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Page 1: Advanced RF System-in-Package for Cellphones 2019 · 2019-03-26 · Advanced RF System-in-Package for Cellphones 2019 | Sample | | ©2019 8 KEY FEATURES OF THIS REPORT Market overview

Sample© 2019

From Technologies to Market

Advanced RF System-in-Package

for Cellphones 2019

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2Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

o RF SiP packaging 81

• Technology & trends

• Interconnection trends

• Challenges & requirements for 5G

• Antenna in package

• Roadmap

• EMI Shielding

o Packaging substrate materials for5G 150

o Players and supply chain 170

• Player landscape and positioning

• Company strategies

TABLE OF CONTENTS

o Introduction 3

• Methodology

• Report synergies

• Objectives, scope, definitions

• Advanced packaging platforms

o Executive summary _______18

o Market drivers and dynamics _45

• Evolution of cellular networks

• Nature of 5G

o Disruptions and opportunities

o RF SiP in smartphones 66

o Architectures

o Trend for 5G

o Market forecasts 189

• Cellphone forecast by type & air standards

• RF components packaging market at wafer-level & SiP level

• RF SiP Forecasts in units & market

• By cellphones category

• By air standards

• By types of SiP modules

• Wafer starts for RF SiP

• Interconnects trend forecast

• OSATs vs IDMs packaging markettrend

o Conclusion 221

o Yole Développement presentation225

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3Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

ABOUT THE AUTHOR

Biography & contact

Santosh Kumar

Santosh Kumar is currently working as Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.

He received the bachelor and master degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

contact: [email protected]

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4Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

COMPANIES CITED IN THE REPORT

Amkor (J-Devices, Nanium), Acco, Apple, ASE Group, AT&T, Avago Technologies, Broadcom, Cavendish Kinetics, Cisco, DecaTechnologies, Ericsson, GLOBALFOUNDRIES, Google, HiSilicon, Huawei, Infineon, Intel, JCET/STATS ChipPAC, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Murata, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks

Solutions, Soitec, Spreadtrum, SPIL, Sprint, TDK-EPCOS, TSMC, Wisol, Xiaomi, ZTE and more…

(non-exhaustive list)

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5Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology

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6Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

REPORT METHODOLOGY

Technology analysis methodology Information collection

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WHO SHOULD BE INTERESTED IN THIS REPORT?

RF component manufacturers

• Evaluate market potential of future technologies and products

• Understand the differentiated value of your products and

technologies in this market

• Build a roadmap for modules: which type of modules? When?

• Identify new business opportunities

• Identify potential strategic partners or technology providers

• Monitor and benchmark your competitor’s advancements

RF foundries, material and equipment suppliers,

packaging houses• Understand what are the components and technologies that will

drive the volumes in 2023

• Identify new business opportunities and prospects

RF and component specialists (manufacturers,

fabless), transceiver, modem, software vendors…• Spot new opportunities and define diversification strategies linked

to RF components

Mobile phone OEMs• Evaluate market potential of future technologies and products to

differentiate your products

• Evaluate the benefits of using these new technologies in your end

system, design architectures for the next generation of systems

• Screen potential new suppliers able to provide new functionalities,

or cost and size savings

R&D centers

• Assess market potential and trends about future technologies and

products

• Distinguish the best candidates for technology transfer

Financial & strategic investors

• Understand the structure and value chain of RF cellular

technology

• Estimate the potential of new technologies such as SOI, RF

MEMS,…

• Get the list of the main key players and emerging start-ups of this

industry worldwide

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KEY FEATURES OF THIS REPORT

Market overview

o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz

o Disruptions and opportunities thereof

o Focus on various SiP architectures in RF Front-End of cellphones

o Focus on both cellular and connectivity RF Front End modules

o Market forecast to include both wafer level & SiP level revenue

o RF Front End SiP forecast in Revenue,Wafers, Units by

o Cell phone category/type

o By cellular & Wi-Fi standards

o By various types of RF Front End SiPs

o Interconnects trends forecsat for RF SiP

Technology trends and forecasts

o RF Front-End multi-die System-in-Package challenges and technology

requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands

o 5G SiP packaging roadmaps for smartphone Front-End

o Packaging trends for both cellular & connectivity modules

o Antenna in Package (AiP) trends for 5G mmWave

o Substrate trends for 5G mmWave

o Shielding trends

o RF SiP Revenue,Wafer and Unit forecasts

Supply chain analysis

• Supply chain changes in the new 5G era

• RF SiP assembly detailed supply chain of various players

• Strategies and outlook of current RF SiP manufacturers

• New entries and supply chain disruptions for mmWave packaging

• Substrate supply chain

The “RF SiP for Cellphones 2019” is the update of the of the “Advanced RF SiP for Cellphones 2017”report.The objectives of the report are as follows:

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9Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

WHAT IS NEW COMPARED TO 2017 REPORT (1/2) ?

