6/6/2014 nasa workmanship standards 1 esd stress test models josé d. sancho
TRANSCRIPT
04/10/23NASA Workmanship Standards1
ESD Stress Test ModelsESD Stress Test Models
José D. Sancho
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Introduction Introduction
General CommentsWhat is an ESD Sensitivity Level?How is it obtained?Why is it important to the user?Why different test models?How we can reduce ESD related failures
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AgendaAgenda
The human body model (HBM) The machine model (MM) The charge device model (CDM)
– Robotic (Real) CDM (R-CDM)– Socketed CDM (SDM)
Damage differences between models Transmission Line Pulse (TLP) stress testing Reasons for CDM/TLP current emphasis Questions
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Overview Overview ESD standard test models define the ESD
sensitivity level of electronic parts. Their Significance to the different
sensitivity levels used in industry.FA recognition of the model responsible
for an ESD failure event.
CDMTLP
MM
HBM
ESD Models: (differences & interrelation)
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The Human Body Model (HBM)The Human Body Model (HBM)
Simulates an Electrostatic Discharge from the human body to a device (e.g. electronic component).
Courtesy of Botron Co.
•Most commonly used model• Best understood by operators• Best controlled by Equipment and Training
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HBM Test CircuitHBM Test Circuit
Basic HBM Test Circuit
HV Supply
100 Meg SW1
SW2
1.5 K
10 K-10 Meg
100 pf
DUT IPS
IPR 500 Ω
Courtesy of ESDA
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HBM WaveformsHBM Waveforms
Stress Waveform Used for HBM ESD Testing
ANSI/ESD STM5.1-2001
ANSI/ESD STM5.1-2001
ANSI/ESD STM5.1-2001
Current Waveform through a shorting wire
Older waveform.
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Typical HBM Typical HBM Generated FailuresGenerated Failures
2000X100XCourtesy of JPL Scott M. Hull NASA/GSFC
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The Machine Model (MM)The Machine Model (MM)
Originated in Japan Discharge from Equipment or Small Tools to a Device Simulates some ESD events in Automatic Equipment Repetitive, faster and more severe than the HBM Mostly used in the design of Automatic Handling
Equipment and ESD-safe tools
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Original MM Circuit & WaveformOriginal MM Circuit & Waveform
HV Supply
SW1
SW2
100 Meg
10 K-10 Meg
200 pf
DUT
500 nH
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ESDA Machine Model CircuitESDA Machine Model Circuit
HV Supply
SW1
SW2
100 Meg
10 K-10 Meg200 pf
DUT500 ΩShort
IpS IpR
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ESDA MM Test WaveformsESDA MM Test WaveformsANSI/ESD STM5.2-1999ANSI/ESD STM5.2-1999
400 v discharge through a shorting wire 400 v discharge through a 500 Ω resistor
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Typical MM ESD Stress FailureTypical MM ESD Stress Failure
Scott M. Hull NASA/GSFC
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The Charge Device Model (CDM)The Charge Device Model (CDM)Simulates Electrostatic Charge transfer from
a Device.Two sub-models are used R-CDM & SDMTest repeatability between Test-Sets has been
a problem.Per ESDA Statistics, 90% of all field failures
are caused by CDM ESD events.Failures are typically at the core of the
Device
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Charge Device Model CircuitsCharge Device Model Circuits
Rc
Rd1 Rd2Rdn
Ld1Ld2 Ldn
Sw1
Rd
Ld
Cd
Sw1
Rc
Device with One Point Discharge
Device with Multiple Discharge Paths
Cd1Cd2 Cdn
Rc = Resistance to Ground. Rd, Ld, Cd = Resistance, Inductance & CapacitanceIn the Discharge Path.
DUTDUT
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ESDA CDM Test WaveformESDA CDM Test Waveform
ANSI/ESD STM5.3.1-1999
Waveform for the verification Modules using a 3.5 GHz BW
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Typical CDM generated failuresTypical CDM generated failures
4600x
8600x
Courtesy of JPLCourtesy of JPLCourtesy of JPLCourtesy of JPL
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Typical CDM Generated FailureTypical CDM Generated FailureCourtesy of Frederick Felt GSFC Part Analysis Lab.
ESD event (~1 KV) shown at arrow after parallel Polishing
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Models ComparisonsModels ComparisonsESD Models ZD RC CD (pf) LD (μH) ΕS (μJ) 5τ (ηs) Pave (W) IPS (A)
Vc = 200 V Typ. # Req # Req # Typ # ½CV2 5ReC Ε/τeff V/Re
HBM 0 1500 100 0 2 750 3 0.13
MM 55 2 200 5.0E-07 4 160 25 3.5
CDM 42 25 15 1.0E-08 0.3 5 30 3
ESD Models ZD RC CD LD ΕS in μJ 5τ in ηs Pave (W) IPS
Vc = 1000 V Typ.# Req # Req # Typ # ½CV2 5ReC Ε/τeff V/Re
HBM 0 1500 100 0 50 750 ~67 0.67
MM 55 2 200 5.0E-07 100 160 625 17.5
CDM 42 25 15 1.0E-08 7.5 5 >750 15
Courtesy of ESDA
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Transmission Line Pulse (TLP)Transmission Line Pulse (TLP)
Used By IC Designers since 1985 to evaluate ESD protection schemes.
Simulates HBM with very short pulses.Allows non-destructive & latch-up issues
testing.Provides better results on a controlled
simulation of the SDM.
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TLP Design MethodologiesTLP Design Methodologies
Current SourceTime Domain ReflectometerTime Domain TransmissionTime Domain Reflection and Transmission
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Current Source TLPCurrent Source TLP
ANSI/ESD SP5.5.1-2004
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Time Domain Reflectometer TLPTime Domain Reflectometer TLP
ANSI/ESD SP5.5.1-2004
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Time Domain Transmission TLPTime Domain Transmission TLP
ANSI/ESD SP5.5.1-2004
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TDR&T TLPTDR&T TLP
ANSI/ESD SP5.5.1-2004
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SummarySummary
Models establish Benchmarks for ESD Sensitivity.
Different Models are used under different environments.
Models provide help to prevent and analyze ESD Failures
Please send feedback to: jsancho.1@[email protected]
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Where to Get More InformationWhere to Get More Information
WEB searches under “ESD Models”ESDA publicationsConsulting services provide Advice on
tough ESD problems and Solutions.
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ReferencesReferences1. ANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)2. ANSI/ESD STM5.2-1999 ESD Sensitivity Testing (MM)3. ANSI/ESD STM5.3.1-1999 ESD Sensitivity Testing (CDM)4. ANSI/ESD SP5.2.2-2004 ESD Sensitivity Testing (SDM)5. ANSI/ESD SP5.5.1-2004 ESD Sensitivity Testing (TPL)6. Scott M. Hull, “ESD Failures in Thin-Film Resistors”
NASA/Goddard Space Flight Center 7. http://qa.jpl.nasa.gov/esd/8. http://esdsystems.com/whitepapers/9. http://www.semiconfareast.com10. http://www.ce-mag.com/archive/01/09/henry.html11. http://www.ce-mag.com/ce-mag.com/archive/
01/03/0103CE_046.html