about daetec

Company Profile – www.daetec.com 1

Diversified Applications

Engineering Technologies

Company Profile – www.daetec.com

Technology has many barriersMost are Internal

• Ability to change with the markets

• Ability to react

• Ability to find answers

• Ability to assemble resources

• All at low cost

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How Does One Cross to a

New Market, Reach a New Customer, or Find Answers?

•Increase investment –

testing & applications

•New product

development

•New tool design

•New process design

•Modification or ancillary

•Bundling

Will it be one or more of these?


What’s the right

level of

resources?

•Stay on schedule

•Overcome challenges

•Acquire IP

•Ready for scale-up

•Train staff

•Respond to customers

•Support the Market

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What is needed to…


What’s the shortest path to

achieve your objective?

•Stay on-track

•Maintain revenue from

core business

•Avoid hitting road-blocks

•Keep on schedule

•Who will drive this effort?

How do you…


DAETEC

We can be your bridge

into new markets

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DAETEC is a Bridge Between One Source to Another

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•Suppliers

•Wafer Fabs

•Manufacturers

•End-Users

•Assemblers

•Consumers

•New Products

•Solutions

•New Markets

•Ancillaries

•New Processes


Partner Facilities to Scale-Up

• R&D in Camarillo, CA

• Partner Fab in Santa Barbara, CA (30,000 sf)

• Access to Toll Mftg at six (6) locations in USA

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History

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‘95 John Moore founds Moore Enviro-Chemical, Inc.

(MEC)

’95-’00 Moore develops PR strippers, cleaners,

polymers for semiconductors, aerospace, and

automotive.

‘99 Moore develops aqueous soluble polymers and cleaners at MEC for

slicing/dicing – used to found Aquabond technologies, ‘02

sale to private investors.

‘00 General Chemical Corp (GCC) purchases MEC,

Moore becomes Product Development Director of Electronic Chem Division.

‘00-’05 Moore starts specialty products division at

GCC and designs GenSolveTM, GenTakTM, GenCleanTM for top-tier

semiconductor firms.

‘05 Moore founds Daetec, resigns from GCC.

Daetec lab designed and built, equipment

capitalized.


Successful Commercialization

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Product Application Industry

Spin-On Polymer High Temperature Wafer Bonding Semiconductor

Metal Safe PR Stripper Negative Tone and Acrylic Stripper Semiconductor

Dissolving Gel Cured Polysulfide Resin Stripper Aviation

EHS Safe Stripper Negative Tone Isoprene & Bisbenzocyclobutene

Semiconductor

Spin-On Thermoplastic Med Temperature Wafer Bonding Compound Semiconductor

Aqueous Etch Residue Cleaner Copper/Low k residue remover Semiconductor

Aqueous Based Spin-On Polymer Polishing, Slicing, Dicing Electronics/Semiconductor

Aqueous Based Polymer Remover Remover of Aqueous Based Polymer Electronics/Semiconductor

Spray Coat Polymer Wafer Protection/bonding Compound Semiconductor

Spin-On Protection Coating Acid Etch Protection Layer MEMS

Please contact us to see any pertinent publications and patents.


Markets Served

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Microelectronics•Silicon, GaAs & other compound semi,

FPD, data storage, MEMS

•Cleans - PR stripper & rinsing

•Coatings – cured polymers, adhesives

•Rinses – surface active agents, non-foam

•Inhibitors – substrate & metal protection


Markets Served

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Aerospace/Aviation

•Polymer sealants & coatings – high temp,

low CTE, special engineering apps.

•Cleaners – dissolve & remove oils,

silicones, polysulfides, epoxies, others.


Markets Served

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Industrial•Automotive

•Construction, roofing, coating

•Metal working, machining

•EHS compliant coatings & cleans


Just a few of our past partners…

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What We Do…• Product Development

• Material Modification

• New Application Development

• Process Design

• Tool Design Demo

• Ancillaries

• Yield Enhancement

• EHS Compliance Review

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Technical Capabilities

Properties—physical and chemical Cleaning and residue characterization Coating applications and processing Polymer compounding—thermoplastics Curing—thermal & radiation Properties—mechanical and adhesion Corrosion potential & evaluation Thin film analysis & electrical characterization

Process modeling—screening testing New process demonstration Etch rates Electrical properties for I-V curves SEM & CD analysis ESCA/XPS FIB SIMS

These and other tests allows us to immediately focus on those areas with the most potential to improve the customers processes and applications.

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Program Planning with Market Targets

Flat Panel Mftg

Successful commercialization depends upon market experience

installed into your development schedule


Intellectual Property

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•IP Assigned to

Customer

•Greater Value to

Investment

•Greater Flexibility

on Business Model


Creativity to New Heights!

• Creative ideas are the core of our business and we continually push those limits to new levels;• Your objective represents an important part of our growth. This interdependency fuels our program;• Creating new answers often provides new business options, leading to greater market capture.

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Results in Record Time

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Compatibility Applications

DAETEC prefers screening tests over large DOEs.