• In 2017 RF SiP report, only PAMiD module forecast is covered. The current report extend the RF Front End SiPscope to include all RF Front End SiP for both cellular & connectivity function in cell phone:

• Cellular

• PAMiD (Power Amplifier Module with Integrated Duplexer)

• PAM (Power Amplifier Module)

• Rx DM (Receive Diversity Module)

• ASM (switchplexer) (Antenna Switch Module)

• Antennaplexers (multiplexer)

• LMM (Low noise amplifier - multiplexer module)

• MMMB PA (Multi-Mode, Multi-Band Power Amplifier)

• mmW FEM

• Connectivity

• WiFi FEM

• WiGig FEM

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10Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

WHAT IS NEW COMPARED TO 2017 REPORT (2/2) ?

• Packaging trend covering both wafer level packaging & SiP

• Interconnect trends for various components in RF SiP

• RF Front End SiP forecast in revenue, wafers, units by

o Cell phone category/type

o By cellular & Wi-Fi standards

o By various types of RF Front End SiPs

• Antenna in Package (AiP) trends for 5G mmWave application

• Substrate trends for 5G

• RF SiP assembly detailed supply chain of various players including substrate supply chain

• Packaging roadmap and challenges for 5G sub 6Ghz & mmWave applications

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11Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

SYSTEM INTEGRATION LEVELS

iPhone X

LEVEL 3:

End

Device/Equipment

LEVEL 2:

Device/Equipment

board

iPhone X PCB

Broadcom RF SiP

in the iPhone X

LEVEL 1:

Semiconductor

Packaging

LEVEL 0:

Semiconductor

Die/Wafer

Power amplifier in

Broadcom RF SiPSemiconductor

wafer

LEVEL 1+2:

Semiconductor Package + Board

Semiconductor

package

Board (PCB)

Si dies

Package Substrate

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12Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

KEY TERM DEFINITIONS

• NOTE:

• From a logical viewpoint, the following terms are highly interchangeable and their usage is unfortunately not consistentthroughout the industry

• In order to avoid confusion and enable systematic segmentation, Yole Développement uses the following definitions

• Module: A fairly general term that usually refers to separate circuit(s)/die(s) or component(s) that form a whole due tofunctional purpose or special features

• MCM: Multi-Chip-Module, a module containing multiple packages as final components (often, the whole module can be againovermolded, lided or differently encapsulated)

• MCP: Multi-Chip-Package, any package with multiple dies, with or without integrated passives

• SiP: System-in-Package, strictly speaking, needs to be a type of system, containing 2 or more dies with different functionality, withor without integrated passives. By definition, an SiP would be a type of multi-die package

NOTE: In this report, a System-In-Package is viewed from a packaging perspective, where the main challenge is integrating multiple dies,regardless of their functionality. Therefore, in order to simplify and keep the emphasis on packaging technologies, the decision has been takento treat all multi-die packages as SiP, even if they do not strictly adhere to a definition of a system. In that sense, it would be fully correct justto use the term multi-die packages but due to the commonly rooted usage of the term SiP in the industry, in this report SiP is used instead ofmulti-die package. For example multiple dies of the same functionality in one package would still be considered as SiP. Furthermore, while it’soften the case that SiPs include also passives, lack of passives would not change the SiP definition.

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KEY TERM DEFINITIONS

• PCB: Printed Circuit Board, abbreviation commonly used for system boards – Yole Développement makes a distinction betweenPCB (boards) and semiconductor package substrates (also sometimes referred to as IC substrates)

• Substrate: While a substrate can be considered on various system levels, (i.e. a transistor Si bulk substrate), the term substrateis here used for semiconductor package substrates (sometimes referred to also as IC substrate), which are package componentsbetween the die and PCB built using semi-additive processing and lamination/build up technology, namely WB/FC packagesubstrates within FC CSP/BGA or WB CSP/BGA packages

• Thin film RDL: Particular form of redistribution layer formed by thin film technologies, refers to RDLs of Fan-In and Fan-OutWLP/PLP

• Interposer: Technically, any kind of substrate/RDL has the function of “interposing” between the die and PCB, however forpractical purposes, the term interposer is used for additional interconnect components on top of a substrate, namely Si andGlass interposers

• Front-End Module (FEM): A multi die package, placed between the transceiver and the antenna that typically consists of filters,duplexers and switches, not necessarily a power amplifier

• Power-Amplifier Module (PAM): Essentially, a multi-die package of amplifiers but can integrate all components of a FEM as well

NOTE: For easier understanding and due to common usage in the industry, in this report FEM refers to a multi-die package that also containsa power amplifiers. Therefore, the term FEM is used for multi-die packages that contain filters, switches, duplexers and power amplifiers(FEMiD or PAMiD can be formal variations of the term FEM)

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SCOPE OF THE REPORT

RF Front-End SiP packaging for mobiles

Mobile phones

Mobile Infrastructure

RF front-end components (PA, LNA, filters, switches, antenna tuners)

RF Front-End packaging (FEM SiPs)

2G, 3G, 4G, 5G technologies

Modems, transceivers, baseband processors, Wi-fi & Bluetooth modules…

Antennas, IPDs, …

Topics NOT included in the report

Focus of the report

Main focus

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RF PACKAGING OVERVIEW

<1W

1-1

00W

100-1

000W

Ceramic lid with Cu flange

Over molded plastic with Cu flange

Pow

er

(W)

