5g mmimo modules with enhanced power and efficiency
TRANSCRIPT
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Company Public – NXP, the NXP logo, and NXP secure connections for a smarter world are trademarks of NXP
B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.
Marketing Manager EMEA - Radio Power BL
Pascal Massot
5G mMIMO Modules with Enhanced Power and Efficiency
November 2019 | EUF-IND-T3931
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COMPANY PUBLIC 1
Focus of this presentation
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COMPANY PUBLIC 2COMPANY PUBLIC 2
Agenda
• Introduction to cellular network market
• 5G network RF technology dynamics
• 5G RF Amplifier portfolio
• RF Circuit collection
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COMPANY PUBLIC 3
Introduction to cellular network
market
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COMPANY PUBLIC 4
Wireless Connectivity Landscape
Ultra-short Range
Short Range
Wide Range
CAT-M1 NB-IoT5G
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COMPANY PUBLIC 5
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COMPANY PUBLIC 6COMPANY PUBLIC 6
History of Communication Standards
1G-AMPS
1980 – 1990
Voice Only
64 kb/s
2G-GSM
1990 – 2000
Digitized Voice
2 Mb/s
3G-WCDMA
2000 – 2010
Mobile Internet
1 Gb/s
4G-LTE
2010 – 2020
Mobile Broadband
5 Gb/s
5G-NR
2020 –
Man-to-Man Communication Man-to-Internet Communication Everything Connected
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COMPANY PUBLIC 7
Explosive Growth in Connected Devices
2015 20182016
25
22
2019
17
15
28
2017 2019 2020 2021
Customers Facing…
• Skyrocketing data rates
• Multiple wireless standards
• Increasing network complexity
• Stringent power requirements
• Worldwide rise in IP traffic
Mobile Broadband for Evolving
Cellular Market
• Reduced energy consumption
• Shrinking equipment footprint
• Reduced time-to-market
Connected Devices vs.
Global Mobile Traffic
# C
on
ne
cte
d D
evic
es (
Bill
ion
s)
Global Mobile Traffic
(Monthly Exabytes)
Source: Ericsson, June 2016
11
20
29
35
53
75
95
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COMPANY PUBLIC 8COMPANY PUBLIC 8
Everything Connected Requires a New Communication
Protocol: 5G New Radio (5G-NR)
Ultra-high reliability:
99.9999999%
Ultra-low latency:
Less than 1millisecondUltra-high density
1M nodes / km2
Ultra low complexity:
10s of kbps 5G
Mobile Broadband
Smart Transport
Realtime Virtual Reality
Internet of Things
Massive
Machine
Communication
Data rate: 10s Gbps
Capacity: 10 Tbps / km2
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COMPANY PUBLIC 9
5G: Cell Phones and Much MoreL
ow
Po
wer
Wir
ele
ss
2G
/3G
4G
Pre
5G
5G
Critical
MTC:
Latency &
reliability
Connected Cars
Beyond LOS
Ultra low latency
Conventional freq.
Low Power & BW
Mobile
Broad Band
(MBB):
Capacity &
Coverage
LTE Advanced
High BW / CA
Higher diversity
Conventional freq.
Low & high power
eMBB:
Ultra High
Capacity
mmWave
RAN
GBps Data
Last mile connectivity
Ultra high bandwidth
mMIMO
New frequencies
TIME
Massive Machine
Type
Communication
(MTC):
Low Power &
Small signaling
overhead
Internet of Things
Low power & BW
NB-LTE / WiFi / 2G
Conventional freq.
2017-2019 2020-2025
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COMPANY PUBLIC 10
5G Network RF
Technology Dynamics
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COMPANY PUBLIC 11COMPANY PUBLIC 11
Evolution of the Cellular Base Station
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COMPANY PUBLIC 12
Massive MIMO
• Active Antenna Solutions enable a leap in capacity by utilizing between 16 and 64 transmit and receive paths in a single active system.