Screening tests = many options + statistics

Options = less challenges + faster results

Fast results = less cost


Cost EffectiveWe Stretch Our Resources to Reduce Costs

• Screening tests are inherently less costly

• Require a creative approach

• Multi-tasked experiments using abbreviated number of specimens

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Applications

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Coatings Technologies

Coating Optimization

Understanding PR Polymers

Coatings Electrical Testing

Substrate Thinning

Inhibitors for Corrosion Control

CLEANING

Materials and Processing

Wafer Bumping

Panels (Solar/FPD)

PLATING

Electrolytic/less

Etchants and Surface Finishing

Process Optimization


Coatings Technologies

• Spin-Coating

• Spray Coating

• Slit/Brush/Roll

• Films

• Molding

• Photo initiated

• Thermal/Electrical Conductive

• Temporary/Permanent

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Cured

CoatingCleans (2 steps)

1 X Puddle + 1 X Spin

Water

Rinse


Coating Optimization

Conformal

Planarize

State-of-the-art characterization techniques


Understanding PR Polymers

DNQ Ketene AcidNon-polar Polar Polar


Coatings Electrical Testing

•Hg Probe – Sensitive for Thin Films

•Rapid Measurement

•IV curves, Dielectric Const., Loss

Tangent

•Hg dot contact is non-destructive

•Used for Epi-layers and films

<50Angstroms

•Ideal for Oxide Layers, Inhibitors,

and Used for Residue Detection

Hg-Probe I-V Plots of Triazoles on Cu

0.0

10.0

20.0

30.0

40.0

50.0

60.0

0 0.1 0.2 0.3 0.4 0.5 0.6

Voltage (volts)

Current (

uA

mps)

Triazoles, 0.5% Aqueous SolnsRT 30sec Exposure

BTA

TTA

Triazole Mix


Substrate Thinning

•Substrates to <20um

•Protection for Backside Processing

•Simple Application & Removal

•Permanent Systems

•High Temps >400C & Low CTE

•Wide Range of Process Options

•Coating Over Bumps

•Applicable to MEMS

•Aqueous Cleans Available

•Cleans for Single Wafer & BatchMany Polymer Options


Inhibitors for Corrosion Control

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FeatureCorrosion

InhibitorAdded

Pourbaix Diagrams & Tafel Plots to Correct Corrosion


Cleaning – Materials & Processing

• Polymers & Residue

• Cured Systems: Silicone, Urethane, Acrylic, Epoxy, Rubber, Sulfides

• Insulators: Polyimide, BCB, PBO, Silicates

• Hydrocarbons: Oils, Greases

• Aqueous Cleans

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Etch Residue, Before Clean Via

Polyimide, Before Polyimide Removal


Cleaning – Wafer Bumping

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Before Strip After Strip

Flux Reflow to 220C

PR Strip/Cleans

Alkali + Solvent

Minor Issues in Cleans

Solder Plating

Exposure & Develop

Wet PR App.

Plated Solder

Wet PR


Cleaning – Panels (Solar/FPD)

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Plating – Electrolytic/less

• Cu + Alloy Processes

• Co Electroless Capping

• Ni Hypophos

• NiFe/NiFeCo Heads

• Sn and Alloys

• Au Processes

• Exchange Processes

• Initiating/Striking

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Etchants & Surface Finishing• Au Etch (aqueous &

solvent)

• Buffered Oxide Etch (BOE)

• Chrome Etch

• Si Etch (acid & base)

• Mixed Acid Etch (MAE)

• Phos Acid Etch PAE)

• Surfactanated Etchants

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Irregular Etch


Process ImprovementIsolating Factors in the Process Step

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•Process Flow

•Residue Removal

•Cleans Improvement

•Yield Improvement

•Monitoring & Controls

•Product Development

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Survey Process Materials, Stability, Life

Simple, On-Site

Monitor &

Controls

Eliminate

Process

Excursions

Process ImprovementFactors Affecting Performance


Plasma

1. Substrate Cleaning

2. ResistCoating

3. Exposure

6. ResistStripping

5. Etching 4. Develop

Process ImprovementStudying Interactions Between Process Steps


Fab Equipment OptimizationHow Materials Work in a Specific Tool


EHS Compliant Development

• Solvent Replacement

with Aqueous Agents

• Green Coatings

• Green Cleaners

• Reduced Energy Use

• Eliminate Toxic or

Regulated Items

• Eliminate Haz Waste

• Green Cost Reduction

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Draft Plan to Contract

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1-Contact

Daetec

&

Customer

2-Objective

* Solution Need

* New Product

* Complementary

Product

* Bundle Option

* New Technology

3-Plan

* Deliverables

* Timing

* IP

* Costs

Adjust

4-Contract

* Written

Document

* Work Plan –

Same as (3)

5-Action

* Progress Reports

* Deliverables

* Payment for

Services

* Completion –

most in 6mos

6-Completion

* Customer Meets

Objective

* Customer has IP


To implement a new and innovative plan, contact us!

John Moore Technical [email protected]

Daetec, LLCDiversified Applications Engineering Technologies

www.daetec.com

1227 Flynn Rd., Unit 310 Camarillo, CA 93012-8551

Phone: 805-484-5546 Fax: 805-484-5556

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http://www.daetec.com/

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