Frequency (GHz)6 60 >100

Plastic leadframe (QFN) packages

28 39 77

>1000W

Power modules

WL CSPQFN FO WLPWB/FC CSP2.5D interposer

Ceramic leadframe

(QFN) packages

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16Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

RF PACKAGING OVERVIEW

<1W

1-1

00W

100-1

000W

Ceramic lid with Cu flange

Over molded plastic with Cu flange

Pow

er

(W)

Frequency (GHz)6 60 >100

Plastic leadframe

(QFN) packages

28 39 77

>1000W

Power modules

WL CSPQFN FO WLPWB/FC CSP2.5D interposer

Ceramic leadframe

(QFN) packages

Focus of this report!

Advanced packages

for RF devices in

smartphone Front-

Ends

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17Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

LTE-A

Pro

CELLULAR TECHNOLOGY DEVELOPMENT

From 2G to 5G: Less than a 30 years’ journey

1992 1997 2001 2007 2010 2013 2018 2020

GSM GPRS EDGE

CDMA CDMA2000 1xRTTCDMA2000

1xEV-DO

WCDMA

TD-SCDMA

TD-CDMA

All belong

to UMTS

technology

EV-DO Rev

A/B/C

HSPA HSPA+

TD-HSPA

TDD-LTE

FDD-LTE

TDD-

LTE-

Advanced

FDD-

LTE-

Advanced

5G sub-6GHz 5G mmWave

2G 2.5G 2.75G/Pre-3G 3G 3.5G 3.9G/Pre-4G 4G Pre-5G 5G4.5G

Other standards from IEEE family

including WiMAX and iBurst

It takes around 10 years between two cellular generations, including a long transition phase with intermediate technologies.

Will be a globally

unified standard!

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20252024

2023

2022

2021

2020

2019

2018

20170

0.3

0.5

1

2

3

45

1015

20

Fre

quency

(GH

z)

APPLICATION MAPPING

5G use cases extend far beyond mobile phone, from IoT to autonomous vehicle, creating new challenges for the network in terms of data rate and latency agility.

4K video streaming

New Gaming Content

Wireless VR

AR

Port Management

Medical Robot

Industrial Automation

Smart City

Remote Surveillance

360° Video Telepresence

Drone Delivery

Autonomous Vehicle

Agriculture

Real-time Translation

Advanced AI assistant

Connected

Wearable

Cloud Computing

Connected Home

Smart Grid

Asset Tracking

Shared Utilities

Robotic Service

SUB-1

GHZ

SUB-6

GHZ

MMWAVE

(>24GHZ)

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DIFFERENT PATH, DIFFERENT USE CASES

Mobile broadband driven by down/up link data rate race required for video: multi Giga bit UE devices and routers penetrating the market.

IoT devices spread through various market segments (consumer, industrial, automotive, health, …) mostly driven by the data quest.

Courtesy of U-Blox

Cat 21Mobile broadband

Mostly video driven

Mass market

IoT devices

Data centric (tracking, health, survey, …)

Plenty of different use cases

Huge market potential

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SMARTPHONE COMPONENTS FOUND IN SiP

Application processor

(PoP)

Memory

storage

TouchscreenBattery

Front End

Module

Transceiver

Front End

ModuleLNA

Antenna

Switch

ModulePA

Modem

Front

End

Module

Antenna

Switch

Module

LNA

GPS

ISP

NFC

controller

NFC

booster

WiFi/BT/FMPA

WiFi FEM

PMU

PMULCD

TS

controller

Display

Driver

LED Flash

driverLED Flash

Camera

Front

Camera

Back

MEMS mic

MEMS micAudio

codec

3-axis

accelerometer

6-axis IMU

Compass

GyroPressure

Barometer

Heart rate

Tuner

USB/charger

Filter /

Duplexer

In SiP Not in SiP

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RF FRONT-END MODULE DEFINITIONFront-End Module with Integrated Duplexer (FEMiD) and Power Amplifier Module with Integrated Duplexer (PAMiD)

An RF FEM can include power amplifiers (PA) or low noise amplifiers (LNA), filters, switches and an antenna tuner.

Courtesy of Qualcomm, modified by Yole

RF FEM in a cellular handset

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RF SIP PACKAGING

Various process

modules used in SiP assembly

SiP assembly

SMT

Wire bond

Molding

Shielding

Inspection & Test

BGA/LGA

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MOBILE RF FEM PACKAGE TREND

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2424Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

RF FRONT END ARCHITECTURE- HIGH END PHONE (5G MM WAVE)

• RF front end has

been complexified

since integration of

new technologies

such as Carrier

Aggregation, MIMO

and later on dual

connectivity.

mmWave

connectivity will

add another RF

path to the UE.