• TDD-mMIMO systems are leading the way at 2.6 GHz and 3.5 GHz bands but will expand to FDD and other frequencies as well.
• Although system costs are currently higher than traditional RRH, significant throughput improvements justify the investment.
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COMPANY PUBLIC 13
mmWave Solutions
• To improve capacity even further, the industry is looking to mmWave frequencies ranging from 24 GHz to 39 GHz, enabling over 1 GHz of bandwidth.
• Beamforming will enable spatial multiplexing for increased spectrum reuse.
• Solutions include Fixed Wireless Access as well as Radio Access Networks.
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COMPANY PUBLIC 14
Throughput Evolution
Massive MIMO
• Used in Macro BTS
• Existing spectrum + new bands below 6 GHz
• More data with LTE and existing handsets
• Possible now
• Least expensive option to increase throughput,
even at increased equipment cost
Microwave & Millimeterwave Frequencies
• > 6 GHz on WRC-2019 agenda
• GHz bandwidth has potential to carry a lot of data
• Propagation and building penetration issues force
“small cell” deployments – many of them needed
• Significant increase of throughput – will see use
starting 2020
Today:
LTE
Tomorrow:
mMIMO + LTE
After 2020:
mMIMO + 5G
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COMPANY PUBLIC 15
TRX
RFFE
RFFE
RFFE
RFFE
RFFE
RFFE
RFFE
RFFE
Solutions for mmWave
beamforming
Required RF building blocks for a mmWave TDD beamforming system:
− Splitter / combiner network
− TX front end (PA)
− RX front end (LNA)
− TX / RX switch
− Phase shifter
VM
VM
BA
TR TR
LNA
PA
VM
VM
BA
TR TR
LNA
PA
VM
VM
B A
TRTR
LNA
PA
VM
VM
B A
TRTR
LNA
PA
BUS
Example of an integrated 4 channel solution:
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COMPANY PUBLIC 16COMPANY PUBLIC 16
Wireless Infrastructure MIMO EvolutionAntenna Diversity Increasing in All Market Sub-segments
2 x 80W 4 x 40W 8 x 15W 32/64 x 2.5W 256 x 200mW
2T120 Mb/s
4T230 Mb/s
8T440 Mb/s
mMIMO2-5 Gb/s
MMW>10 Gb/s
4 x 40W 32x 5W 32/64 x 2.5W 256 x 200mW
4T230 Mb/s
16T1 Gb/s
32T1-2 Gb/s
64T2-5 Gb/s
MMW>10 Gb/s
16x 10W
4G
4G 5G
4G LTE
Wide Area Coverage
LDMOS & GaN
LTE Adv. / 5G
Suburban Coverage
LDMOS, GaN & SiGe
LTE Adv. / 5G
Urban Coverage
LDMOS, GaN & SiGe
LTE Adv. / 5G
Dense Urban Areas
LDMOS, GaN & SiGe
5G – Highest Capacity
Dense Urban Areas
SiGe & GaN
5G
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COMPANY PUBLIC 17
5G RF Module Portfolio
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COMPANY PUBLIC 18COMPANY PUBLIC 18
NXP’s RF Technology Toolbox
80W
40-60W
10-20W
1-5W
<1 W
LNA SW
LDMOS
48V
GaN
GaN
LDMOS 28V
GaN
and LDMOS
28V
LDMOS 28 V IC
SiGe and RFCMOS
GaAs (HBT, pHEMT)
< 1000MHz 2,0 GHz 2.6 GHz 3.5 GHz 4-10 GHz 10-60 GHz
Existing Spectrum
GaN
and LDMOS
28V
New Spectrum
AV
G P
A P
ow
er
From sub-1GHz to mm-wave;
from mW’s to 10’s of W
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COMPANY PUBLIC 19COMPANY PUBLIC 19
Leveraging the Benefits of GaN and LDMOS
