a70 product specifications - paoli · 2020. 4. 8. · lte: +23dbm (power class 3) application...
TRANSCRIPT
A70
Product Specifications
Issue 1.3
Date 2018-10-26
Neoway Product Document
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd i
Copyright © Neoway Technology Co., Ltd 2018. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior written
consent of Neoway Technology Co., Ltd.
is the trademark of Neoway Technology Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
This document provides guide for users to use A70.
This document is intended for system engineers (SEs), development engineers, and test engineers.
THE INFORMATION IN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE DUE TO
PRODUCT VERSION UPDATE OR OTHER REASONS.
EVERY EFFORT HAS BEEN MADE IN PREPARATION OF THIS DOCUMENT TO ENSURE ACCURACY
OF THE CONTENTS, BUT ALL STATEMENTS, INFORMATION, AND RECOMMENDATIONS IN THIS
DOCUMENT DO NOT CONSTITUTE A WARRANTY OF ANY KIND, EXPRESS OR IMPLIED.
Neoway provides customers complete technical support. If you have any question, please contact your
account manager or email to the following email addresses:
Website: http://www.neoway.com
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd ii
Contents
About This Document ................................................................................... 1
Scope ................................................................................................................................................. 1
Audience ............................................................................................................................................ 1
Change History ................................................................................................................................... 1
Conventions ....................................................................................................................................... 2
Related Documents ............................................................................................................................ 2
1 About A70 .................................................................................................. 3
1.1 Product Overview ......................................................................................................................... 3
1.2 Block Diagram .............................................................................................................................. 5
1.3 Basic Features ............................................................................................................................. 6
2 Compliant Standards ................................................................................. 9
3 Module Pins ............................................................................................. 10
3.1 Pad Layout ................................................................................................................................. 10
3.2 Pin Description ............................................................................................................................ 11
3.3 MUX Interfaces .......................................................................................................................... 20
4 Electric Feature and Reliability ................................................................ 23
4.1 Electric Features ........................................................................................................................ 23
4.2 Temperature Feature .................................................................................................................. 26
4.3 ESD Protection ........................................................................................................................... 27
5 RF Features ............................................................................................. 28
5.1 Operating Bands ........................................................................................................................ 28
5.2 TX Power and RX Sensitivity ..................................................................................................... 29
5.3 GNSS Feature ............................................................................................................................ 32
6 Mechanical Features ............................................................................... 33
6.1 Dimensions ................................................................................................................................. 33
6.2 Label ........................................................................................................................................... 34
6.3 Three Views ............................................................................................................................... 34
6.4 Package ..................................................................................................................................... 35
6.4.1 Reel ................................................................................................................................... 35
6.4.2 Moisture ............................................................................................................................. 36
7 Mounting A70 onto the Application Board ................................................ 37
7.1 Application Foot Print ................................................................................................................. 37
7.2 Stencil ......................................................................................................................................... 38
7.3 Solder Paste ............................................................................................................................... 38
7.4 SMT Furnace Temperature Curve .............................................................................................. 38
8 Safety Recommendations ....................................................................... 40
A Conformity and Compliance .................................................................... 41
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd iii
A.1 Approvals ................................................................................................................................... 41
A.2 Chinese Notice........................................................................................................................... 41
A.2.1 CCC Class A Digital Device Notice ................................................................................... 41
A.2.2 Environmental Protection Notice ....................................................................................... 41
B Abbreviation ............................................................................................ 42
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd iv
Table of Figures
Figure 1-1 Block Diagram .................................................................................................................. 5
Figure 3-1 Pin Definition ................................................................................................................... 10
Figure 6-1 A70 dimensions .............................................................................................................. 33
Figure 6-2 A70 label ......................................................................................................................... 34
Figure 6-3 Three views of A70 ......................................................................................................... 34
Figure 6-4 A70 reel packaging ......................................................................................................... 35
Figure 6-5 A70 reel dimensions ....................................................................................................... 36
Figure 7-1 Recommended PCB Foot Print ...................................................................................... 37
Figure 7-2 SMT furnace temperature curve ..................................................................................... 38
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd v
Table of Tables
Table 1-1 Variant and frequency bands .............................................................................................. 3
Table 3-1 IO definition ....................................................................................................................... 11
Table 3-2 Pin Description ................................................................................................................. 12
Table 3-3 MUX pins .......................................................................................................................... 20
Table 4-1 Operating conditions of A70 ............................................................................................. 23
Table 4-2 Current consumption of A70 ............................................................................................. 23
Table 4-3 Current features of A70V2 ................................................................................................ 25
Table 4-4 Current features of A70V3 ................................................................................................ 25
Table 4-5 Temperature feature of A70 .............................................................................................. 26
Table 4-6 A70 ESD protection .......................................................................................................... 27
Table 5-1 Operating bands of A70 .................................................................................................... 28
Table 5-2 RF TX power of A70 ......................................................................................................... 29
Table 5-3 RF RX sensitivity of A70 ................................................................................................... 30
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 1
About This Document
Scope
This document is applicable to A70 series.
It defines the features, indicators, and test standards of the A70 module.
Audience
This document is intended for system engineers (SEs), development engineers, and test engineers.
Change History
Issue Date Change Changed By
1.0 2017-09 Initial draft Li Huixiang
1.1 2017-12
Added WCDMA B5
Updated pin definition
Updated Table 1-2
Updated dimensions of A70 and application PCB
figure.
Li Huixiang
1.2 2018-03
Added A70V3
Added GNSS features
Added currents in flight mode and sleep mode
Added operating temperature range and modified the
storage temperature range
Updated the block diagram
Li Huixiang
1.3 2018-09
Modified the pin definition according to Neoway
Module Pin Definition.
Added variant information
Deleted IO type of P6 and added P8
Changed the default function of S4 to GPIO_43
Li Huixiang
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 2
Conventions
Symbol Indication
This warning symbol means danger. You are in a situation that could cause fatal
device damage or even bodily damage.
Means reader be careful. In this situation, you might perform an action that could
result in module or product damages.
Means note or tips for readers to use the module
Related Documents
Neoway_A70_Hardware_User_Guide
Neoway_A70_AT_Command_Mannual
Neoway_A70_EVK_User_Guide
Neoway Module Reflow Manufacturing Recommendations.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 3
1 About A70
1.1 Product Overview
A70 is an automotive-grade LTE module that is developed on Qualcomm platform. It supports LTE-FDD, LTE-TDD, WCDMA, TD-SCDMA, CDMA, and
GSM cellular networks.
A70 series include multiple variants. Table 1-1 lists the variants and frequency bands supported.