2G PAM

3G/LTE LB PAM

Wi-Fi/BT module

3G/LTE PAM MHB

Diversity receive

Diversity receive

Diversity receiveGPS module

Multiplexer

CA

Antennaplexer

MIMO

5G PAM

Baseband

Modem

Transceiver

(integrated with PMIC)

Enveloppe

Tracker

mmWave AiP

mmWave baseband

modem

May be integrated

4x4 M

IMO

DL

LNA

FilterLNA

PA Filter

Filter

Filter

Tuner

Tuner

Tuner

Tuner

May be shared

2x2 M

IMO

DL

SiP technology Antenna+RF

transceiver+PMIC

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INTERCONNECTS IN RF SIP

Different interconnects

in SiP

Interconnects in RF SiP

Flip-chip

( Bump)

Solder

Paste printing Ball drop Plated

Cu pillar (plated)

Au bump (plated/stud)

Wire-bondTSV + RDL+

Flip-chipTSV + Wire

bond

Power Amplifiers, BAW

Filters, Switches

BAW Filters Power AmplifiersPower Amplifiers,

Switches, Filters

SAW filters,

BAW filters

FiltersFilters

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TECHNOLOGY TOOLBOX FOR RF SIP FOR 5G MOBILE

Packaging innovations needed at

various levels

Double side assembly

Double side mold

Embedded active & passives

Conformal & compartmental

shielding

Thin substrate

Miniaturized passive

components

Antenna in package

integration

Low loss materials

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ANTENNA KEY PARAMETERS

Antenna parameters

Antenna key

parameters

Effective area

Gain

BandwidthEfficiency

Polarization

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ANTENNA FOR 5G MM-WAVE SMARTPHONES

Considerations for antenna for 5G mm-Wave smartphones

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Stability of Electrical and Physical

Properties against Temperature and

Humidity Variation

Design Rule Capability

Multilayer Capability

Process tolerancesElectrical Properties

vs. Frequency

Panel Size, Process Throughput and

Cost

Manufacturing Supply Chain

Readiness

SUBSTRATE MATERIALS FOR MM WAVE APPLICATION

Key parameters for 5g substrate

Various parameters

have to keep in mind to

select substrate for

5G application

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RF FRONT-END ECOSYSTEM COMPLEXITY

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CELLPHONE AIR INTERFACE STANDARD DEVELOPMENT

Despite a slow down in mobile market growth, RF Front-End market is still expected to increase because of complexity encountered in LTE-A Pro and 5G sub 6.

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ASSEMBLY / PACKAGING MARKET FOR RF SIP FOR MOBILE

Assembly of various RF

components in SiP basically consists of 2

process: Wafer level assembly

& SiP level assembly

Assembly of RF components

Wafer level

SiP level

Cap wafer

bondingTSV

RDL/

UBMBumping Dicing

SMT Wire bond Molding Shielding BGA/LGA

Wafer

grinding

Wafer

dicingInspection

Component available as

SMT component in SiP

assembly / Flip-chip

Component available as

bare die (in wafer form) in

SiP assembly / wire-bond

process

Test

Included in

market forecast

Included in

market forecast

BAW filters SAW filters Filters / Switches / IPDs

Prior to SiP

assembly

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TOTAL ASSEMBLY MARKET FORECAST FOR RF SIP IN MOBILE

Total assembly / packaging

market for the RF SiP in

mobile will grow at 11%

CAGR to reach from

$XX B in 2017 to $XX B by

2023

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RF FEM MARKET FORECAST

By cellular & connectivity air standards (in $M)

Limited adoption of

5G mmWave, in terms of revenue.

RF FEM SiP supporting 5G mmW

and 5G sub6 will grow at CAGR of

111% & 51% respectively

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35Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

RF FEM SIP PACKAGING MARKET FORECAST

By smartphone type (in $M)

In 2023, high-end smartphone

contributes XX % RF FEM SiP

assembly market, followed by low-end smartphone

(XX %) and luxury

smartphone (XX %)

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36Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

INTERCONNECT TREND IN RF SIP FOR MOBILE

%age in terms of interconnects units counts

XXXXX

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37Advanced RF System-in-Package for Cellphones 2019 | Sample | www.yole.fr | ©2019

RELATED REPORTS

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© 2019

Yole Développement

From Technologies to Market

Source: Wikimedia Commons

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2©2019 | www.yole.fr | About Yole Développement

YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE

Life Sciences

& Healthcare o Microfluidics

o BioMEMS & Medical Microsystems

o Inkjet and accurate dispensing

o Solid-State Medical Imaging & BioPhotonics

o BioTechnologies

Power

& Wireless

o RF Devices & Technologies

o Compound Semiconductors & Emerging Materials

o Power Electronics

o Batteries & Energy Management

Semiconductor

& Software o Package,Assembly & Substrates

o Semiconductor Manufacturing

o Memory

o Software & Computing

Photonics,

Sensing & Display

o Solid-State Lighting

o Display

o MEMS, Sensors & Actuators

o Imaging

o Photonics & Optoelectronics

Semiconductor

& Software

Power & Wireless

Photonics,

Sensing

& Display

Life

Sciences &

Healthcare

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3©2019 | www.yole.fr | About Yole Développement

