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Advanced Processing Systems Honeywell Proprietary 1 12/04/2003 Honeywell UF HCS & Honeywell DSES Opportunities Presented by Advanced Processing Systems

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Page 1: Advanced Processing Systems Honeywell Proprietary1 12/04/2003 Honeywell UF HCS & Honeywell DSES Opportunities Presented by Advanced Processing Systems

Advanced Processing Systems Honeywell Proprietary1

12/04/2003

Honeywell

UF HCS & Honeywell DSES Opportunities

Presented by

Advanced Processing Systems

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HoneywellAgenda

Introduction - Honeywell UF HCS Capabilities Overview - UF Integrated Payload Overview - Honeywell Collaboration Plan - Honeywell Overview of Opportunities - Honeywell Working Group

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Honeywell

UF HCS Overview

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Honeywell

Integrated Payload

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HoneywellMarket Need A market need has been established for an integrated payload

processing system based on the Honeywell payload product line.

To fulfill this need we must define a system hardware architecture based Honeywell payload processors and peripherals.

A software system framework must also be defined to facilitate the integration of hardware components, horizontal services, and customer applications.

The combined software and hardware must provide the capabilities desired by our customers.

Integrated payload systems make application development easier.

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HoneywellKeys to Business Growth Modular and Integrated Systems

Can assemble/architect system to meet mission needs with low NRE

Pay only for missionization

Inexpensive and readily available SDU system Provide a mechanism to evaluate and benchmark

algorithms High Speed Interconnect to meet increasing bandwidth

requirements Reconfigurable Computing has been recognized as key

technology

We are listening to our customers and we will deliver.

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HoneywellGet in the door early!

Integrated Payload Development Cycle

Study of Mission Algorithms on Integrated Payload SDU

Customer Internal Development

Phase1 competition begins

Continue refinement of algorithms on SDU and demonstrations conducted with instrument prototypes

Phase 2 Elaboration Flight

Custom flight components are developed if necessary

Custom components are integrated and tested on flight Integrated Payload

Software migrates to flight unit for final qualification

Flight unit complete

Integrated Payload Development CycleProgram Life Cycle

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HoneywellOverall IRAD Objectives Establish a substantive technical advantage in the area

of complete satellite payload processing systems, enabling Honeywell to achieve significantly increased program roles.

Deliver increasing system value to our Customers by “pre-integrating” the technologies of Honeywell and its Partners.

Establish the system architecture for a heterogeneous system.

Honeywell Payload Systems will be the first choice in theIntegrated Payload Market

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HoneywellProposed Product Offering Integrated Payload Processor

Pre-integrated software components operating systems, device drivers, system monitors, runtime libraries, etc.

Pre-integrated hardware components system controller, data processors, reconfigurable modules, IO, memory,

etc. Pre-integrated development tools

Development software and configware libraries, verification tools, compilers, etc.

Scalable and Software Compatible System will be scalable to meet the particular requirements of the target

application Software will not break if additional components are added to the system

Provide support to quickly get customer up and running and resolve technical issues

Provide a low cost SDU that is equivalent to flight system

The Integrated Payload will be a turnkey solution ready for application development.

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HoneywellIntegrated Payload System

Horizontal Services: APIs, Interprocessor Communication, Runtime Libraries etc.

System Software Components: OS, Hardware Abstraction, Device Drivers, etc.

PayloadInterfaces

SBC-PDPP/L Data

Processor

SBC-PCControl

ProcessorMuSICA

CustomI/O Module(e.g. 1394)

RHVPHRSC

PMC

MassStorageModule

Mission Application

Honeywell DSES does payload processing systems well and we will make the Integrated Payload a reality.

Honeywell Integrated Payload System

Point to Point High Speed Interconnects (data)

cPCI Backplane (control)

PMC PMC

Payload, S/C& Comm

System Interfaces

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HoneywellBenefits of Product Reduce cycle time

Eliminating the long integration phase Lowers integration risk

Reduce amount of new development Ease migration from SDU to flight unit

Reduce costs Reduce NRE Higher volume will yield lower production costs

Increase overall product quality Product will have more time to mature

Higher quality and reduced costs can lead to increased profit!