Table 1-1 Variant and frequency bands
Model Variant Category Band Baseband
Chipset RF GNSS CODEC
Antenna
Switch
A70 CN Cat4
LTE FDD: B1, B3, B5, B8, B26
LTE TDD: B34, B38, B39, B40, B41
TD-SCDMA: B34, B39
UMTS: B1, B5, B8
EV-DO: BC0
CDMA 1x BC0
GSM/GPRS/EDGE: 900/1800 MHz
MDM9628 Automotive
-grade1 Optional Supported Supported
1 Automotive-grade RF: the OEMs of key RF components declare that the component complies with automotive-grade standard or they can provide PPAP report as required.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 4
EU2 Cat4
LTE FDD: B1, B3, B5, B7,B8, B20, B26, B283
UMTS: B1, B33, B5, B8
GSM/GPRS/EDGE: 900/1800 MHz
US2 Cat4
LTE FDD: B2, B4, B5, B12, B17
UMTS: B2, B4, B5
GSM/GPRS/EDGE: 850/1900 MHz
A70V2 CN Cat4
LTE FDD: B1, B3, B5, B8, B26
LTE TDD: B34, B38, B39, B40, B41
TD-SCDMA: B34, B39
UMTS: B1, B5, B8
EV-DO: BC0
CDMA 1x BC0
GSM/GPRS/EDGE: 900/1800 MHz
MDM9607 Industrial-
grade Optional
Optional, not
supported
by default
Optional,
not
supported
by default
A70V3 CN Cat4
LTE FDD: B1, B3, B5, B8, B26
LTE TDD: B34, B38, B39, B40, B41
TD-SCDMA: B34, B39
UMTS: B1, B5, B8
EV-DO: BC0
CDMA 1x BC0
GSM/GPRS/EDGE: 900/1800 MHz
MDM9628 Industrial-
grade Optional
Optional, not
supported
by default
Optional,
not
supported
by default
2 A70EU and A70US are in development phrase.
3 The frequency band is optional.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 5
A70 adopts 284-pin LGA package and its dimensions are 37 mm x 37 mm x 2.7 mm. With automotive-
grade performance, this module is well applicable to in-vehicle OEM applications.
A70 in this document refers to A70, A70V2, and A70V3 if not specified.
1.2 Block Diagram
A70 consists of the following functionality modules:
Baseband and memory
Crystal oscillation and power (VBAT_BB, VBAT_RF, VDD_1P8, AVDD_1P8, voltage drop
detection)
Digital interfaces (USIM, USB, HSIC, UART, SPI, SDIO, SDC/eMMC, GPIO, I2C, and I2S/PCM)
Analog interfaces (ADC, SGMII)
Analog audio interfaces (optional)
RF interfaces (main antenna, diversity antenna, GNSS antenna, antenna switch)
Figure 1-1 Block Diagram
Base
Band
RF transceiver
RF Section
Power
Manager
MCP
VBAT_BB
VBAT _ RF
CODEC
(Optional)
Interface
ADCAUDIO
(Optional)Control
I2SPCM
I2C
MAIN DIV GNSS
GPIOSDC
eMMCSDIOSPIUARTHSICUSBSGMII
MDIOUSIM2USIM1
LDO
LDO(Optional)
VDD _1P8
EN
Power Drop
Dectector
VBAT_BB
Switch Switch
AVDD_1P8
AVDD_1P8
(Optional)
(Optional)
19.2MHzCrystal
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 6
1.3 Basic Features
Parameter Description
Physical features
Dimensions: (37.0±0.1) mm × (37.0±0.1) mm × (2.7±0.2) mm
Package: 284-pin LGA
Weight: around 8.4g
Temperature
ranges
Operating: -30°C to +75°C
Extended: -40°C to +85°C4
Storage: -45°C to +105°C
Operating voltage VBAT_BB: 3.4V to 4.2V, TYP: 3.8V
VBAT_RF: 3.4V to 4.2V, TYP: 3.8V
Current5
Flight mode 1.24mA
Sleep Mode
GSM DRX=6: 2.2 mA
GSM DRX=9: 1.45 mA
WCDMA DRX=2: 2 mA
WCDMA DRX=9: 1.54 mA
LTE (Paging Cycle 320ms): 6.5 mA
LTE (Paging Cycle 2.56s): 1.67 mA
Operating
Current
VBAT_BB: 1.5A MAX
VBAT_RF: 2.5A MAX
VBAT_BB+VBAT_RF: 3A MAX6
MIPS processor ARM Cortex-A7 processor, 1.3 GHz main frequency, 256kB L2 cache
Memory RAM: 256MB
ROM: 512MB
Band See Table 1-1.
Wireless data rate
GPRS: Max 85.6 Kbit/s(DL) / Max 85.6 Kbit/s(UL)
EDGE: Max 236.8 Kbit/s(DL) / Max 236.8 Kbit/s(UL)
CDMA2000@1x, 1xEV-DOrA: Max 3.1 Mbit/s (DL) / Max 1.8Mbit/s (UL)
TD-SCDMA: Max 4.2 Mbit/s (DL)/Max 2.2 Mbit/s (UL)
WCDMA: DC-HSPA+, Max 42Mbit/s(DL)/Max 5.76Mbit/s(UL)
4 RF performance might not meet 3GPP/3GPP2 standards in extended temperature but it does not affect functioning.
5 Indicates current features of A70CN. For current features of other variants, see Chapter 4.
6 indicates that VBAT_BB and VBAT_RF share one power supply.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 7
FDD-LTE: non-CA cat4, Max 150 Mbit/s(DL)/Max 50 Mbit/s (UL)
TDD-LTE: non-CA cat4, Max 130 Mbit/s(DL)/Max 35 Mbit/s(UL)
Transmit power
EGSM900: +33dBm (Power Class 4)
DCS1800: +30dBm (Power Class 1)
EDGE 900MHz: +27dBm (Power Class E2)
EDGE1800MHz: +26dBm (Power Class E2)
TD-SCDMA: +23 dBm (Power Class 3)
CDMA 1X/EVDO: +23 dBm (Power Class 3)
UMTS: +23 dBm (Power Class 3)
LTE: +23dBm (Power Class 3)
Application
Interfaces
2G/3G/4G antenna, 4G diversity antenna, GNSS antenna, 50Ω impedance
Two UART interfaces, at most 4 Mbit/s
Two USIM interfaces, compatible with 1.8V/2.85V USIM cards, dual-SIM
single-standby
One USB2.0 high-speed interface
One HSIC interface, used to connect high-speed chipset
Three 15-bit ADC interfaces, detectable voltage ranging from 0.1 to 1.7V.
One SPI interface, maximum frequency of 50MHz, support host mode only
One SDIO interface, used to control WLAN
One dual-voltage SD3.0 interface, used to control SD card or 4-bit eMMC
chipset
One I2S interface, used for digital audio transmission or configured as PCM
interface
One I2C interface, used to control external sensor, host mode only
One SGMII interface, used to connect to Ethernet PHY chipset
One MDIO interface, used to control PHY chipset (multiplexed from USIM2)
Two analog audio input interfaces (only supported by variants with CODEC
chipset)
Two analog audio output interfaces (only supported by variants with CODEC
chipset)
One analog power output interface (only supported by variants with CODEC
chipset)