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research,

marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

• Design and characterization

of innovative optical systems

• Financial services (due

diligence, M&A with our

partner)

www.yole.fr

o Syndicated reports

• Market & technology reports

• Patent investigation and patent

infringement risk analysis

• Teardowns & reverse costing

analysis

• Cost simulation tool

www.i-Micronews.com/reports o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast

services

• Events: TechDays, forums,…

www.i-Micronews.com

o Monitors

• Monthly and/or Quarterly

update

• Excel database covering supply,

demand, and technology

• Price, market, demand and

production forecasts

• Supplier market shares

www.i-Micronews.com/reports

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4©2019 | www.yole.fr | About Yole Développement

6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

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5©2019 | www.yole.fr | About Yole Développement

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

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6©2019 | www.yole.fr | About Yole Développement

ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

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7©2019 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

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8©2019 | www.yole.fr | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

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9©2019 | www.yole.fr | About Yole Développement

o Over the course of more than 20 years, Yole Développement has grown to become a group of companies. Together with System Plus Consulting and KnowMade, we now

provide marketing, technology and strategy consulting, media and corporate finance services, reverse costing, structure, process and cost analysis services and well as

intellectual property (IP) and patent analysis. Together, our group of companies is collaborating ever closer and therefore will offer, in 2019, a collection of over 125 reports

and 10 new monitors. Combining respective expertise and methodologies from the three companies, they cover:

o If you are looking for:

• An analysis of your product market and technology

• A review of how your competitors are evolving

• An understanding of your manufacturing and production costs

• An understanding of your industry’s technology roadmap and related IPs

• A clear view supply chain evolution

Our reports and monitors are for you!

o Our team of over 70 analysts, including PhD and MBA qualified industry veterans from Yole Développement, System Plus Consulting and KnowMade, collect information,identify trends, challenges, emerging markets, and competitive environments. They turn that information into results and give you a complete picture of your industry’slandscape. In the past 20 years, we have worked on more than 2,000 projects, interacting with technology professionals and high-level opinion makers from the mainplayers of their industries and realized more than 5,000 interviews per year.

WHAT TO EXPECT IN 2019?In 2019 we will extend our offering with a new ‘monitor’ product which provides more updates on your industry during the year. The Yole Group of Companies is also buildingon and expanding its investigations of the memory industry. Moreover, in parallel, the Yole Group reaffirms its commitment to a new collection of reports mixing software andhardware and is increasing its involvement in displays, radio-frequency (RF) technology, advanced substrates, batteries and compound semiconductors. Discover our 2019program right now, and ensure you get a true vision of the industry. Stay tuned!

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Medical technologies

• Semiconductor Manufacturing

• Advanced packaging

• Memory

• Batteries and energy management

• Power electronics

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Imaging

• Photonics

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10©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (1/4)

18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

Market –Technology – Strategy – by Yole DéveloppementYole Développement (Yole) offers market reports including quantitative market forecasts,

technology trends, company strategy evaluation and indepth application analyses. Yole will

publish more than 55 reports in 2019, with our partner PISEO contributing to some of

the lighting reports.

Reverse Costing® – Structure, Process and Cost Analysis – by

System Plus ConsultingThe Reverse Costing® report developed by System Plus Consulting provides full

teardowns, including detailed photos, precise measurements, material analyses,

manufacturing process flows, supply chain evaluations, manufacturing cost analyses and

selling price estimations. The reports listed below are comparisons of several analyzed

components from System Plus Consulting. More reports are however available, and over

60 reports will be released in 2019.The complete list is available at www.systemplus.fr.

Patent Reports – by KnowMadeMore than describing the status of the IP situation, these analyses provide a missing link

between patented technologies and market, technological and business trends. They offer

an understanding of the competitive landscape and technology developments from a

patent perspective. They include key insights into key IP players, key patents and future

technology trends. For 2019 KnowMade will release over 15 reports.

The markets targeted are :

• Mobile & Consumer

• Automotive & Transportation

• Medical

• Industrial

• Telecom & Infrastructure

• Defense & Aerospace

• Linked reports are dealing with the same topic to provide

• a more detailed analysis.

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11©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (1/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT

• Status of the MEMS Industry 2019 - Update

• Status of the Audio Industry 2019 - New

• Uncooled Infrared Imagers and Detectors 2019 – Update

• Consumer Biometrics:Technologies and Market Trends 2018

• MEMS Pressure Sensor Market and Technologies 2018

• Gas & Particle Sensors 2018

o STRUCTURE, PROCESS & COST REPORT

• MEMS & Sensors Comparison 2019

• MEMS Pressure Sensor Comparison 2018

• Particle Sensors Comparison 2019

• Miniaturized Gas Sensors Comparison 2018

o PATENT REPORT

• MEMS Foundry Business Portfolio 2019 - New

• Miniaturized Gas Sensors 2019 - New

PHOTONIC AND OPTOELECTRONICS

o MARKET ANDTECHNOLOGY REPORT

• Photonic Integrated Circuit 2019 - New

• LiDARs for Automotive and Industrial Applications 2019 - Update

• Silicon Photonics 2018

o PATENT REPORT

• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New

• LiDAR for Automotive 2018

RF DEVICES AND TECHNOLOGIES

o MARKET ANDTECHNOLOGY REPORT

• RF GaN Market: Applications, Players, Technology,

and Substrates 2019 - Update

• 5G’s Impact on RF Front-End Module and Connectivity

for Cell Phones 2019 – Update

• 5G Impact on Wireless Infrastructure 2019

• Radar andV2X Market & Technology for Automotive 2019 - Update

• Advanced RF Antenna Market & Technology 2019 - New

• RF Standards and Technologies for Connected Objects 2018

o STRUCTURE, PROCESS & COST REPORT

• RF Front-End Module Comparison 2019 - Update

• Automotive Radar RF Chipset Comparison 2018

o PATENT REPORT

• Antenna for 5G Wireless Communications 2019 - New

• RF Front End Modules for Cellphones 2018

• RF Filter for 5G Wireless Communications: Materials and Technologies 2019

• RF GaN : Materials, Devices and Modules 2018

Update : 2018 version still available

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12©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (2/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

IMAGING

o MARKET AND TECHNOLOGY REPORT

• Status of the CIS Industry 2019: Technology

and Foundry Business - Update

• Imaging for Automotive 2019 - Update

• Neuromorphic Technologies for Sensing 2019 - Update

• Status of the CCM and WLO Industry 2019 - Update

• MachineVision for Industry and Automation 2018

• Sensors for Robotic Vehicles 2018

o STRUCTURE, PROCESS & COST REPORT

• Compact Camera Modules Comparison 2019

• CMOS Image Sensors Comparison 2019

o PATENT REPORT

• Facial & Gesture Recognition Technlogies in Mobile Devices 2019 - New

• Apple iPhone X Proximity Sensor & Flood Illuminator 2018

MEDICAL IMAGING AND BIOPHOTONICS

o MARKET ANDTECHNOLOGY REPORT

• X-Ray Detectors for Medical, Industrial

• and Security Applications 2019- New

• Microscopy Life Science Cameras: Market and Technology Analysis 2019

• Ultrasound technologies for Medical, Industrial

and Consumer Applications 2018

o PATENT REPORT

• Optical Coherence Tomography Medical Imaging 2018

MICROFLUIDICS

o MARKET ANDTECHNOLOGY REPORT

• Status of the Microfluidics Industry 2019 - Update

• Next Generation Sequencing & DNA Synthesis - Technology,

Consumables Manufacturing and Market Trends 2019 - New

• Organ-on-a-Chip Market & Technology Landscape 2019 - Update

• Point-of-Need Testing Application of Microfluidic Technologies 2018

• Liquid Biopsy: from Isolation to Downstream Applications 2018

• Chinese Microfluidics Industry 2018

o PATENT REPORT

• Microfluidic Manufacturing Technologies 2019 – New

INKJET AND ACCURATE DISPENSING

o MARKET ANDTECHNOLOGY REPORT

• Inkjet Printheads - Dispensing Technologies

& Market Landscape 2019 - Update

• Emerging Printing Technologies

for Microsystem Manufacturing 2019 - New

• Piezoelectric Materials from Bulk to Thin Film 2019 - New

• Inkjet Functional and Additive Manufacturing for Electronics 2018

o STRUCTURE, PROCESS & COST REPORT

• Piezoelectric Materials from Bulk to Thin Film Comparison 2019

Update : 2018 version still available

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13©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (3/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

BIOTECHNOLOGIES

o MARKET AND TECHNOLOGY REPORT

• CRISPR-Cas9 Technology: From Lab to Industries 2018

o PATENT REPORT

• Personalized Medicine 2019 – New

BIOMEMS & MEDICAL MICROSYSTEMS

o MARKET ANDTECHNOLOGY REPORT

• Medical Wearables: Market & Technology Analysis 2019 - New

• Neurotechnologies and Brain Computer Interface 2018

• BioMEMS & Non-Invasive Sensors: Microsystems for Life Sciences

& Healthcare 2018

o PATENT REPORT

• 3D Cell Printing 2019 - New

• Circulating Tumor Cells Isolation 2019 - New

• Nanopore Sequencing 2019 - New

SOFTWARE AND COMPUTING

o MARKET ANDTECHNOLOGY REPORT

• Artificial Intelligence Computing For Automotive 2019 - New

• Hardware and Software for Artificial Intelligence (AI)

in Consumer Applications 2019 - Update

• From Image Processing to Deep Learning 2019 - Update

• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC

and Gaming 2019 – New

MEMORY

o MARKET AND TECHNOLOGY REPORT

• Status of the Memory Business 2019 - New

• MRAM Technology and Business 2019 - New

• Emerging NonVolatile Memory 2018

o STRUCTURE, PROCESS & COST REPORT

• Memory Comparison 2019

o PATENT REPORT

• Magnetoresistive Random-Access Memory (MRAM) 2019 - New

• 3D Non-Volatile Memory 2018

ADVANCED PACKAGING

o MARKET ANDTECHNOLOGY REPORT

• Fan Out Packaging Technologies and Market Trends 2019 - Update

• 3D TSV Integration and Monolithic Business Update 2019 - Update

• Advanced RF SiP for Cellphones 2019 - Update

• Status of Advanced Packaging 2019 - Update

• Status of Advanced Substrates 2019 - Update

• Panel Level Packaging Trends 2019 - Update

• System in Package (SiP) Technology and Market Trends 2019 - New

• Trends in Automotive Packaging 2018

• Thin-Film Integrated Passive Devices 2018

o STRUCTURE, PROCESS & COST REPORT

• Advanced RF SiP for Cellphones Comparison 2019

Update : 2018 version still available

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14©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (4/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

