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MD-50H12NBC50-inch (diag.) HD Plasma Display Panel Module

SpecificationsPower Source 100-240 V AC, 50 / 60 Hz

Plasma Display panel Drive method : AC type 50-inch,

16:9 aspect ratio

Screen size 1,106.46 mm (W) × 622.08 mm (H)

No. of pixels 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]

Weight approx. 18.5 kg net

Operating ConditionsTemperature 32°F - 104°F (0 °C - 40 °C)

Humidity 20 % - 80 %

Notes: · Design and specifications are subject to change without notice. Weight and dimensions shown are approximate.

ORDER NO.PDP0905001CE

1 Safety Precautions 3 1.1. General Guidelines 3

2 Prevention of Electrostatic Discharge (ESD) toElectrostatically Sensitive (ES) Devices 4

3 About lead free solder (PbF) 5 4 PCB Structure and List 6 5 Set Serial Label Information 7 6 Troubleshooting guide 8

6.1. How to identify SOS Signal 8

6.2. Timing Chart of LED Blinking 8

6.3. How to Display Internal Test pattern 9

6.4. No Power 10

6.5. No Picture 10

6.6. Local screen failure 11

7 Adjustment Procedure 12 7.1. Driver Set-ups 12

7.2. Initialization Pulse Adjust 13

7.3. P.C.B. (Printed Circuit Board) exchange 13

7.4. Adjustment Volume Location 14

7.5. Test Point Location 14

8 Block Diagram 15 8.1. Main Block Diagram 15

9 Replacement Parts List 17 9.1. Replacement Parts List Notes 17

9.2. Parts List 17

CONTENTS Page Page

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1.1.1. Leakage Current Cold Check 1. Unplug the AC cord and connect a jumper between the two

prongs on the plug. 2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinetpart on the equipment such as screwheads, connectors,control shafts, etc. When the exposed metallic part has areturn path to the chassis, the reading should be between1MΩ and 5.2MΩ.When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage Current Hot Check (SeeFigure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use anisolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µFcapacitors, between each exposed metallic part on the setand a good earth ground such as a water pipe, as shown inFigure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or moresensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure thevoltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of theabove measurements.

6. The potential at any point should not exceed 0.75 voltsRMS. A leakage current tester (Simpson Model 229 orequivalent) may be used to make the hot checks, leakagecurrent must not exceed 1/2 milliamp. In case ameasurement is outside of the limits specified, there is apossibility of a shock hazard, and the equipment should berepaired and rechecked before it is returned to thecustomer.

1 Safety Precautions1.1. General Guidelines 1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit. 2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed. 3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

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2 Prevention of Electrostatic Discharge (ESD) toElectrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damagecaused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparableconductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will be installed.Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient todamage an ES device).

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MD-50H12NBC

3 About lead free solder (PbF)Note: Lead is listed as (Pb) in the periodic table of elements.In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’dsuggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pbsolder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow ontothe opposite side. (see figure below)

Suggested Pb free solderThere are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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4 PCB Structure and List

Board Name FunctionP Power SupplyD Interface & Digital ProcessC1 Data Driver (Lower Right)C2 Data Driver (Lower Center)C3 Data Driver (Lower Left)SC Scan DriveSU Scan Drive out (Upper)SD Scan Drive out (Lower)SS Sustain Drive

SS2 Sustain Connector out

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5 Set Serial Label Information

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6 Troubleshooting guide6.1. How to identify SOS Signal[Function]

When an abnormality has occurred in the PDP module, the protection circuit operates and reset to the stand-by mode. At thesame time, the defective P.C.Board can be indicated by the number of the pulse at Pin 17(LED_R) of D6 connector on D Board.

By using this tool (V1 board), the indication of pulse is shown to the blinking of red LED.(Pluse High = LED light, Pulse Low light off)

Tool name Part number Supply period Supply routeV1 board TNPA3199 until end of AUG /2009 Normal spare part route (chargeable)

[How to check]Connect the V34 connector on V1 board to D6 connector on D board with Lead Wire (V1-D).And then turn on the power of PDP module.If power is shut down by protection circuit, the red LED of V1 board will be shown as blinking.(If the unit keeps power on, the green LED of V1 board will be lighting.)

6.2. Timing Chart of LED Blinking 1. Subject

Information of LED Blinking timing chart. 2. Contents

When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, thedefective block can be identified by the number of blinkes of LED on V1 board.

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6.3. How to Display Internal Test pattern

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6.4. No PowerPreparation

The V1 board is connected with D board (D6 connector).First check point

There are following 3 states of No Power indication by power LED. 1. No lit 2. Green is lit then turns red blinking a few seconds later. 3. Only red is lit.

6.5. No Picture

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6.6. Local screen failurePlasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.

Fig-1

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7 Adjustment Procedure7.1. Driver Set-ups

7.1.1. Item / Preparation 1. Input a white signal of RGB signal generator.

7.1.2. AdjustmentsAdjust driver section voltages referring the panel data on the panel data label.

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7.2. Initialization Pulse Adjust 1. Input a white signal of RGB signal generator. 2. Adjust the indicated test point for the specified wave form.

Test point Volume LevelT2 TPSC1 (SC) VR16601 (SC) 210V ± 10V

at 100µs period of the initialization pulseslope by VR16601

7.3. P.C.B. (Printed Circuit Board) exchange7.3.1. Caution 1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

7.3.2. Quick adjustment after P.C.B. exchangeP.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus ± 2V R737 (P) *SC Board Vad TPVAD (SC) -180V ± 2V VR16600 (SC)

Vscn TPVSCN (SC) Vad_base:+145V±4VGND_base: -35V±6V

Fixed

Vset TPVSET (SC) 290V ± 9V FixedSS Board Ve TPVE (SS) Ve ± 2.5V Fixed *

Vda TPVDA (P) 60V +1V , -2V Fixed

*See the Panel label.