One general power output interface, typically output 1.8V, a maximum current
of 200 mA.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 8
13 GPIO pins, five among which support interrupt.
AT commands 3GPP Release 13
Neoway extended commands
Emergency
response ERA-GLONASS, eCall (only for A70 and A70V3)
Dedicated in-
vehicle
communications
technology
DSRC-V2V, V2P 802.11p (only for A70 and A70V3, requiring a third-party
module)
SMS PDU, TXT
Data PPP, RNDIS, ECM, RMNET
Protocol TCP, UDP, MQTT, FTP/FTPS, HTTP/HTTP(S), SSL, TLS
Certification
approval CCC, SRRC, RoSH, ISO167507
7 The tests were performed in third-party labs.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 9
2 Compliant Standards
A70 complies with the following standards:
3GPP TS 07.07 AT command set for GSM Mobile Equipment (ME)
YD 1214-2006 Technical requirement of 900/1800MHz TDMA Digital Cellular Mobile
Telecommunication Network General Packet Radio Service (GPRS)Equipment: Mobile Stations
YD 1215-2006 Testing Methods of 900/1800MHz TDMA Digital Cellular Mobile
Telecommunication Network General Packet Radio Service (GPRS)Equipment: Mobile Stations
YD 1032-2000 Limits and Measurement Methods of Electromagnetic Compatibility for
900/1800MHz Digital Cellular Telecommunications System Part1:Mobile Station and Ancillary
Equipment
YD/T 2220-2011 Technical Requirement and test method of WCDMA/GSM(GPRS) dual mode
digit mobile user equipment (phase 4)
Ministry of Industry and Information Technology PRC, Measures for the Network Access
Management of Telecommunication Equipment (2014 Amendment)
GB4943.1-2011 Information technology equipment - Safety - Part 1: General requirements
GB/T22450.1-2008 Limits and measurement methods of electromagnetic compatibility for
900/1800MHz TDMA digital cellular telecommunications system - Part 1: Mobile station and
ancillary equipment
CNCA-O7C-031:2007 Rules for Compulsory Certification of Telecommunication Equipment
Telecommunication Terminal Equipment
3GPP TS GSM Specification Set
3GPP TS WCDMA Specification Set
CDMA2000@1x,1xAdvanced,1xEV-DOrA Specification Set
3GPP TS LTE Cat4 4G Specification Set
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 10
3 Module Pins
There are 284 pins on A70 and their pads are introduced in LGA package.
3.1 Pad Layout
Figure 3-1 shows the pad layout of A70.
Figure 3-1 Pin Definition
GN
D
GN
D
GN
D
GN
D
RE
SE
RV
ED
GN
D
GN
D
GN
D
SP
I_M
ISO
RE
SE
RV
ED
VD
D_
SD
C_
PU
LL
SD
C_
DA
TA
2
SD
C_
DA
TA
0
GN
D
GP
IO_
11
UA
RT
3_
CT
S
UA
RT
3_
TX
D
GN
D
AN
T_
DIV
GN
D
RE
SE
RV
ED
GN
D
GN
D
AN
T_
GN
SS
GN
D
GN
D
SP
I_M
OS
I
EM
MC
_R
ES
ET
_N
SD
C_
DA
TA
3
SD
C_
DA
TA
1
SD
C_
CL
K
GP
IO_
10
UA
RT
3_
RT
S
UA
RT
3_
RX
D
WL
AN
_S
DI
O_
DA
TA
3
GN
D
GN
D
GN
D
GP
IO_
51
GP
IO_
52
GN
D
GN
D
GN
D
SP
I_C
S_
N
RE
SE
RV
ED
SD
C_
PW
R_
EN
SD
C_
DE
T
SD
C_
CM
D
GN
D
GN
D
WC
I_L
TE
_R
XD
WL
AN
_S
DI
O_
DA
TA
2
WL
AN
_S
DI
O_
DA
TA
1
GN
D
GN
D
RE
SE
RV
ED
RE
SE
RV
ED
GN
SS
_L
NA
_E
N
GN
D
GP
IO_
53
GN
D
SP
I_C
LK
GN
D
GN
D
GN
D
RE
SE
RV
ED
DS
RC
_S
LE
EP
_C
LK
WL
AN
_E
N
WC
I_L
TE
_T
XD
WL
AN
_S
DI
O_
DA
TA
0
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
BT
_E
N
WL
AN
_S
LE
EP
_C
LK
RF
CL
K2
_Q
CA
WL
AN
_P
WR
_E
N
WL
AN
_S
DI
O_
CM
D
RE
SE
RV
ED
RE
SE
RV
ED
UA
RT
5_
RX
D
RE
SE
RV
ED
GN
D
WL
AN
_S
DI
O_
CL
K
GN
D
RE
SE
RV
ED
UA
RT
5_
TX
D
GN
D
I2S
_M
CL
K
I2S
_R
X
I2S
_S
CLK
RE
SE
RV
ED
RE
SE
RV
ED
GP
IO_
58
GP
IO_
78
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
I2S
_W
S
I2S
_T
X
GN
D
GP
IO_
76
GP
IO_
79
GP
IO_
77
GN
D
GN
D
GN
D
GN
D
MIC
2_
P
GN
D
GN
D
GN
D
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
MIC
2_
N
EA
R2
_N
EA
R1
_P
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
MIC
1_
P
MIC
1_
N
EA
R2
_P
EA
R1
_N
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
MIC
_B
IAS
GN
D
GN
D
GN
D
GN
D
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
GN
D
I2C
_S
CL
I2C
_S
DA
AV
DD
_1
P8
GN
D
GN
D
RE
SE
RV
ED
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
RE
SE
RV
ED
GN
D
GN
D
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
US
IM2
_V
CC
RE
SE
RV
ED
SG
MII_
RX
_
N
RE
SE
RV
ED
RE
SE
RV
ED
GN
D
GN
D
US
IM2
_C
LK
SG
MII_
RX
_
P
GN
D
GN
D
GN
D
GN
D
GN
D
GP
IO_
25
GN
D
GN
D
US
IM1
_D
ET
US
IM1
_C
LK
US
IM1
_V
CC
AD
C3
AD
C1
GN
D
GN
D
US
IM2
_R
ES
ET
US
IM2
_D
AT
A
SG
MII_
TX
_
N
GN
D
GN
D
GN
D
RE
SE
RV
ED
SL
EE
P
GP
IO_
24
RE
SE
RV
ED
GP
IO_
43
US
IM1
_R
ES
ET
US
IM1
_D
AT
A
RE
SE
RV
ED
AD
C2
GN
D
GN
D
GN
D
US
IM2
_D
ET
SG
MII_
TX
_
P
GN
D
GN
D
GN
D
GN
D
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
VD
D_
1P
8
GN
D
GN
D
GN
D
GN
D
VB
AT
_B
B
VB
AT
_B
B
RE
SE
RV
ED
US
B_
ID
GN
D
GN
D
AN
T_
MA
IN
GN
D
GN
D
GN
D
RE
SE
RV
ED
RE
SE
RV
ED
RE
SE
RV
ED
GN
D
VB
AT
_R
F
VB
AT
_R
F
VB
AT
_R
F
GN
D
VB
AT
_B
B
VB
AT
_B
B
HS
IC_
DA
TA
US
B_
VB
US
US
B_
DP
GN
D
GN
D
GN
D
GN
D
PW
RK
EY
_N
RE
SE
T_
N
GN
D
GN
D
VB
AT
_R
F
VB
AT
_R
F
VB
AT
_R
F
GN
D
GN
D
VB
AT
_B
B
VB
AT
_B
B
HS
IC_
ST
B
US
B_
DM
GN
D
A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A B C D E F G H J K L M N P R S T U V W X Y AA AB AC AD AE AF AG AH AJ AK AL AM AN
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
RE
SE
RV
ED
ANTGND
CONTROL
GPIO RESERVED UIM
ADC
USB SGMII
I2C
AUDIO
I2S
WLAN UART SDC/eMMC
SPI OTHERS
POWER
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 11
3.2 Pin Description
Table 3-1 lists the definition of IO types.
