a new beginning for the electronics assembly industry wgraphiclib)/apr2002platform.pdf/… · the...

Automation in Electronic Assembly 1

CORPORATE/EXECUTIVE MESSAGE

MITA (P) NO 076/05/2000 A Quarterly Publ ication By Universal Instruments Corporation ISSUE 8 Apri l 2002

W e have all been affected by the severity of thisparticular business cycle. Anyone who has workedin our industry is well aware that we have uniquely

dramatic upturns and downswings, normally on 4 to 5 year cyclespeak-to-peak. Our last growth cycle alone was nearly double that.However, the positive news is that it will get better.

What does that mean for Universal Instruments?

We are extremely well positioned. Universal is a lean, focusedorganization that has a great portfolio of current generationproducts and leading edge new developments being prepared forlaunch. We have an industry-leading support infrastructure anda solid commitment to the Asian market with localized sourcingand manufacturing.

Universal Instruments, with strong Dover support, is committed tobeing a leader in the field. We believe the following attributes makeus stand out:

• Delivery of process capability with defined and guaranteed parameters• Size to afford 10% plus continued research and development• Consistent, customizable and supportable products delivered on a

worldwide basis

Our industry continues to evolve into a leveled structure. UniversalInstruments’ family of equipment, processes and systems solutionsdeliver real benefits and value. Our products, services, corporatesupport and Asian manufacturing are pertinent to Universal’s growthand success. We feel that our equipment must be assembled andsupported within our major region of growth.

We are poised to be in the right place at the right time. The Asianmarket has great growth opportunity. With a strong sales, service andapplications team on the ground, we look forward to increased marketshare in the Asia Pacific region and throughout the globe.

Gene Heiser,Vice President, Corporate Sales and Support

A New Beginning for the

Electronics Assembly Industry

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Automation in Electronic Assembly2

WHAT’s NEW

Technical SessionsThe comprehensive technical sessions covered areas such as linelevel solutions, the GSM® Platform roadmap, the PolarisAssembly cell and other topics. Gintic, Dek and Vitronics-Soltecwere also invited to present at the meeting. The presentationsallowed everyone to get updated on the latest product offeringsand get a better understanding of line level solutions thatUniversal Instruments now has available.

As part of the technical training, teams were tasked with solvinga case study for an actual customer line opportunity. Followingthat, formal presentations were made to the UniversalInstruments executives in attendance at the meeting. Thisexercise reinforced the teamwork required to be successful intoday’s competitive market, and allowed the entire group to seedifferent solutions presented for various customer applications.

2002 Asian Sales Meeting in Bintan

The Asian Sales Meeting was held over the weekend of February 1st -4th in Bintan, Indonesia. The entire Asian sales team was on hand toparticipate in a combination of technical training sessions and outdoor

team-building exercises. To top it off, Universal’s president and vice-president(Corporate Sales and Support) made their way from the United States toattend the meeting.

A team-building exercise was used to kick off the meeting. Members had agreat opportunity to reacquaint themselves with each other. The next twodays provided an opportunity for presentations and team-building activities.

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Outdoor team-building exercisesUsing the Team Challenge Pyramid (a 25-meter high tower)and other low level tasks, the Asian Team was able to identifyindividual strengths and weaknesses, as well as learn thattheir teammates were there to support them as they tookon a new challenge.

The exercise definitely brought the Asian team together, andthe various challenges taught the team how to communicate,overcome difficult challenges, develop leadership, negotiateeffectively and think creatively to solve problems. Moreimportantly, the exercise motivated the Asian Team to meetthe challenges ahead.



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There was also an award ceremony held at the meeting. ZhangDa Cheng won “New Employee of the Year”, Michelle Teo waschosened as “Asia Team Employee of the Year” and Taiwan wasselected for “Asia Team of the Year”. Albert Wong received theaward on behalf of Michelle Teo.

The Asian Team, with a renewed energy andspirit, is now armed and ready, both technicallyand physically, to meet your requirements andassist you in overcoming the challenges youface in your businesses!

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Christophe G Hill,Corporate Account Manager

Beginning in March 2002, Product Perspective will becomemore easily available to our expanding customer marketand will be electronically distributed as part of Universal’s

larger, monthly email publication titled, Automation E-News.

With this change, Universal Instruments will bring you a broadervariety of information on a monthly basis. We will continue tooffer technical tips, details on available retrofits, and software

update information, and now we will combine that with articleshighlighting new products and services, interviews withindustry professionals and other valuable information.

Subscribers to Product Perspective will not automatically beginreceiving Automation E-News. If you do not already subscribeto Automation E-News, please visit www.uic.com/enews tosubscribe and configure your newsletter.