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7.4. Adjustment Volume Location

7.5. Test Point Location

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8 Block Diagram8.1. Main Block Diagram

HOTCOLD

CONTROL SIGNAL +15V(P)

VIDEO DATA

+15V(P)

D20

FSTBY+15V

SS2

SUSTAIN DRIVE

RELAY

SUB-FIELD PROCESSOR

POWER SUPPLY

VSET GEN.

RECTIFIER

SC46

DATADRIVER

DATADRIVER

C22

SCAN OUT (UPPER)

SU11

+5V(P)

+5V(P)

P25

+5V(P)

C2C1

DATADRIVER

+15V(P)

P34

+5V

(P)

DATADRIVER

EEPROM

SU41

P11

VSUS

MAIN SW1UNREG_15V

POWERFACTORCONTROL

SCANDRIVER

SOS8_SS

Vda

SS22

+5V(P)

SCAN DRIVESC

D32

DATA DRIVER (LEFT)

C10

SS

10bit L

VD

S

STBY5V

PS SOS4

+5V(P)

C35

PANEL MAIN ON

SOS8_SS

DATA DRIVER

MAIN SW2P

AN

EL S

TB

Y_O

N

DISCHARGECONTROL

RE

AD

Y

BUFFER

P

SS23

POWER MICOM

SC20

P35

SOS7_SC2

SD46

Vda

SU

UNREG_FSTB

SO

S8_S

S

DATADRIVER

SD

D25

VSUS

P60

SC-BOARDENEGRY RECOVERYSOS DETECT

SC-BOARDFLOTING PARTSOS DETECT

C32

+5V(P)

DATA DRIVER (CENTER)

SUSTAIN CONTROL

H/V SYNC CONTROL

VIDEO DATA

SD11

SOS6_SC1

SS-BOARDSOS DETECT

SC41

PLASMA AI PROCESSOR

SCANDRIVER

SUSTAIN

SUSTAIN CONTROL

SOS7_SC2

SUSTAINVOLTAGERECTIFIER

SOS4_PS

SS3

(24bit)

DATADRIVER

D31

FORMAT CONVERTER,

CONNECTOR

VSUS GEN.

SS3

VSCAN GEN.

+5V

(P)

AR

AR

M

VIDEO DATA

DATADRIVER

DATADRIVER

SC42

SOS8_SS

DATA DRIVER (RIGHT)

C11

LVDS RX

SU

ST

AIN

CO

NT

RO

L

SOS6_SC1

SCAN OUT (LOWER)

C20

SOS4_PS

F_STBY_ON

+15V(P)

+5V(P)

SS24

+5V(P)

CPG with SS

P7

SC2

VIDEO DATA

SS11

(24bit)

VE GEN.

SOS7_SC2

STBY5V

(LOWER)

Vda

SD42

POWER SOS

VSUS

Vda

SCAN CONTROL

GenX7

D5

VSUS

SOS6_SC1

SCAN CONTROL

Vda

SOS8_SS

DATADRIVER

ON/OFF CONTROL

RECTIFIER

Vda

P-BOARDSOS DETECT

MEMORY

+15V(AUDIO)

P2

P9

SUSTAIN CONTROL

PROCESSVOLTAGERECTIFIER

STBY5V

DDR

FLASH

STANBYVOLTAGERECTIFIER

CONTROLPULSE

P6

Vda

PANEL MICOM

DATADRIVER

DATADRIVER

C33

PLASMA AI

+5V

(P)

FSTBY+15V

RESET

+15V(P)

C21

D

C3

MD-50H12NBCMain Block Diagram

MD-50H12NBCMain Block Diagram

MD-50H12NBC

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NOTE

MD-50H12NBC

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Ref.No.

Part No. Part Name & Description Pcs Remarks

PCB LSEP1279WMHB CIRCUIT BOARD P 1

PCB TXNC111ABG CIRCUIT BOARD C1 1

PCB TXNC211ABG CIRCUIT BOARD C2 1

PCB TXNC311ABG CIRCUIT BOARD C3 1

PCB TZTNP011ABG CIRCUIT BOARD D 1

PCB TXNSC11ABG CIRCUIT BOARD SC 1

PCB TXNSD11ABG CIRCUIT BOARD SD 1

PCB TXNSS11ABG CIRCUIT BOARD SS 1

PCB TXNSS211ABG CIRCUIT BOARD SS2 1

PCB TXNSU11ABG CIRCUIT BOARD SU 1

THEL069J SCREW (TU:2 INLET:3CONT:1)

29

THEL069J SCREW (TU:2 INLET:3CONT:1)

33

XYN4+F10FJ SCREW(SUSD:4) 4

XYN4+F10FJ SCREW(HANGERE METALKARI)

8

TSXL519 CABLE(SU11-SD11/C10-C20)

2

TSXL719 CABLE(D20-SC20) 1

TSXL737 CABLE(C22-C32) 1

TSXL779 CABLE(C11-D31) 1

TSXL780 CABLE(C21-D32) 1

MD50H12M1J PLASMA DISPLAY PANEL 1

9 Replacement Parts List9.1. Replacement Parts List Notes

9.2. Parts List

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NOTE

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