Table 3-1 IO definition
IO Type
B Digital input/output, COMS level
DO Digital output, COMS level
DI Digital input, COMS level
OD Open drain
PO Power output
PI Power supply input
AO Analog output
AI Analog input
AIO Analog input/output
Level Feature
I/O Pin type Voltage Feature Output Current
Feature
P1
USIM1 interface
voltage, compatible with
1.8V/2.85V
1.8V
VIH=1.26V~2.1V
VIL=-0.3V~0.36V
VOH=1.44V~1.8V
VOL=0V~0.4V
2.85V
VIH=2V~3.15V,
VIL=-0.3V~0.57V
VOH=2.28V~2.85V
VOL=0V~0.4V
2 mA~16 mA,
adjustable at a
spacing of 2 mA
P2
USIM2 interface
voltage, compatible with
1.8V/2.85V
1.8V
VIH=1.26V~2.1V
VIL=-0.3V~0.36V
VOH=1.44V~1.8V
VOL=0V~0.4V
2.85V
VIH=2V~3.15V,
VIL=-0.3V~0.57V
VOH=2.28V~2.85V
VOL=0V~0.4V
2 mA~16 mA,
adjustable at a
spacing of 2 mA
P3 1.8V digital IO VIH min=1.2V, VIL max= 0.3V
VOH min=1.35V, VOL max= 0.45V
2 mA~16 mA,
adjustable at a
spacing of 2 mA
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 12
P4
SDC interface voltage,
compatible with
1.8V/2.85V
1.8V
VIH=1.27V~2V,
VIL= -0.3V~0.58V
VOH=1.4V~1.8V,
VOL=0V~0.45V
2.85V
VIH=1.8V~3.15V,
VIL= -0.3V~0.7V
VOH=2.1V~2.85V,
VOL=0V~0.36V
2 mA~16 mA,
adjustable at a
spacing of 2 mA
P5 HSIC interface voltage,
1.2V
VIH=0.78V~1.2V, VIL =0V~0.42V
VOH =0.9V~1.2V, VOL=0V~0.3V
2 mA~16 mA,
adjustable at a
spacing of 2 mA
P7
GPIO from power
management chipset,
1.2V/1.8V/VBAT_BB
(input power of A70
baseband)
The level is not
automatically
adjustable. There are
three grades of currents
available.
VIH=0.65*VIO~(VIO+0.3V),
VIL=-0.3V~0.35*VIO
VOH=(VIO-0.45)V~VIO
VOL=0V~0.45V
(VIO is GPIO voltage,
1.2V/1.8V/VBAT_BB)
When VIO is 1.8V
High: 0.9mA
Medium: 0.6mA
Low: 0.15 mA
P8
The level of GPIO from
power management
chipset is fixed to 1.8V.
There are three grades
of currents available.
VIH=1.26V~2.1V
VIL=-0.3V~0.63V
VOH=1.35V~1.8V
VOL=0V~0.45V
High: 0.9mA
Medium: 0.6mA
Low: 0.15 mA
Table 3-2 Pin Description
Signal Pin I/O Function Level
Feature Remarks
Power Interfaces
VBAT_BB
AE1, AG1,
AD2, AF2,
AC3, AE3
PI Power input of A70
baseband Vmax=4.2V Peak current is up to 1.5A.
VBAT_RF
T1, V1,
X1, U2,
W2, Y2
PI RF power input Vmax=4.2V Peak current is up to 2.5A.
VDD_1P8 R3 PO 1.8V power output Vnorm=1.8V
Imax=200mA
Used only for level shifting
and IO power supply.
Leave this pin
unconnected if it is not
used.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 13
GND
A1, C1, D2, E1, G1, N1, R1, F2, H2, AA1, AC1, S2, AB2,
AN1, C5, A5, D4, B4, C3, A3, R5, N5, J5, F6, G5, E5, F4,
G3, E3, AA3, X3, V3, T3, AH6, AG5, AE5, AN3, AL3, AH4,
AF4, AD4, A13, D12, D10, C9, A9, B8, P12, P10, P8, R13,
R11, F12, R9, F10, G9, F8, Y12, Y10, S8, U8, W8, Y8,
X13, V13, T13, X11, W12, V11, T11, U12, S12, X9, W10,
V9, T9, U10, S10, AN13, AL13, AJ13, AM10, AK10, AN9,
AM8, AK8, C19, A19, D18, B18, C17, A17, A15, P14, R19,
N19, L19, M18, L17, J17, G17, E17, G15, Y14, W14, U14,
S14, AB18, AC17, AA17, X17, Y18, W18, V17, S18, AG19,
AE19, AK16, AH14, C21, A21, D20, R21, N21, L21, G21,
E21, P20, K20, H20, S20, AN21, E19, AE21
Ensure that all GND pins
are connected to the
ground.
Control Interfaces
RESET_N L1 DI Module reset input P3
Triggered by low level to
reset the module. Hold it
for 8 seconds, and the
module is shut down
forcibly.
PWRKEY_N J1 DI ON/OFF button P3
Triggered by low level to
control the startup of the
module.
SLEEP K4 DI Sleep mode control P3
Triggered by low level to
control the sleep mode of
the module. Leave this pin
unconnected if it is not
used.
UART3 interface
UART3_TXD AL21 DO UART3 data
transmitting P3
Used for data transmission
UART3_RXD AK20 DI UART3 data
receiving P3
UART3_CTS AJ21 DI Clear to send P3
UART3_RTS AH20 DO Request to send P3
UART5 interface
UART5_TXD E15 DO UART5 data
transmitting P3
UART5_RXD F16 DI UART5 data
receiving P3
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 14
USIM1 interface
USIM1_VCC X5 PO USIM1 power output Imax=50mA
USIM1_RESET U4 DO USIM1 reset P1
It should be connected to
USIM1_VCC through a 10
kΩ pull-up resistor.
USIM1_DATA W4 B USIM data IO P1
USIM1_CLK V5 DO USIM1 clock output P1
USIM1_DET T5 DI USIM1 detect P3
USIM2 Interface
USIM2_VCC AJ7 PO USIM2 power output Imax=50 mA
USIM2_RESET AJ5 DO USIM2 reset P2
USIM2_DATA AL5 B USIM2 data IO P2
It should be connected to
USIM2_VCC through a 10
kΩ pull-up resistor.
USIM2_CLK AK6 DO USIM2 clock P2
USIM2_DET AK4 DI USIM2 detect P3
USB interface
USB_DM AL1 AIO USB data negative
signal
Used for firmware
download and data
transmission.
DM and DP adopt
differential routing. USB_DP AM2 AIO
USB data positive
signal
USB_VBUS AK2 PI Charging voltage
check
3.3V~5.2V,
TYP: 5V
USB_ID AJ3 AI OTG detect
Leave this pin
unconnected if it is not
used.
HSIC interface
HSIC_DATA AH2 B HSIC data IO P5
HSIC_STB AJ1 B HSIC strobe P5
ADC interface
ADC3 AA5 AI Analog-to-digital
signal conversion
Vmax=1.7V;
Vmin=0.1V
15-bit, detectable voltage
ranging from 0.1V to 1.7V
Leave this pin
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 15
unconnected if it is not
used.
ADC2 AB4 AI Analog-to-digital
signal conversion
Vmax=1.7V;
Vmin=0.1V
15-bit, detectable voltage
ranging from 0.1V to 1.7V
Leave this pin
unconnected if it is not
used.
ADC1 AC5 AI Analog-to-digital
signal conversion
Vmax=1.7V;
Vmin=0.1V
15-bit, detectable voltage
ranging from 0.1V to 1.7V
Leave this pin
unconnected if it is not
used.
SGMII interface
SGMII_TX_P AM4 AO SGMII transmit plus
SGMII_TX_N AN5 AO SGMII transmit minus
SGMII_RX_P AM6 AI SGMII receive plus
SGMII_RX_N AN7 AI SGMII receive minus
MDIO and PHY chipset control interface
MDIO_CLK AL5 DO MDIO clock output P2 Multiplexed from USIM2
MDIO_DATA AK6 B MDIO data IO P2 Multiplexed from USIM2
ETH_RST_N AJ5 DO Reset Ethernet PHY
chipset P2 Multiplexed from USIM2
ETH_INT_N AK4 DI Interrupt from
Ethernet PHY input P3 Multiplexed from USIM2
I2C interface
I2C_SCL AG9 OD I2C clock P3 Pulled up by a 2.2 kΩ
resistor internally.