GaN Benefits
• Differentiating performance exceeding
LDMOS above 2.5 GHz
• Enables 5G at higher frequencies
• Broadband design
• High efficiency at high frequencies
• Comparable thermal package as LDMOS
• Compact PA design (more power in smaller
package, smaller matching circuitry)
• Wideband CW and Pulse PA applications:
• 200-2600 MHz at 100 W
• S-band 2.7-3.5 GHz at 700 W
LDMOS Benefits
• Competitive performance to 2.7 GHz
• Cost effective PA solutions
• Mature process technology
• High ruggedness up to 65:1 VSWR
• Consistent thermal behavior
• Broadband VHF/UHF below 1 GHz
• Highest power up to 1.5 GHz
• Narrow-band PA applications:
• Cellular bands up to 2.7 GHz
• Avionics/L-band 1.2-1.4 GHz up to 1.5 kW
• S-band 2.7-3.1 GHz at 300 W
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COMPANY PUBLIC 20COMPANY PUBLIC 20
NXP Family of Fully-Integrated High Efficiency Power
Amplifiers
• Power levels 2.5 –
5 Watt devices
• Roadmap covering bands
2.3 GHz to 5 GHz
• Easy implementation –
50 Ω input & output
• Pin-compatibility between
all frequency bands and
power levels
• LDMOS – low cost solution
Rx Front-End
Module4x4 mm2 package
PA Module6x10 mm2 package
Pre-Driver Amplifier3x4 mm2 package
Low Cost Small Size21x35 mm2 solution
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COMPANY PUBLIC 21COMPANY PUBLIC 21
Block diagram
Tx In
I2C
ENABLE
RX OUT
RF PA
CONTROL
BYPASS
AFRX5G132
AFLP5G35647
BIAS CONTROLLER
AFSC5G35D37
T/R SWITCH
TO ANTENNA
FEEDBACK OUT
BYPASS
TX OUT /
RX IN
CONTROL
DAC0
DAC1
Final stage:
AFSC5G35D37
Driver:
AFLP5G25641
RX Module:
AFRX5G372
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COMPANY PUBLIC 22COMPANY PUBLIC 22
Airfast 5G MCM Benefits
Device 10x6 mm2
Solution 15x11 mm2
Time To Market
The ease of use of a 50-ohm, high gain dual-stage PA with integrated Doherty shortens design cycle time
• Eliminates multiple prototype passes
• No compromise on performance
• 50-ohm, pin-compatibility from a MCM PA to another enables reuse for other frequencies / power levels
Manufacturing
A surface mount device, compatible with standard pick and place + reflow, facilitates manufacturing
• Reduces assembly time increasing ROI for manufacturing equipment and reduced need for capital investment
• Eliminates testing redundancies while improving yields
Smaller, lighter active antenna systems
The high integration enables lighter 64T active antenna systems.
• Small size enabled by a 10 x 6 mm package
• 50-ohm in/out with integrated Doherty reduces external component out
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COMPANY PUBLIC 23COMPANY PUBLIC 23
Devices
Dual-stage PA• AFSC5G23D37
• AFSC5G26D37
• AFSC5G35D37
• AFSC5G37D37
• AFSC5G35D35 10x6 mm2
LNA + switch• AFRX5G272
• AFRX5G3726.2x6.2 mm2
Pre-driver• AFLP5G25641
• AFLP5G35645
4x3 mm2
Airfast 5G MCM Enablement – Reference Circuits & Reference Designs
Reference DesignReference Circuits
Documentation
(data pack, dxf
drawings) available
from nxp.com
Orderable P/N:
“device#”-EVB (ex: AFSC5G37D37-EVB)
$250 MSRP
Reference Designs
Reference Design:
AFDEV5G-26D37
Reference Design:
AFDEV5G-35D37
More details on
AFDEV5G-26D37
More details on
AFDEV5G-35D37
Orderable Q4 2019
Available now
Orderable Sep 2019
Pre-driver, PA and
LNA together
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COMPANY PUBLIC 24COMPANY PUBLIC 24
Part Number Decoder
AFSC5G35D37T2
5G Family
2000 pcs reel
size (MPQ)
NXP’s RF Signature for Cellular
Infrastructure: Airfast
System-in-compact
package
Frequency
band
dBm Avg
Power
Doherty Series
PA Modules:
AFLP5G35645T5Linear Pre-driver Frequency
band
5000 pcs reel
size (MPQ)
Pre-Drivers:
AFRX5G372T4Receiver Frequency
bandGeneration
2500 pcs reel
size (MPQ)Rx Modules:
Back to
portfolio
selection
Back to 5G
portfolio
Introduction
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COMPANY PUBLIC 25COMPANY PUBLIC 25
Introducing Airfast 5G MCM Solutions – 28 V LDMOSA
ve
rage
Ou
tpu
t P
ow
er
2300 MHz 2400 MHz 2500 MHz 2600 MHz 2700 MHz ~ 3400 MHz 3500 MHz 3600 MHz 3700 MHz 3800 MHz
AFSC5G23D37 AFSC5G26D37
AFSC5G35D35
AFSC5G35D37 AFSC5G37D37
5 W
37
dB
m
27 dB gain, 38% PAE
2300-2400 MHz
27 dB gain, 38% PAE
2545-2655 MHz
27 dB gain, 36% PAE
3400-3600 MHz
29 dB gain, 38% PAE
3600-3800 MHz
29 dB gain, 38% PAE
3400-3600 MHz
PA MCMs:
Rx Front-end Modules (LNA + switch):
Pre-Driver Amplifiers:
29 d
Bm AFLP5G25641
2300-2700 MHz
AFLP5G35645
3400-3800 MHz
AFRX5G272
2300-2700 MHz
AFRX5G372
3300-4200 MHz
3 W
35 d
Bm
Test conditions: PAE @ 8-8.5 dB OBO
✓ Simple DPD
✓ ACPR < -50 dBc w/ 2x20MHz LTE 7.5dB PAR
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COMPANY PUBLIC 26COMPANY PUBLIC 26
mMIMO Power budget
BTS Total Pout (W)
BTS Total Pout (dBm)
MIMO (#)
Antenna Pout (W) Antenna Pout (dBm)
PA avg Pout (W)
PA avg Pout (dBm)
Losses (dB)
320 55 16 20.0 43 32 45 2
240 54 16 15.0 42 24 44 2
200 53 16 12.5 41 20 43 2
320 55 32 10.0 40 16 42 2
240 54 32 7.5 39 12 41 2
200 53 32 6.3 38 10 40 2
160 52 16 10.0 40 16 42 2
100 50 16 6.3 38 10 40 2
320 55 64 5.0 37 8 39 2
240 54 64 3.8 36 6 38 2
200 53 64 3.1 35 5 37 2
160 52 32 5.0 37 8 39 2
100 50 32 3.1 35 5 37 2
3 35 4 0.8 29 1.27 31 2
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COMPANY PUBLIC 27COMPANY PUBLIC 27
AFSC5G37D37
Typical line-up:
• 3600-3800 MHz
• 37 dBm / 5 W avg (45.6 dBm / 36 W peak)
• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner
• 38% efficiency @ 8 dB OBO
• 29 dB gain
• 10x6 mm2 over-molded plastic package
Comments:
• Designed for 240 W, 64T mMIMO active antennas
for the B48
• In production
• Reference circuit: AFSC5G37D37-EVB available
Reference Circuit:
Pout = 5 W avg., VDD = 29 V, 1x 20 MHz LTE, Input PAR 8 dB
Carrier Center
Frequency
Gain
(dB)
ACPR
(dBc)
PAE
(%)
3600 MHz 29.5 -32.4 39%
3700 MHz 29.7 -33.6 38%
3800 MHz 29.9 -34.4 38%
Final stage:
AFSC5G37D37
Driver:
AFLP5G35645
RX Module:
AFRX5G372
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COMPANY PUBLIC 28COMPANY PUBLIC 28
AFSC5G35D37
Typical line-up:
• 3400-3600 MHz
• 37 dBm / 5 W avg (45.6 dBm / 36 W peak)
• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner
• 39% efficiency @ 8 dB OBO
• 29 dB gain
• 10x6 mm2 over-molded plastic package
Comments:
• Designed for 240 W, 64T mMIMO active antennas
for the B42
• In production
• Reference circuit: AFSC5G35D37-EVB available
Reference Circuit:
Pout = 5 W avg., VDD = 29 V, 1x 20 MHz LTE, Input PAR 8 dB
Final stage:
AFSC5G35D37
Driver:
AFLP5G35645
RX Module:
AFRX5G372
Carrier Center
Frequency
Gain
(dB)
ACPR
(dBc)
PAE
(%)
3400 MHz 29.2 -31.4 39%
3500 MHz 29.3 -32.8 39%
3600 MHz 29.4 -31.0 39%
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COMPANY PUBLIC 29COMPANY PUBLIC 29
AFSC5G35D35
Typical line-up:
• 3400-3600 MHz
• 35 dBm / 3 W avg (43 dBm / 20 W peak)
• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner
• 37% efficiency @ 8 dB OBO
• 25 dB gain
• 10x6 mm2 over-molded plastic package
Comments:
• Designed for 240 W, 64T mMIMO active antennas
for the B42
• In production
• Reference circuit: AFSC5G35D35-EVB available
Reference Circuit:
Pout = 3 W avg., VDD = 24 V, 1x 20 MHz LTE, Input PAR 8 dB
Final stage:
AFSC5G35D35
Driver:
AFLP5G35645
RX Module:
AFRX5G372
Carrier Center
Frequency
Gain
(dB)
ACPR
(dBc)
PAE
(%)
3400 MHz 25.3 -27.6 37%
3500 MHz 24.9 -30.8 37%
3600 MHz 24.8 -32.9 35%
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COMPANY PUBLIC 30COMPANY PUBLIC 30
AFSC5G26D37
Typical line-up:
• 2496-2690 MHz
• 37 dBm / 5 W avg (45.7 dBm / 37 W peak)
• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner
• 40% efficiency @ 8 dB OBO
• 27 dB gain
• 10x6 mm2 over-molded plastic package
Comments:
• Designed for 200 W, 64T mMIMO active antennas
for the B41
• In production
• Reference circuit: AFSC5G26D37-EVB available
Reference Circuit:
Pout = 5 W avg., VDD = 28 V, 1x 20 MHz LTE, Input PAR 8 dB
Final stage:
AFSC5G26D37
Driver:
AFLP5G25641
RX Module:
AFRX5G272
Carrier Center
Frequency
Gain
(dB)
ACPR
(dBc)
PAE
(%)
2575 MHz 27.4 –27.8 40%
2600 MHz 27.2 –27.9 40%
2625 MHz 27.1 –27.7 40%
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COMPANY PUBLIC 31COMPANY PUBLIC 31
AFSC5G23D37
Typical line-up:
• 2300-2400 MHz
• 37 dBm / 5 W avg (45.7 dBm / 37 W peak)
• 28 V LDMOS• 50-ohm in/out, dual-stage MCM with Doherty combiner
• 38% efficiency @ 8 dB OBO
• 27 dB gain
• 10x6 mm2 over-molded plastic package
Comments:
• Designed for 240 W, 64T mMIMO active antennas
for the B40
• In production
• Reference circuit: AFSC5G23D37-EVB available
Reference Circuit:
Pout = 5 W avg., VDD = 26 V, 1x 20 MHz LTE, Input PAR 8 dB
Final stage:
AFSC5G23D37
Driver:
AFLP5G25641
RX Module:
AFRX5G272
Carrier Center
Frequency
Gain
(dB)
ACPR
(dBc)
PAE
(%)
2575 MHz 27.4 –27.8 40%
2600 MHz 27.2 –27.9 40%
2625 MHz 27.1 –27.7 40%
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COMPANY PUBLIC 32COMPANY PUBLIC 32
AFLP5G35645
Functional Block Diagram: Typical line-up:
• 3400-3800 MHz pre-driver
• 29 dBm avg (25 dBm @ 3.3 V)
• 5 V GaAs• 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias
enable/disable TDD operation.