Product Perspective Combines with Automation

E-News for Faster Release of Universal Information


SOUTH EAST ASIA


Leadership Training in Asia

Several of Universal’s Asian offices recently participatedin a two-day leadership training workshop. The sessions

were held in Singapore, Shanghai, Shenzhen and Taipei, andwere taught by Universal Employee Training Manager ChrisPowers. During the sessions, attendees explored the subjectof leadership and discussed both what makes a leadersuccessful and how to incorporate those skills into their ownleadership styles. In addition they discussed the impactchange can have on a business and its employees.

Attendees also learned new ways to approach problems andopportunities, and discussed how to implement these intheir day-to-day activities. Both experienced managers andthose new to leadership positions attended the classes. Themore experienced attendees often shared their real-life

Find out what Universal will be showcasing at

SEMICON Singapore 2002

Do stop by booth 1424 on level 6 at the Suntec SingaporeInternational Convention and Exhibition Center to see the new

options on Universal’s GSMxs Platform and many other solutionsUniversal has developed. Universal will debut the new integratedWafer Feeder, offering on-line wafer processing and shuttle deliveryof die for gang picking. We will be highlighting our newest waferfeeder options. These options include 300mm wafer feedingcapability and die inversion of bumped devices, enabling thefeeding of flip chip devices directly from large wafers. The waferfeeder is equipped to process flip chips and bare die with the samemachine setup

Universal will also showcase the GSMxs Platform and its new Look-Before-Pick software that offers precise “find” functionality thatensures optimal accuracy. This machine uses an upward-lookingcamera to process components on-the-fly, which also confirms asuccessful pickup.

Universal is committed to empowering your business. Let us showyou how we can do that.

In conjunction with SEMICON Singapore, Universal will be hostinga Technology Seminar on “Optoelectronics”, “Lead-Free Process”and “Wafer Bumping” - May 8 & 9 from 9:30am - 12pm. Lunch willbe provided. Please register at [email protected]

If you haven’t registered for SEMICON Singapore or would like moreinformation visit:http://events.semi.org/semiconsingapore/V30/index.cvn.

Automation in Electronic Assembly 5Automation in Electronic Assembly 5

HONG KONG/CHINA

Beijing

Seminar

examples with the others, which added value to the classes. Thesesame topics are being offered to managers in the Binghamton areaand other locations. Attendees walked away with valuableinsights. This, in turn, will allow them to meet customers’ needsmore effectively.

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PRODUCT & TECHNOLOGY


Virtual Process EngineerTM

with Intelligent Agent

U niversal’s Virtual Process Engineer withIntelligent Agent (VPE with IA) is an innovativetool that is adding the next level of intelligence,

efficiency and accountability to Universal’s total linesolution. VPE is constantly matching your AOI data withassociated line data to feed into Universal’s expertsystem which, in turn:

• automatically isolates defects,• determines a course of corrective action,• recommends the proper procedure to the right people,• and verifies that the problem is solved.

Universal’s VPE with Intelligent Agent:• brings Universal’s Surface Mount Laboratory and

applications engineering problem-solvingknowledge directly to the product line.

• builds not just “detection,” but also “correction” andverification” into your AOI system.

• takes corrective action targeted by Intelligent Agent,our custom-designed expert system.

• improves utilization and productivity.• dramatically shortens the problem-solving cycle

time in electronic assembly manufacturing.• enables the customer to better utilize their staff.

Universal has been honored for its significant achievement in creatingthe Radial 8XT through hole assembly solution. It received theprestigious SMT Vision Award in the category of Assembly Tools. Since

1992, SMT Magazine’s Vision Award has recognized companies for theircontributions in providing products or services that excel in innovation, costsavings and overall excellence.

The Radial 8XT is the premier solution for high-speed, flexible radialassembly. It offers the world’s highest insertion rate at 20,000 insertionsper hour (0.18 seconds per insertion), with actual throughputs reachingnearly the same rate. Customers can benefit from the highest throughputavailable, while placing this machine in their surface mount lines for fullautomation of mixed technology.

The Radial 8XT also uses brushless DC servo drives for high reliability, as wellas an uninterruptable power supply that provides continued operation underpower brownouts/blackouts. This machine achieves 95% intrinsic availabilityand 300ppm insertion reliability or better.

Radial 8XT

Wins

Prestigious

SMT Vision

Award

Universal Instruments introduces the next step in real-time process control....intelligence!