I2C_SDA AJ9 OD I2C data P3 Pulled up by a 2.2 kΩ
resistor internally.
I2S/PCM interface
I2S_TX AM14 DO I2S data transmit P3 Multiplexed as
PCM_DOUT
I2S_RX AJ15 DI I2S data receive P3 Multiplexed as PCM_DIN
I2S_SCLK AL15 DO I2S serial clock P3 Multiplexed as PCM_CLK
I2S_WS AK14 B I2S word select P3 Multiplexed as
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 16
PCM_SYNC
I2S_MCLK AG15 DO I2S main clock P3 12.288 MHz by default
Analog Audio Interfaces
MIC_BIAS AH10 PO MIC bias voltage Only supported by variants
with CODEC chipset
AVDD_1P8 AL9 PO 1.8V analog power
supply output
Vnorm=1.8V
Imax=180mA
Only supported by variants
with CODEC chipset
EAR1_N AN11 AO Left-channel EAR
output minus
Only supported by variants
with CODEC chipset
EAR1_P AM12 AO Left-channel EAR
output plus
Only supported by variants
with CODEC chipset
EAR2_N AK12 AO Right-channel EAR
output minus
Only supported by variants
with CODEC chipset
EAR2_P AL11 AO Left-channel EAR
output plus
Only supported by variants
with CODEC chipset
MIC1_P AG11 AI Left-channel MIC
input plus
Only supported by variants
with CODEC chipset
MIC1_N AJ11 AI Left-channel MIC
input minus
Only supported by variants
with CODEC chipset
MIC2_P AG13 AI Right-channel MIC
input plus
Only supported by variants
with CODEC chipset
MIC2_N AH12 AI Right-channel MIC
input minus
Only supported by variants
with CODEC chipset
SDIO/WLAN interface
WLAN_SDIO_D
ATA3 AM20 B
WLAN SDIO data bit
3 P3
WLAN_SDIO_D
ATA2 AL19 B
WLAN SDIO data bit
2 P3
WLAN_SDIO_D
ATA1 AN19 B
WLAN SDIO data bit
1 P3
WLAN_SDIO_D
ATA0 AM18 B
WLAN SDIO data bit
0 P3
WLAN_SDIO_C
MD AN17 B
WLAN SDIO
command P3
WLAN_SDIO_C AM16 DO WLAN SDIO clock P3
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 17
LK
WLAN_PWR_E
N AL17 DO
WLAN power supply
enable P8
WLAN_EN AH18 DO WLAN enable P3
WCI_LTE_RXD AJ19 DI
Data receiving of
WLAN/LTE co-
existence
P3
WCI_LTE_TXD AK18 DO
Data transmitting of
WLAN/LTE co-
existence
P3
WLAN_SLEEP_
CLK AG17 DO WLAN sleep clock P7
DSRC_SLEEP_
CLK AF18 DO DSRC sleep clock P8
RFCLK2_QCA AJ17 DO
WLAN chipset clock,
used for some
Qualcomm QCA
chipsets
P3
Bluetooth Interface
BT_EN AE17 DO Bluetooth enable P8
SDC/eMMC Interface
SDC_DATA3 Y20 B SDC/eMMC data bit 3 P4
SDC_DATA2 AA21 B SDC/eMMC data bit 2 P4
SDC_DATA1 AB20 B SDC/eMMC data bit 1 P4
SDC_DATA0 AC21 B SDC/eMMC data bit 0 P4
SDC_CMD AC19 B SDC/eMMC
command P4
SDC_CLK AD20 DO SDC/eMMC data
clock P4
SDC_DET AA19 DI SDC/eMMC card
detect input P3
VDD_SDC_PUL
L X21 PO
Power for
SDC/eMMC data bit
to connect to through
a pull-up resistor
Imax=50mA
Automatically adjustable to
IO voltage.
Do not use it for any other
purpose except
connecting to data bit.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 18
SDC_PWR_EN X19 DO SDC/eMMC power
enable P7
EMMC_RESET
_N W20 DO
eMMC hardware
reset P3
SPI interface
SPI_MISO T21 DI Device output, host
input P3
SPI_MOSI U20 DO Device input, host
output P3
SPI_CS_N T19 DO Chip select P3
SPI_CLK U18 DO Clock signal P3
GPIO
GPIO_10 AF20 B GPIO P3
GPIO_11 AG21 B GPIO with interrupt P3
GPIO_24 M4 B GPIO P3
Do not connect it to an
external power supply or
VDD_1P8 through a pull-
up resistor before the
module is started.
GPIO_25 L5 B GPIO with interrupt P3
Do not connect it to an
external power supply or
VDD_1P8 through a pull-
up resistor before the
module is started.
GPIO_43 S4 B GPIO P3
GPIO_51 G19 B GPIO P3
GPIO_52 J19 B GPIO with interrupt P3
GPIO_53 P18 B GPIO P3
GPIO_58 D14 B GPIO P3
GPIO_76 C13 B GPIO with interrupt P3
GPIO_77 G13 B GPIO P3
GPIO_78 F14 B GPIO P3
GPIO_79 E13 B GPIO with interrupt P3
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 19
Antenna Interface
ANT_GNSS M20 AI GNSS antenna 50Ω impedance
ANT_MAIN B2 AIO Main antenna 50Ω impedance
ANT_DIV B20 AI Diversity antenna 50Ω impedance
Other Interface
GNSS_LNA_EN K18 DO GNSS LNA enable P3
Reserved Pins
RESERVED
K2, M2, P2, C7, A7, D6, B6, G7, E7, P4, N3, L3, J3, H4,
Y4, AL7, AG7, AG3, B12, C11, A11, B10, D8, G11, E11,
E9, AH8, D16, B16, C15, B14, R17, N17, H18, F18, V19,
T17, AD18, AN15, AH16, J21, F20, V21
Leave RESERVED pins
unconnected.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 20
3.3 MUX Interfaces
Table 3-3 MUX pins
Pin Default Function GPIO Function 1 Function 2 Function 3 Function 4 With Interrupt
T5 USIM1_DET GPIO_34 Y
U4 USIM1_RESET GPIO_33
W4 USIM1_DATA GPIO_31
V5 USIM1_CLK GPIO_32
AK4 USIM2_DET GPIO_30 ETH_INT_N Y
AJ5 USIM2_RESET GPIO_29 ETH_RST_N Y
AL5 USIM2_DATA GPIO_27 MDIO_CLK
AK6 USIM2_CLK GPIO_28 MDIO_DATA Y
AM16 WLAN_SDIO_CLK GPIO_16 UART4_TXD Y
AN17 WLAN_SDIO_CMD GPIO_17 UART4_RXD Y
AM18 WLAN_SDIO_DATA0 GPIO_15 UART1_RTS SPI1_CLK I2C_SCL1
AN19 WLAN_SDIO_DATA1 GPIO_14 UART1_CTS SPI1_CS_N I2C_SDA1
AL19 WLAN_SDIO_DATA2 GPIO_13 UART1_RXD SPI1_MISO Y
AM20 WLAN_SDIO_DATA3 GPIO_12 UART1_TXD SPI1_MOSI Y
AK18 WCI_LTE_TXD GPIO_36
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 21
AJ19 WCI_LTE_RXD GPIO_37 USB_BOOT8 Y
AH18 WLAN_EN GPIO_38 Y
AL21 UART3_TXD GPIO_0 SPI3_MOSI
AK20 UART3_RXD GPIO_1 SPI3_MISO Y
AJ21 UART3_CTS GPIO_2 SPI3_CS_N I2C_SDA3
AH20 UART3_RTS GPIO_3 SPI3_CLK I2C_SCL3 Y
AG21 GPIO_11 GPIO_11 SPI5_CLK I2C_SCL5 Y
