermeticmoderately expensive
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Organic SubstrateOrganic Substrate• Rigid; mostly epoxies (resin-glass)
FR4 conventional
FR4 type non-halogenated
BT (Bismaleimide-triazine)
New non-epoxy halogen-free products
• Flexible
Polyimide
LCP
Limited use for MEMS
Non-hermeticLowest cost
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MultiChip PackagesMultiChip PackagesTraditional StackedSingle-Plane
Cavity type used MEMS + ASIC, other
Infineon MEMS mic + ASIC chip
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• Bond die (chip) to base; die attach)
• 1st Level connect chip; wire bonding
• Enclosure; encapsulant
Packaging StepsPackaging Steps
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Wire Bonding (WB)Wire Bonding (WB)• Most common connection
• Gold ball bonding dominants (~ 93%)
• Features Programmable; handles die and package change Very versatile Universal method Fast, automatic, equipment makers keeping pace Fully mechanical process Clean; no pollution, waste, hazardous materials Well-suited for MEMS/MOEMS
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Package ProtectionPackage Protection
• Fabricated cavity enclosure; metal, plastic, ceramic
• Transfer Molding Compounds (solids)
• Glob Top; free flow encapsulant
• Dam & Fill encapsulants
• Cavity fill encapsulants
• Underfill; 4 basic classes
• Underfill + encapsulant
• Injection molded cavity packages; near-hermetic
DIE
Most can’t be
used for MEMS
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BGABGA
DIE
encapsulants: for protection & handling
Only suitable for capped MEMS
CAP
MEMS
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Session SummarySession Summary• Packaging is very dynamic today
• The package is all about metal & dielectrics
• Challenges are greater than ever
• Chip advances push performance
• WLP is finally gathering momentum
• MEMS is opening up a new packaging industry