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Automation in Electronic Assembly 7Automation in Electronic Assembly 7

Exploring Component

Feeding AlternativesBy Jacques Coderre, Product Manager of Universal’s Advanced Semiconductor Assembly Division

In traditional circuit board assembly, components arepresented to the pick and place machine in either tapeor trays. With the convergence of component and circuit

board assembly, alternate component presentationmethods are increasingly being used. Telecommunicationsmodules, such as bluetooth modules, are good examplesof the converging assembly processes. A typical moduleassembly consists of one, two or three active devices and30-50 passives. As such, it looks like traditional circuitboard assembly but with the addit ion of ac tivesemiconductor devices. Although these devices may betaped, they are typically packaged in waffle packs or pickeddirectly from wafers.

The presentation method chosen depends on cost andlogistics issues, as well as the customer’s experience andparadigms. In general, small size devices, with high waferyields and high volumes, are picked directly from wafers. Highperformance devices, which are large and lower yielding, aretypically die sorted into waffle packs, partly because manyof these types of devices go through a performance sort ofsome kind and it becomes very difficult to handle variouslevels of quality on a single wafer. Some assemblers chooseto remain consistent in component presentation for non-technical reasons, such as ease of training, manufacturingflexibility and complexity of shop floor control.

By picking directly from wafers, the cost of the die sortingoperation is eliminated. Die sorting costs are typicallyestimated at $0.07 to $0.10 per die, based on an equipmentcost of 200-250K. Prior to dicing, wafers are mounted onto afilm frame, a sticky film material is used as backing duringthe dicing operation. Bad die are “ink dotted” or identified ina computer wafer map. Because the die “age” on the filmframe and can become difficult to remove, it is well suitedfor high volume, low mix operations that consume dierapidly. The smaller the die, the less wafer transfer time isneeded and therefore, the higher the throughputs obtained.

For users of GSM Platform machines, all die feeding optionsare available. Universal’s second generation wafer feeder,shown here, can handle 25 wafers of all sizes, up to 300mm.Stop in at Semicon Singapore and see for yourself how youcan benefit from the flexibility of the GSM Platform.


For more information about Universal products and services, please call (65) 485-8360 or check out Universal’s website at www.uic.com

CUSTOMER FOCUS

SIIX - The Fast-Growing Innovative EMS

Flip Chip Assembly Training WorkshopJun 12 – 14, 2002Singapore

This three-day course is meant to be an introduction and demonstration toflip chip processes and equipment. The approach will be seminar based, withhands-on sessions. This includes utilizing the equipment within GINTIC toprocess actual flip chip components like placement, reflow, underfill andcuring. Complete analysis, including X-ray, scanning acoustic microscopyinspection and microsectioning will also be demonstrated.

Attendees would typically have had exposure to the SMT assembly processand wish to extend their understanding to flip chip assembly.

For more information, kindly contact:Stanley Chen, SMT/ASA Business Development ManagerTel: 65 6485 8325Mobile: 65 9791 2802

SEMICON Singapore 2002May 7 – 9, 2002Suntec Singapore International Convention& Exhibition Center

Technology SeminarMay 8 - 9 (9.30am -12pm)Singapore International Convention& Exhibition Center (SICEC)RSVP: [email protected] or call 65 6485 8300

Suzhou Technical Center OpeningMay 16, 2002

Suzhou Technology SeminarMay 17, 2002

Thailand SeminarJuly 5, 2002

SIIX, formerly known as Sakata Inx InternationalCorp., was established in July 1992 as a whollyowned subsidiary of Sakata Inx Corporation. Thecompany has since launched many new

business and was renamed SIIX Corp. in July1998. SIIX has established a global network ofprocurement, logistics, sales and marketing.

This division deals with audio equipment andits mechanical assemblies, computer peripherals, communications

and household appliances. It also undertakes PCBA for mobilephones and other industrial and consumer electronics throughcircuit assembly subsidiaries and joint ventures in Asia and otherregions. SIIX uses its network of overseas bases to serve as acomprehensive outsourcer meeting customers’ needs.

“We are glad to be working with a professional equipmentmanufacturer like Universal Instruments Corporation to meet theneeds of our customers,” commented Mr. Matsushima, Set FactoryGroup, Head Quarter Manager, SIIX EMS (THAILAND) CO., LTD. “Wepurchased the most enhanced, productive and reliable Radialinsertion machine, RADIAL 8XT, to produce high-quality products

for our valuable customers. We look forward to the introductionof new technology, equipment and enhanced businessopportunities with Universal and SIIX EMS world wide.”

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Contact Information:SIIX EMS (THAILAND) CO., LTD TEL +66-2-463-0118(ext300) DIRECT +66-2-462-8554 FAX +66-2-464-2773

H/P +66-1-811-1090 E-Mail [email protected]

CALENDAR OF EVENTS

More listings can be found at http://www.uic.com/wcms/WCMS.nsf/index/Tradeshows_4.html

a new beginning for the electronics assembly industry wgraphiclib)/apr2002platform.pdf/… · the...

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