AF20 GPIO_10 GPIO_10 SPI5_CS_N I2C_SDA5
F16 UART5_RXD GPIO_9 SPI5_MISO Y
E15 UART5_TXD GPIO_8 SPI5_MOSI Y
AA19 SDC_DET GPIO_26 Y
U18 SPI_CLK GPIO_7 UART2_RTS I2C_SCL2
T19 SPI_CS_N GPIO_6 UART2_CTS I2C_SDA2
T21 SPI_MISO GPIO_5 UART2_RXD Y
U20 SPI_MOSI GPIO_4 UART2_TXD
K18 GNSS_LNA_EN GPIO_54
P18 GPIO_53 GPIO_53 GNSS_DR_SYNC
J19 GPIO_52 GPIO_52 GNSS_TX_AGGRESSOR Y
8 Do not connect it to any external power supply or VDD_1P8 through a pull-up resistor before the module is started.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 22
K4 SLEEP GPIO_74 Y
C13 GPIO_76 GPIO_76 PCM2_DIN I2S_RX2 Y
G13 GPIO_77 GPIO_77 PCM2_DOUT I2S_TX2
F14 GPIO_78 GPIO_78 PCM2_CLK I2S_SCLK2
E13 GPIO_79 GPIO_79 PCM2_SYNC I2S_WS2 Y
AM14 I2S_TX9 GPIO_22 UART6_CTS SPI6_CS_N PCM1_DOUT I2C_SDA6
AJ15 I2S_RX9 GPIO_21 UART6_RXD SPI6_MISO PCM1_DIN
AL15 I2S_SCLK9 GPIO_23 UART6_RTS SPI6_CLK PCM1_CLK I2C_SCL6
AK14 I2S_WS9 GPIO_20 UART6_TXD SPI6_MOSI PCM1_SYNC Y
42 pins of A70 allow multiplexing and all of them can be used as GPIO. Please use their default functions if you do not have any special requirements
in your application.
9 I2S/PCM interface can be multiplexed for other functions only on variants without OCDEC.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 23
4 Electric Feature and Reliability
4.1 Electric Features
Table 4-1 Operating conditions of A70
Status Minimum Typical Maximum
VBAT_BB Vin 3.4V 3.8V 4.2V
Iin / / 1.5A
VBAT_RF Vin 3.4V 3.8V 4.2V
Iin / / 2.5A
VBAT_BB
VBAT_RF
Vin 3.4V 3.8V 4.2V
Iin / / 3A
Table 4-2 Current consumption of A70
Variant Status Test Conditions Test Result (Typ) Unit
CN
Power OFF Shut down the module. 20 μA
Sleep Mode
GSM900 DRX=2 1.9 mA
GSM900 DRX=9 1.3 mA
WCDMA DRX=2 2 mA
LTE Paying cycle = 320ms 6.5 mA
LTE Paying cycle = 640ms 3.8 mA
LTE Paying cycle = 1.28s 2.4 mA
LTE Paying cycle = 2.56s 1.67 mA
Active Mode
GSM900 Voice Call PCL=5 245 mA
GSM1800 Voice Call PCL=0 201 mA
GPRS900 1DL/4UL PCL=5 459 mA
GPRS1800 1DL/4UL PCL=0 327 mA
EGPRS900 1DL/4UL PCL=8 418 mA
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 24
EGPRS1800 1DL/4UL PCL=2 436 mA
WCDMA Band1@ Max Tx power 510 mA
WCDMA Band5@ Max Tx power 488 mA
WCDMA Band8@ Max Tx power 417 mA
LTE-FDD Band1@ Max Tx power 544 mA
LTE-FDD Band3@ Max Tx power 531 mA
LTE-FDD Band5@ Max Tx power 533 mA
LTE-FDD Band8@ Max Tx power 528 mA
LTE-FDD Band26@ Max Tx power 475 mA
LTE-TDD Band34@ Max Tx power 255 mA
LTE-TDD Band38@ Max Tx power 341 mA
LTE-TDD Band39@ Max Tx power 268 mA
LTE-TDD Band40@ Max Tx power 363 mA
LTE-TDD Band41@ Max Tx power 367 mA
EU
Power OFF TBD TBD μA
Sleep Mode TBD TBD mA
Active Mode TBD TBD mA
US
Power OFF TBD TBD μA
Sleep Mode TBD TBD mA
Active Mode TBD TBD mA
Test Result in above table indicates the total current consumption of VBAT_BB and VBAT_RF.
Data in the table was obtained in test with instruments. LTE test conditions: 10 MHz bandwidth,
QPSK modulation, uplink 50RB
A70 in table heading refers to A70 only and does not include A70V2 and A70V3. For current
consumption of A70V2 and A70V3, see Table 4-3 and Table 4-4 respectively.
The values might change as software is optimized in later versions. If the values are different from
those in Hardware Test report, the result is subject to the test report.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 25
Table 4-3 Current features of A70V2
Variant Status Test Conditions Test Result (Typ) Unit
CN
Power OFF TBD TBD μA
Sleep Mode TBD TBD mA
Active Mode TBD TBD mA
Test Result in above table indicates the total current consumption of VBAT_BB and VBAT_RF.
Data in the table was obtained in test with instruments. LTE test conditions: 10 MHz bandwidth,
QPSK modulation, uplink 50RB
The above table refers to A70V2.For current consumption of A70 and A70V3, see Table 4-2 and
Table 4-4 respectively.
The values might change as software is optimized in later versions. If the values are different from
those in Hardware Test report, the result is subject to the test report.
Table 4-4 Current features of A70V3
Variant Status Test Conditions Test Result (Typ) Unit
CN
Power OFF Shut down the module. 20 μA
Sleep Mode
GSM900 DRX=2 1.9 mA
GSM900 DRX=9 1.3 mA
WCDMA DRX=2 2 mA
LTE Paying cycle = 320ms 6.5 mA
LTE Paying cycle = 640ms 3.8 mA
LTE Paying cycle = 1.28s 2.4 mA
LTE Paying cycle = 2.56s 1.67 mA
Active Mode
GSM900 Voice Call PCL=5 245 mA
GSM1800 Voice Call PCL=0 201 mA
GPRS900 1DL/4UL PCL=5 439 mA
GPRS1800 1DL/4UL PCL=0 407 mA
EGPRS900 1DL/4UL PCL=8 418 mA
EGPRS1800 1DL/4UL PCL=2 435.7 mA
WCDMA Band1@ Max Tx power 510 mA
WCDMA Band5@ Max Tx power 487.9 mA
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 26
WCDMA Band8@ Max Tx power 417 mA
LTE-FDD Band1@ Max Tx power 564 mA
LTE-FDD Band3@ Max Tx power 605 mA
LTE-FDD Band5@ Max Tx power 544 mA
LTE-FDD Band8@ Max Tx power 440 mA
LTE-FDD Band26@ Max Tx power 524 mA
LTE-TDD Band34@ Max Tx power 289 mA
LTE-TDD Band38@ Max Tx power 370 mA
LTE-TDD Band39@ Max Tx power 251 mA
LTE-TDD Band40@ Max Tx power 417 mA
LTE-TDD Band41@ Max Tx power 375 mA
Test Result in above table indicates the total current consumption of VBAT_BB and VBAT_RF.