SEMICONDUCTOR MANUFACTURING

o MARKET ANDTECHNOLOGY REPORT

• Nano Imprint Lithography 2019 - New

• Equipment and Materials for Fan Out Packaging 2019 - Update

• Equipment for More than Moore: Thin Film Deposition

& Etching 2019 - New

• Wafer Starts for More Than Moore Applications 2018

• Polymeric Materials at Wafer-Level

for Advanced Packaging 2018

• Bonding and Lithography Equipment Market

for More than Moore Devices 2018

o STRUCTURE, PROCESS & COST REPORT

• Wafer Bonding Comparison 2018

o PATENT REPORT

• Hybrid Bonding for 3D Stack 2019 – New

SOLID STATE LIGHTING

o MARKET ANDTECHNOLOGY REPORT

• Status of the Solid State Light Source Industry 2019 - New

• Edge Emitting Lasers (EELS) 2019 - New

• Light Shaping Technologies 2019 - New

• Automotive Advanced Front Lighting Systems 2019 - New

• VCSELs - Technology, Industry and Market Trends 2019 - Update

• IR LEDs and Laser Diodes – Technology, Applications,

and Industry Trends 2018

• Automotive Lighting 2018: Technology, Industry and Market Trends

• UV LEDs - Technology, Manufacturing and Application Trends 2018

• LiFi: Technology, Industry and Market Trends 2018

o STRUCTURE, PROCESS & COST REPORT

• VCSEL Comparison 2019

o PATENT REPORT

• VCSELs 2018

DISPLAY

o MARKET ANDTECHNOLOGY REPORT

• Next Generation 3D Display 2019 - New

• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New

• Micro-and Mini-LED Displays 2019 - Update

• QD and Wide Color gamut (WCG)

Display Technologies 2019 - Update

• Displays & OpticalVision Systems forVR,AR & MR 2018

o PATENT REPORT

• MicroLED Displays : Intellectual Property Landscape 2018

Update : 2018 version still available

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15©2019 | www.yole.fr | About Yole Développement

OUR 2019 REPORTS COLLECTION (5/5)18 fields of excellence combined with six markets to provide a complete picture of your industry landscape

POWER ELECTRONICS

o MARKET ANDTECHNOLOGY REPORT

• Power SiC: Materials, Devices and Applications 2019 - Update

• Power Electronics for EV/HEV and e-mobility:

Market, Innovations and Trends 2019 - Update

• Status of the Power Electronics Industry 2019 - Update

• Discrete Power Packaging : Material Market

and Technology Trends 2019 - New

• Status of the Power ICs Industry 2019 - Update

• Status of the Passive Components for the Power Electronics

Industry 2019 - Update

• Status of the Inverter Industry 2019 - Update

• Status of the Power Module Packaging Industry 2019 - Update

• Wireless Charging Market Expectations

and Technology Trends 2018

• Power GaN 2018: Epitaxy, Devices, Applications

and Technology Trends

o STRUCTURE, PROCESS & COST REPORT

• Automotive Power Module Packaging Comparison 2018

• GaN-on-Silicon Transistor Comparison 2019

• SiC Transistor Comparison 2019

o PATENT REPORT

• Power SiC : Materials, Devices and Modules 2019 - New

• Power GaN : Materials, Devices and Modules 2019 – Update

BATTERY & ENERGY MANAGEMENT

o MARKET ANDTECHNOLOGY REPORT

• Status of the Rechargeable Li-ion Battery Industry 2019 - New

• Li-ion Battery Packs for Automotive and Stationary Storage

Applications 2019 - Update

o PATENT REPORT

• Battery Energy Density Increase: Materials

and Emerging Technologies 2019 - New

• Solid-State Batteries 2019 - New

• Status of the Battery Patents 2018

COMPOUND SEMI.

o MARKET ANDTECHNOLOGY REPORT

• Emerging Compound Semiconductor

Market & Technology Trends 2019 - New

• Status of the Compound Semiconductor Industry 2019 - New

• InP Materials, Devices and Applications 2019 - New

• GaAs Wafer and Epiwafer Market: RF, Photonics,

LED and PV Applications 2018

o PATENT REPORT

• GaN-on-Silicon Substrate: Materials, Devices

and Applications 2019 - Update

Update : 2018 version still available

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16©2019 | www.yole.fr | About Yole Développement

OUR 2019 MONITORS COLLECTION (1/2)

Get the most updated overview of your market to monitor your strategy

Yole Développement, System Plus Consulting and KnowMade, all part of the Yole Group of Companies, are launching a collection of 10 monitors in 2019. The monitors aim to

provide updated market, technology and patent data as well dedicated quarterly analyses of the evolution in your industry over the previous 12 months. Furthermore, you can

benefit from direct access to the analyst for an on-demand Q&A and discussion session regarding trend analyses, forecasts and breaking news.

