ADVANCED CFD

MODELING

ELECTR

ONICS COOLING DESI

GN OPTIONS F

OR AIR MANAGEMENT

Don Blanchet3B Associates02/01/2016

MODEL – VME CARD HIGH POWER PMC STUDY

Processor (s)Heat sink

Air flow

30 watts

Total board Power = 130 watts

OptionalHeat spreader/

StiffenerPMC position #2

PMC position #1

DUAL PMC CONFIGURATION WITH BASELINE HEAT SINK

DETAIL – HIGH DENSITY MEMORY DAUGHTER CARD

FPGA

Memoryassembly

BASELINE ALUMINUM HEAT SINK DESIGN

ALUMINUM HEAT SINK DESIGN – BOTTOM VIEW

ENHANCED HEAT SINK DESIGN - COPPER

ENHANCED HEAT SINK DESIGN COPPER – BOTTOM VIEW

DETAIL OF – PWB REMOVED – WITH HEAT SINK

FPGAFPGA

Baseline Heat sink

MECHANICAL DESIGN HEAT PIPE IMPLEMENTATION

Heatspreaders

Heat Pipes

ProcessorHeat sink

HEAT PIPE ENHANCED DESIGN

Main ProcessorHeat sink

Heat Pipes integrated with mainProcessor heat sink

FPGA

HEAT PIPE ENHANCED DESIGN – PMC PWB REMOVED

FPGA

Heat Pipes

HEAT PIPE ENHANCED DESIGN – PMC PWB REMOVED

FPGA

FPGA

Spreader

RESULTS – WITH BASELINE ALUMINUM HEAT SINK

Tj =85 C40 C

ProcessorsTj =78 C

Air flow

RESULTS – WITH BASELINE ALUMINUM HEAT SINK – MEMORY ARRAY

ProcessorsTj =78 C40 C

RESULTS – WITH ENHANCED COPPER HEAT SINK

40 CTj =80 C

RESULTS – WITH HEAT PIPES & SPREADER

Tj =78 C

40 C

RESULTS – BASELINE HEAT SINK DUAL PMC CONFIGURATION

40 CTj =85 C Tj =112 C Processors

Tj =92 C

RESULTS – BASELINE HEAT SINK DUAL HIGH POWER PMC CONFIGURATION

40 CTj =90 C Tj =117 C Processors

Tj =93 C

RESULTS – BASELINE HEAT SINK DUAL PMC CONFIGURATION MAX POWER = 22W PER PMC

40 CTj =78 C Tj =98 C

ENHANCED COPPER HEAT SINK DESIGN

BASELINE VS. ENHANCED HEAT SINK

BASELINE ALUMINUM VS. ENHANCED COPPER @ 25W EACH

Slot module air flow 20CFM 40C @ 10K feet

Tj =108 Tj =95

CFD TOOL – ORIGIN U.K.The tool used has been customized for electronics cooling

applications over 20+ years.

Unfortunately it is lease only and VERY expensive $$$$$$$.

Looking forward to cloud rental options being more economical. ??