Data in the table was obtained in test with instruments. LTE test conditions: 10 MHz bandwidth,
QPSK modulation, uplink 50RB
The above table refers to A70V3. For current consumption of A70 and A70V3, see Table 4-2 and
Table 4-3 respectively.
The values might change as software is optimized in later versions. If the values are different from
those in Hardware Test report, the result is subject to the test report.
4.2 Temperature Feature
Table 4-5 Temperature feature of A70
Status Minimum Value Typical Value Maximum Value
Operating -30℃ 25℃ 75℃
Extended -40℃ 85℃
Storage -45℃ 105℃
RF performance might not meet 3GPP/3GPP2 standards in extended temperature but it does not
affect functioning.
A70
Product Specifications
Copyright © Neoway Technology Co., Ltd 27
4.3 ESD Protection
Electronics need to pass ESD tests. The following table shows the ESD capability of key pins of this
module. It is recommended to add ESD protection based on the application scenarios to ensure product
quality when designing a product.
Humidity 45% Temperature 25℃
Table 4-6 A70 ESD protection
Testing Point Contact Discharge Air Discharge
VBAT_BB ±8kV ±15kV
VBAT_RF ±8kV ±15kV
GND ±8kV ±15kV
ANT ±8kV ±15kV
Cover ±8kV ±15kV
Others ±2kV ±4kV
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 28
5 RF Features
5.1 Operating Bands
Table 5-1 Operating bands of A70
Operating Bands Uplink Downlink
GSM850 824~849MHz 869~894MHz
EGSM900 880~915MHz 925~960MHz
DCS1800 1710~1785MHz 1805~1880MHz
PCS1900 1850~1909MHz 1930~1990MHz
CDMA BC0 824~849MHz 869~894MHz
WCDMA B1 1920~1980MHz 2110~2170MHz
WCDMA B2 1850~1910MHz 1930~1990MHz
WCDMA B3 1710~1785MHz 1805~1880MHz
WCDMA B4 1710~1755MHz 2110~2155MHz
WCDMA B5 824~849MHz 869~894MHz
WCDMA B8 880~915MHz 925~960MHz
TD-SCDMA B34 2010~2025MHz 2010~2025MHz
TD-SCDMA B39 1880~1920MHz 1880~1920MHz
FDD-LTE B1 1920~1980MHz 2110~2170MHz
FDD-LTE B2 1850~1910MHz 1930~1990MHz
FDD-LTE B3 1710~1785MHz 1805~1880MHz
FDD-LTE B4 1710~1755MHz 2110~2155MHz
FDD-LTE B5 824~849MHz 869~894MHz
FDD-LTE B7 2500~2570MHz 2620~2690MHz
FDD-LTE B8 880~915MHz 925~960MHz
FDD-LTE B12 699~716MHz 729~746MHz
FDD-LTE B13 777~787MHz 746~756MHz
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 29
FDD-LTE B17 704~716MHz 734~746MHz
FDD-LTE B20 832~862MHz 791~821MHz
FDD-LTE B26 814~849MHz 859~894MHz
FDD-LTE B28A 703~733MHz 758~788MHz
FDD-LTE B28B 718~748MHz 773~803MHz
TDD-LTE B34 2010~2025MHz 2010~2025MHz
TDD-LTE B38 2570~2620MHz 2570~2620MHz
TDD-LTE B39 1880~1920MHz 1880~1920MHz
TDD-LTE B40 2300~2400MHz 2300~2400MHz
TDD-LTE B41 2555~2655 MHz 2555~2655 MHz
5.2 TX Power and RX Sensitivity
Table 5-2 RF TX power of A70
Operating Band Max Power Min. Power
GSM850 33dBm+2/-2dB 5dBm+2/-2dBm
EGSM900 33dBm+2/-2dB 5dBm+2/-2dBm
DCS1800 30dBm+2/-2dB 0dBm+2/-2dBm
PCS1900 30dBm+2/-2dB 0dBm+2/-2dBm
CDMA BC0 24dBm +1/-1dBm <-50 dBm
WCDMA B1 24dBm +1/-3dBm <-50 dBm
WCDMA B2 24dBm +1/-3dBm <-50 dBm
WCDMA B3 24dBm +1/-3dBm <-50 dBm
WCDMA B4 24dBm +1/-3dBm <-50 dBm
WCDMA B5 24dBm +1/-3dBm <-50 dBm
WCDMA B8 24dBm +1/-3dBm <-50 dBm
TD-SCDMA B34 24dBm +1/-3dBm <-49 dBm
TD-SCDMA B39 24dBm +1/-3dBm <-49 dBm
FDD-LTE B1 23dBm+2/-2dBm <-40 dBm
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 30
FDD-LTE B2 23dBm+2/-2dBm <-40 dBm
FDD-LTE B3 23dBm+2/-2dBm <-40 dBm
FDD-LTE B4 23dBm+2/-2dBm <-40 dBm
FDD-LTE B5 23dBm+2/-2dBm <-40 dBm
FDD-LTE B7 23dBm+2/-2dBm <-40 dBm
FDD-LTE B8 23dBm+2/-2dBm <-40 dBm
FDD-LTE B12 23dBm+2/-2dBm <-40 dBm
FDD-LTE B13 23dBm+2/-2dBm <-40 dBm
FDD-LTE B17 23dBm+2/-2dBm <-40 dBm
FDD-LTE B20 23dBm+2/-2dBm <-40 dBm
FDD-LTE B26 23dBm+2/-2dBm <-40 dBm
FDD-LTE B28A 23dBm+2/-2dBm <-40 dBm
FDD-LTE B28B 23dBm+2/-2dBm <-40 dBm
TDD-LTE B34 23dBm+2/-2dBm <-40 dBm
TDD-LTE B38 23dBm+2/-2dBm <-40 dBm
TDD-LTE B39 23dBm+2/-2dBm <-40 dBm
TDD-LTE B40 23dBm+2/-2dBm <-40 dBm
TDD-LTE B41 23dBm+2/-2dBm <-40 dBm
Table 5-3 RF RX sensitivity of A70
Operating Band Sensitivity
GSM850 ≤-108dBm
EGSM900 ≤-108dBm
DCS1800 ≤-108dBm
PCS1900 ≤-108dBm
CDMA BC0 <-107dBm
WCDMA B1 <-108 dBm
WCDMA B2 <-107dBm
WCDMA B3 <-108 dBm
WCDMA B4 <-108 dBm
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 31
WCDMA B5 <-108 dBm
WCDMA B8 <-108 dBm
TD-SCDMA B34 <-109dBm
TD-SCDMA B39 <-109dBm
FDD-LTE B1 <-97dBm
FDD-LTE B2 <-95dBm
FDD-LTE B3 <-95dBm
FDD-LTE B4 <-97dBm
FDD-LTE B5 <-95dBm
FDD-LTE B7 <-95dBm
FDD-LTE B8 <-95dBm
FDD-LTE B12 <-95dBm
FDD-LTE B13 <-95dBm
FDD-LTE B17 <-95dBm
FDD-LTE B20 <-95dBm
FDD-LTE B26 <-95dBm
FDD-LTE B28A <-95dBm
FDD-LTE B28B <-95dBm
TDD-LTE B34 <-97dBm
TDD-LTE B38 <-97dBm
TDD-LTE B39 <-97dBm
TDD-LTE B40 <-97dBm
TDD-LTE B41 <-95dBm
All the values above are obtained in the lab environment. LTE test conditions: 10 MHz bandwidth,
QPSK modulation, uplink 50RB
In actual applications, there might be a difference due to the changes of test conditions and
environment.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 32
5.3 GNSS Feature
Changes Parameter
GPS L1 operating frequency 1574.397~1576.443 MHz
GLONASS operating frequency 1597.5~1605.9MHz
BDS B1 operating frequency 1559.1~1563.1 MHz
Galileo operating frequency 1573.42~1577.42MHz
Tracking sensitivity GPS: -158 dBm max
Acquisition sensitivity GPS: -146dBm max
Re-acquisition sensitivity GPS: -155 dBm max
Positioning precision (in air) < 3m (CEP50)
Hot start (in air) <2.5s
Cold start (in air) <35s
Update frequency 1Hz by default
CNRin/CNRout 3dB
Max. positioning altitude 18000m
Max. positioning speed 515m/s
Max. positioning acceleration 4g
GNSS data type NMEA-0183
GNSS antenna type Passive/active antenna
Tracking sensitivity, acquisition sensitivity, and re-acquisition sensitivity were obtained in signaling
test on SPIRENT6300 and they are the maximum values of multiple tests on samples. No external LNA
or active antenna was used in the test.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 33
6 Mechanical Features
6.1 Dimensions
Figure 6-1 A70 dimensions
1.0±0.1mm1.6±0.1mm 2.7±0.2mm
37.0±0.1mm
37.0±0.1mm
37.0±0.1mm
36.16±0.1mm
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 34
6.2 Label
The label is made of materials that are deformation-resistant, fade-resistant, and high-temperature-
resistant and it can endure high temperature up to 260 °C.