Topics covered will be compact camera modules (CCMs), advanced packaging, compound semiconductors, microfluidics, batteries, RF and memory.

MARKET MONITOR byYole Développement

A FULL PACKAGE:The monitors will provide the evolution of the market in units, wafer area and revenues.They will also offer insights into what is driving the business and a close look at what ishappening will also be covered in it.

The following deliverables will be included in the monitors:

• An Excel database with all historical and forecast data

• A PDF slide deck with graphs and comments/analyses covering the expected

evolutions

o ADVANCED PACKAGING – NEWThis monitor will provide the evolution of the advanced packaging platforms. It willcover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5Dand 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q32019

o COMPOUND SEMI. – NEWThis monitor will describe how the compound semiconductor industry is evolving. Itwill offer a close look at GaAs, InP, SiC, GaN and other compounds of interestproviding wafer volumes, revenues, application breakdowns and momentum.Frequency: Quarterly, starting from Q3 2019

o CAMERA MODULE – NEWThis monitor will provide the evolution of the imaging industry, with a close look atimage sensor, camera module, lens and VCM. Volumes, revenues and momentum ofcompanies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.Frequency: Quarterly, starting from Q3 2019

o MEMORY – UPDATEFor the memory industry you can have access to a quaterly monitor, as well as anadditional service, a monthly pricing. Both services can be bought seprately:

• DRAM Service: Including a quarterly monitor and monthly pricing.

• NAND Service: Including a quarterly monitor and monthly pricing.

REVERSETECHNOLOGY MONITOR by System Plus Consulting

o SMARTPHONES – NEWTo stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone ReverseTechnology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at thebeginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

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17©2019 | www.yole.fr | About Yole Développement

OUR 2019 MONITORS COLLECTION (2/2)

Get the most updated overview of your market to monitor your strategy

PATENT MONITOR by KnowMade

A FULL PACKAGE:Starting at the beginning of the year, the KnowMade monitors include the following deliverables:

• An Excel file including the monthly IP database of:

• New patent applications

• Newly granted patents

• Expired or abandoned patents

• Transfer of IP rights through re-assignment and licensing

• Patent litigation and opposition

• Quarterly report including a PDF slide deck with the key facts & figures of thequarter: IP trends over the three last months, with a close look to key IP players andkey patented technologies.

o GaN for Power & RF ElectronicsWafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductordevices such as transistors, and diodes, devices and applications including converters,rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits(MMICs), packaging, modules and systems.

o GaN for Optoelectronics & PhotonicsWafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices suchas LEDs and lasers; and applications including lighting, display, visible communication,photonics, packaging, modules and systems.

o Li-ion BatteriesAnodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made ofLithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium NickelCobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), LithiumMetal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytesincluding liquid, polymer/gel, and solid inorganics; ceramic and other separators;battery cells including thin film/microbattery, flexible, cylindrical and prismatic; andbattery packs and systems.

o Post Li-ion BatteriesBattery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,battery cells and battery packs/systems.

o Solid-State BatteriesSupply chain including electrodes, battery cells, battery packs/systems andelectrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.

o RF Acoustic Wave FiltersIncluding Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, BulkAcoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-Mounted Resonator (BAW-SMR), and Packaging.

o RF Power AmplifiersIncluding Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wavetechnology.

o RF Front-End Modules

o MicrofluidicsFrom components to chips and systems, including all applications.

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18©2019 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 11,200+

monthly unique visitors, the

10,500+ weekly readers of

@Micronews e-newsletter

Several key events planned for

2018 on different topics to

attract 120 attendees on average

Gain new leads for your business

from an average of 340

registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Director

Page 56: Advanced RF System-in-Package for Cellphones 2019 · 2019-03-26 · Advanced RF System-in-Package for Cellphones 2019 | Sample | | ©2019 8 KEY FEATURES OF THIS REPORT Market overview

19©2019 | www.yole.fr | About Yole Développement

CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: [email protected] – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: [email protected] – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Korea & Singapore)

Email: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development

Email: [email protected] - +886 979 336 809

• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership with Woodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development

Email: [email protected] - +1 208 850 3914

o CUSTOM PROJECT SERVICES

• Jérome Azémar, Technical Project Development Director

Email: [email protected] - +33 6 27 68 69 33

o GENERAL

• Camille Veyrier, Director, Marketing & Communication

Email: [email protected] - +33 472 83 01 01

• Sandrine Leroy, Director, Public Relations

Email: [email protected] - +33 4 72 83 01 89 / +33 6 33 11 61 55

• Email: [email protected] - +33 4 72 83 01 80

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