www.smthelp.com

✦Advanced Packaging Assembly Solution

www.smthelp.com

Solutions for Advanced Packaging Assembly

Flip Chip die

PCB

Flux

High Accuracy Placement: Embedded Device WLCSP Power QFN

Flip Chip Die Attach

SIP/MCM Assembly: Die Attach Flip Chip & Component Placement

Chip

www.smthelp.com

Growth In Advanced Packaging

www.smthelp.com

The closest Package format to a Flip Chip or WLCSP Package

What’s new?QFN (Quad Flatpack No Lead)

Flip Chip die

PCB

Flux

www.smthelp.com

QFN Market AssessmentAPAS Opportunity

Tota

l QFN

& P

QFN

Pac

kage

s

0

12.5

25

37.5

50

Year2009 2010 2011 2012 2013 2014 2015

12.410.3

8.67.2

5.443.6

41.4

34.5

28.7

24

21.819.8

18

QFN Units PQFN Units

Market in Transition Price of Gold Thermal Performance Electrical Performance

www.smthelp.com

PQFN Market AssessmentPackaging Units, Lines and Capacity Needs

Incr

emen

tal

Cap

acity

(m/c

's &

$M

)

0

32.5

65

97.5

130

Tota

l PQ

FN P

acka

ges

(B)

0

3.25

6.5

9.75

13

Year2009 2010 2011 2012 2013 2014 2015

PQFN Units Incremental PQFN m/c's Incr CAPEX $ M

90.97

75.81

63.17

129.96

108.3

90.25

12.4

10.3

8.6

7.2

5.4

43.6

63.17

75.81

90.9790.25

108.3

129.96

Incremental CAPEX $

Incremental Lines needed

www.smthelp.com

Annual Savings from no Taping = $300,000 / Year PER COMPONENT!

Wafer Re-constitution - WLCSP

www.smthelp.com

www.smthelp.com

OSAT’s Strategic Value

www.smthelp.com