Figure 6-2 A70 label
The picture above is only for reference.
The silk-screen printing must be clear. No blur is allowed.
The material and surface finishing must comply with RoHS directives.
6.3 Three Views
The following figure shows the top view, bottom view, and side view of A70 module.
Figure 6-3 Three views of A70
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 35
6.4 Package
A70 modules are packaged in sealed vacuum bags with dryer, humidity card, and tray on delivery to
guarantee a long shelf life. Follow the same package method again in case of opened for any reasons.
6.4.1 Reel
A70 in mass production is delivered in the following packaging.
Figure 6-4 A70 reel packaging
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 36
Figure 6-5 A70 reel dimensions
6.4.2 Moisture
A70 is a level 3 moisture-sensitive electronic elements, in compliance with IPC/JEDEC J-STD-020
standard.
If the module is exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH,
bake it at a temperature higher than 90 degree for more than 12 hours before SMT.Or, if the indication
card shows humidity greater than 20%, the baking procedure is also required.Do not bake modules
with the package tray directly.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 37
7 Mounting A70 onto the Application Board
A70 is introduced in 284-pin LGA package. This chapter describes A70 foot print, recommended PCB
design and SMT information to guide users how to mount the module onto application PCB board.
7.1 Application Foot Print
Figure 7-1 Recommended PCB Foot Print
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 38
7.2 Stencil
The recommended stencil thickness is at least 0.12 mm to 0.15 mm.
7.3 Solder Paste
Do not use the kind of solder paste different from our module technique.
The melting temperature of solder paste with lead is 35 °C lower than that of solder paste
without lead. It is easy to cause voiding for LGA and LCC inside the module after second reflow
soldering.
When using only solder pastes with lead, please ensure that the reflow temperature is kept at
220 °C for more than 45 seconds and the peak temperature reaches 240 °C.
7.4 SMT Furnace Temperature Curve
Thin or long PCB might bend during SMT. So, use loading tools during the SMT and reflow soldering
process to avoid poor solder joint caused by PCB bending.
Figure 7-2 SMT furnace temperature curve
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 39
Technical parameters:
Ramp up rate: 1 to 4 °C/sec
Ramp down rate: -3 to -1 °C/sec
Soaking zone: 150-180 °C, Time: 60-100 s
Reflow zone: >220 °C, Time: 40-90 s
Peak temperature: 235-250 °C
Neoway will not provide warranty for heat-responsive element abnormalities caused by improper
temperature control.
For information about cautions in A70 storage and mounting, refer to Neoway Module Reflow
Manufacturing Recommendations.
When manually desoldering the module, use heat guns with great opening, adjust the temperature to
250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is
melt. Then remove the module using tweezers. Do not shake the module in high temperatures while
removing it. Otherwise, the components inside the module might get misplaced.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 40
8 Safety Recommendations
Ensure that this product is used in compliant with the requirements of the country and the environment.
Please read the following safety recommendations to avoid body hurts or damages of product or work
place:
Do not use this product at any places with a risk of fire or explosion such as gasoline stations, oil
refineries, etc
Do not use this product in environments such as hospital or airplane where it might interfere with
other electronic equipment.
Please follow the requirements below in application design:
Do not disassemble the module without permission from Neoway. Otherwise, we are entitled to
refuse to provide further warranty.
Please design your application correctly by referring to the HW design guide document and our
review feedback on your PCB design. Please connect the product to a stable power supply and
lay out traces following fire safety standards.
Please avoid touch the pins of the module directly in case of damages caused by ESD.
Do not remove the USIM card in idle mode if the module does not support hot plugging.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 41
A Conformity and Compliance
A.1 Approvals
CCC
SRRC
RoHS
A.2 Chinese Notice
A.2.1 CCC Class A Digital Device Notice
This product has been tested and found to comply with the limits for class A digital devices.These limits
are designed to provide reasonable protection against harmful interference in a residential installation.
A.2.2 Environmental Protection Notice
This product is in compliant with China RoHS directives and does not contain any hazardous
substances as per the above referenced standard. Follow the regulations of the countries when storing,
applying, and discarding it.
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 42
B Abbreviation
Abbreviation English Full Name
ADC Analog-Digital Converter
BT Bluetooth
CDMA Code Division Multiple Access
CODEC COder-DECoder
DC-HSPA+ Dual-carrier HSPA+
DDR Double Data Rate
DSRC Dedicated Short Range Communications
DTR Data Terminal Ready
EGSM Enhanced GSM
eMMC Embedded Multi Media Card
EVDO Evolution Data Optimized
FDD Frequency Division Duplex
GNSS Global Navigation Satellite System
GPRS General Packet Radio Service
GPIO General-Purpose Input/Output
GPS Global Positioning System
GSM Global Standard for Mobile Communications
HSIC High-Speed Interchip
HSPA+ High-Speed Packet Access
HSUPA High-Speed Up-link Packet Access
I2C Interintegrated Circuit
I2S Inter-IC Sound
LGA Land Grid Array
LTE Long-Term Evolution
MDIO Management Data Input/Output
A70
Hardware User Guide
Copyright © Neoway Technology Co., Ltd 43
PCB Printed Circuit Board
RF Radio Frequency
SDC Secure Digital Controller
SGMII Serial Gigabit Media Independent Interface
SPI Serial Peripheral Interface
TBD To Be Determined
TDD Time Division Duplex
TD-SCDMA Time Division-Synchronous Code Division
Multiple Access
UART Universal Asynchronous Receiver-Transmitter
USIM Universal Subscriber Identity Module
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
WCDMA Wide-band Code Division Multiple Access
WCI Wireless Coexistence Interface
WLAN Wireless Local Area Network