• Very low power consumption: 158 mW @ 5 V
(114 mW @ 3.3 V)
• 4x3 mm2 plastic package
Comments:
• Pre-driver for AFSC5G37D37, 35D37, 35D35
• In development, qualification planned end Q4 2019
MATCH
CONTROLLER
GND
GND
GND GND GND GNDVCC2
GND EN VCC1 GNDLLS
RFIN
GND
GND
RFOUT
Final stage:
AFSC5G35D37
Driver:
AFLP5G35645
RX Module:
AFRX5G372
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COMPANY PUBLIC 33COMPANY PUBLIC 33
AFLP5G25641
Functional Block Diagram: Typical line-up:
• 2300-2700 MHz pre-driver
• 29 dBm avg (25 dBm @ 3.3 V)
• 5 V GaAs• 50-ohm in/out, 3-stage MCM with 1.8 V logic control pin for bias
enable/disable TDD operation.
• Very low power consumption: 158 mW @ 5 V
(114 mW @ 3.3 V)
• 4x3 mm2 plastic package
Comments:
• Pre-driver for AFSC5G23D37, 26D37
• In development, qualification planned end Q4 2019
MATCH
CONTROLLER
GND
GND
GND GND GND GNDVCC2
GND EN VCC1 GNDLLS
RFIN
GND
GND
RFOUT
Final stage:
AFSC5G26D37
Driver:
AFLP5G25641
RX Module:
AFRX5G272
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COMPANY PUBLIC 34COMPANY PUBLIC 34
AFRX5G372
Functional Block Diagram: Typical line-up:
Comments:
• Rx for AFSC5G37D37, 35D37, 35D35
• In development, qualification planned in Q1 2020
• Support circuitry to work from a 5 V supply and a 1.8
logic-level T/R control
• Support Tx and Rx modes, which are controlled by
T/R logic signaling
• 3300-5000 MHz
• 5 V GaAs LNA + switch
• Noise Figure: 1.3 dB • Gain 33dB
• 50-ohm in/out
• 6.2x6.2 mm2 plastic package
PA
Controller
LNA LNARx Tx
Tx / RxDigital control (1.8 V JEDEC)
VDD
(5 V)
6.2 x 6.2 LGA
P in switch
Final stage:
AFSC5G35D37
Driver:
AFLP5G35645
RX Module:
AFRX5G372
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COMPANY PUBLIC 35COMPANY PUBLIC 35
AFRX5G272
Functional Block Diagram: Typical line-up:
• 2300-2700 MHz LNA + switch
• Noise Figure: 1.3 dB
• 5 V GaAs• Gain 33dB
• 50-ohm in/out
• 6.2x6.2 mm2 plastic package
Comments:
• Rx for AFSC5G23D37, 26D37
• In development, qualification planned in Q1 2020
• Support circuitry to work from a 5 V supply and a 1.8
logic-level T/R control
• Support Tx and Rx modes, which are controlled by
T/R logic signaling
PA
Controller
LNA LNARx Tx
Tx / RxDigital control (1.8 V JEDEC)
VDD
(5 V)
6.2 x 6.2 LGA
P in switch
Final stage:
AFSC5G26D37
Driver:
AFLP5G25641
RX Module:
AFRX5G272
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COMPANY PUBLIC 36COMPANY PUBLIC 36
AFDEV5G-35D37 Reference Design
Functional Block Diagram: Typical line-up:
• 3400-3600 MHz
• 30 V LDMOS
• 5 W AVG, 37 dBm• Integrated RF design
• 50 ohm input/output
• In development, orderable Q1 2020
Design Size:
20.95 mm 38.35 mm
57.15 mm
34.52 mm
Total height including
cover 9.7 mm
Tx In
I2C
ENABLE
RX OUT
RF PA
CONTROL
BYPASS
AFRX5G372
AFLP5G35647
BIAS CONTROLLER
AFSC5G35D37
T/R SWITCH
TO ANTENNA
FEEDBACK OUT
BYPASS
TX OUT /
RX IN
CONTROL
DAC0
DAC1
Final stage:
AFSC5G35D37
Driver:
AFLP5G35645
RX Module:
AFRX5G372
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COMPANY PUBLIC 37COMPANY PUBLIC 37
AFDEV5G-26D37 Reference Design
Functional Block Diagram: Typical line-up:
• 2496-2690 MHz
• 30 V LDMOS
• 5 W AVG, 37 dBm• Integrated RF design
• 50 ohm input/output
• In development, orderable Q1 2020
Design Size:
20.95 mm 38.35 mm
57.15 mm
34.52 mm
Total height including
cover 9.7 mm
Tx In
I2C
ENABLE
RX OUT
RF PA
CONTROL
BYPASS
AFRX5G272
AFLP5G25641
BIAS CONTROLLER
AFSC5G26D37
T/R SWITCH
TO ANTENNA
FEEDBACK OUT
BYPASS
TX OUT /
RX IN
CONTROL
DAC0
DAC1
Final stage:
AFSC5G26D37
Driver:
AFLP5G25641
RX Module:
AFRX5G272
![Page 39: 5G mMIMO Modules with Enhanced Power and Efficiency](https://reader035.vdocument.in/reader035/viewer/2022071613/6157d529ce5a9d02d46f97c4/html5/thumbnails/39.jpg)
COMPANY PUBLIC 38
RF Circuit Collection
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COMPANY PUBLIC 39
Full Set of Design
Support Tools
On-Demand
Accessibility
Proven RF
Designs
![Page 41: 5G mMIMO Modules with Enhanced Power and Efficiency](https://reader035.vdocument.in/reader035/viewer/2022071613/6157d529ce5a9d02d46f97c4/html5/thumbnails/41.jpg)
COMPANY PUBLIC 40
Announced in October
![Page 42: 5G mMIMO Modules with Enhanced Power and Efficiency](https://reader035.vdocument.in/reader035/viewer/2022071613/6157d529ce5a9d02d46f97c4/html5/thumbnails/42.jpg)
COMPANY PUBLIC 41COMPANY PUBLIC 41
What is it?
• The RF Circuit Collection is a unique tool to quickly search for the right board, order a fully assembled board, and obtain reference circuit design files
• It resides on NXP.com and available to the general public with no special log-in required
• It provides access to over 400 reference circuits
− 60 orderable board part#s with distributor inventory
− 80 downloadable design files
− Quick access to request hundreds of other assembled specialty boards
![Page 43: 5G mMIMO Modules with Enhanced Power and Efficiency](https://reader035.vdocument.in/reader035/viewer/2022071613/6157d529ce5a9d02d46f97c4/html5/thumbnails/43.jpg)
COMPANY PUBLIC 42
RequestSpecialty Boards
Go
to
www.nxp.com/RFCollection
SearchFrequency
Power
Gain
Voltage
DownloadDesign Files
OrderFully
Assembled
Boards
RF Circuit Collection
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COMPANY PUBLIC 43
What’s inside the zip file?
![Page 45: 5G mMIMO Modules with Enhanced Power and Efficiency](https://reader035.vdocument.in/reader035/viewer/2022071613/6157d529ce5a9d02d46f97c4/html5/thumbnails/45.jpg)
COMPANY PUBLIC 44
Orderable
Part#
Design
File
Not Rec
For New
Design
Specialty
BoardBuy Direct
X X
X
X X
X
X
RF Circuit Collection
Remember:
All boards with the
button have orderable NXP
part numbers. Examples:• MRF101AN-27MHZ
• AFIC901N-135MHZ
• AFV10700H-1090
All others can be special
ordered directly from NXP
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NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2019 NXP B.V.