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Honeywell2003 IRAD Objective Primary Goal

Integrate available subassemblies into a functional system model

Develop system architecture to support the integration of heterogeneous payload systems

Develop APIs to configure and manage available subassemblies

Secondary Goal Develop a “flight-like” proof of concept application that can be

utilized to support new program pursuits. Demonstrate ability to coordinate projects with other Honeywell

sites

We are well on our way to achieving our goals

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Honeywell

Proof of Concept System Integration (PoCSI)

Description

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HoneywellDemonstration goals

To show the capabilities of the Integrated Payload by processing real-time video

To show the reconfigurability of the system by implementing multiple modes of operation using reconfiguration

To create an “eye-catching” demonstration that will draw customer interest

To help develop standard interfaces and design flows for reuse by us and our customers

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HoneywellDesign Considerations

The HRSC has no microprocessor onboard. All functionality on the HRSC is implemented in hardware. Therefore, devices requiring software drivers to operate can not be used as PMC modules (for example webcams)

Communication protocols such as IEEE 1394 and USB are complicated to implement in hardware (also costly)

Most video formats such as composite video or S-video are analog

Cameras that have digital video interfaces (such as CameraLink cameras) are cost prohibitive (price $4000+)

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HoneywellSystem Block Diagram

PC

SBC

cPC

I Ba

ckpla

ne

SDI to CompositeConverter

Camcorder S-Video to SDIConverter

TV

S-VideoNTSC Analog

SDISerial Digital

SDISerial Digital

CompositeNTSC Analog

Ethernet

Virtex IIIFIA

Mezzanine

IFIBMezzanine

HRSC Processing

Virtex II

SDI Rx &Decoder

SDIEncoder &

Tx

8

8

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Honeywell

Integrated Payload Software Architecture

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HoneywellSoftware Architecture - Goals Significantly reduce initial integration effort.

Reduce dependencies on specific hardware, operating system, and BSP versions.

Provide a modern COTS-like development experience for customers.

Provide a system that can be extended by additional nodes and additional capabilities.

Maintain a distinction between new product line technologies and demonstration software.

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HoneywellSoftware Architecture - Functional CapabilitiesPayload Processing Systems and Applications

Functional Model

User Application

Application Level Services(Horizontal Services)

General Embedded Systems Services

Base Processing Environment

Control Hardware Sensing and Processing Assets

Operating System

Board Support Package (BSP) Reusable Software Drivers

Device Configuration

Interprocess Communication &Synchronization

Basic Network Communications

General Development Services

Clustering

High-level Network andInterprocess Messaging

Service Location

Database

In-memory

Persistent

ISAM

Relational

SQL

Embedded Space Systems

Common PayloadProcessing Services

FaultManagement

Distributed Object Middleware

Ground/PayloadControl

This is a functional model of the domain of payload processing systems. It provides us a tool for describing and understanding these systems.

General services needed by most applications. These represent value-add opportunities where a customer typically invests effort, but does not focus on their

specific application.

These are basic computing environmental conditions. They relate to the ability to

initialize a system, command peripherals, and develop traditional software services.

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HoneywellSoftware Architecture - Architectural ElementsCurrent focus is on the Base Processing Environment.

I/O Subsystem

BSP

Device Drivers

PCI Configuration

PCI QueryService

BSP-Specific BootConfiguration

Service

VXI Plug & PlaySpecifications

VISA I/OSpecifications

BSP-SpecificVISA

Implementation

This is the specific BoardSupport Package for a targetsingle board computer andoperating system

These are the device driversdeveloped for Honeywell hardware.They will be independant ofhardware architecture or BSPimplementation, making themreusable on multiple projects.

The PCI Query Service providesa generic mechanism to locatedevices on the PCI bus.

VXIpnp and VISA arecommercial standards fordevice IO and driverdevelopment.

The configuration serviceprovides a standard way for thecustomer to control the PCIconfiguration of the system.

The VISA implementation for agiven BSP provides an isolatedlocation to encapsulate all of theBSP IO specifics.

12

3

45

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Honeywell

Next Steps

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HoneywellFuture Next Steps

Integrate additional hardware (e.g. RapidIO) Develop additional device drivers (e.g. MUSICA, 1394). Investigate integrating with Glendale’s satellite structure lab Investigate additional horizontal services. Integrate payload system software with RTOS development

tools. Continue to investigate additional RTOSs. Define development flows.

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Honeywell

Collaboration Plan

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HoneywellProposed Plan

Communication Identify key representatives from each organization Establish recurring meetings

Direction Define common goals and objectives for research and development

Action Identify and pursue most promising opportunities

Together we are more productive and competitive.

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Honeywell

Overview of Honeywell Opportunities

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Honeywell

InternshipsNew Millennium ST-8Integrated PayloadHRSCDARPA (RWI, others)SSPARestricted (SCA, others)NASA