agile manufacturing of glass carriers for fan-out · agile manufacturing of glass carriers for...

Agile Manufacturing of Glass Carriers for Fan-OutDr. Jay ZhangBusiness Development Director, Corning Precision Glass Solutions

Presentation Outline

I. Introduction to Corning Precision Glass SolutionsII. Carrier requirements for fan-out

• Understanding in-process warp• Levers to control warp• Real-world customer challenges

III. Introducing Corning Advanced Packaging CarriersIV. Glass Considerations and Corning’s Agile Manufacturing PlatformV. Concluding Remarks

© 2019 Corning Incorporated .


Corning Incorporated is one of the world’s leading innovators in materials science. For more than 165

years, Corning has applied its unparalleled expertise in glass science, ceramics, and optical physics to

develop products and processes that have transformed industries and enhanced people’s lives.

Founded: 1851

Headquarters: Corning, New York

Employees: ~ 46,000 worldwide

2017 Core Sales: $10.3 billion

Fortune 500 Ranking (2017): 298

v

Introduction to CorningWe understand the Periodic Table of a glass scientist

Network modifiers

Colorants

Fining agents(get rid of bubbles)

Glass formers

‘Backbone’ or network formers

Network modifierse.g. sodium or calcium


Corning Precision Glass Solutions offers industry leading wafer and panel format glass-based solutions.

Our products help customers deliver increasingly demanding functionality and form factor requirements in consumer devices and

Internet of Things applications.

Through Glass Via Solutions*

Wafer-Level Optic Solutions

Augmented Reality Solutions

Wafer-Level Capping Solutions

Custom Glass Solutions

5

*Development program

Carrier Solutions


Understanding in-process warpCTE mismatch in carrier applications induces in-process warpAssuming bi-axial bending, the bending curvature due to CTE mismatch and high process temperature is:

( )( )( )( )

( )( ) ( )

g process room g g

gg 4 4 2 2g g g g

gg

6 ( )

112 2 3 2

11

s s s

sss s s s

ss

T T t t t t

E vE vt t t t t t t t

E vE v

α ακ

− − += −− + + + +

−−

: Young's modulus; : Poisson's ratio; : Glass thickness;: Coefficient of thermal expansion; : Temperature.

g: glass; s: semiconductor layers (MC + redistribution layers + die)

E tT

να

( )( )( )( )

( )( ) ( )

( )( )

2g process room g g

gg 4 4 2 2g g g g

gg

g22

g g

11 cos 1 cos2 2

3 ( )

114 2 2 3 2

11

1 0.75

1

s s s

sss s s s

ss

s s

s

LW R

L T T t t t t


E vE v

E v tL TE v t

α κκ

α α

α

= − = −

− − +≈

−− + + + +

−−

−≈ ∆ ∆

−

L LRα κ= =1R κ=

and the warp is:

glass, , ,g g g gE v t α

, , ,s s s sE v t α semi


Understanding in-process warpCTE mismatch in carrier applications induces in-process warp


( )( )( )( )

( )( ) ( )

( )( )

2g process room g g

gg 4 4 2 2g g g g

gg

g22

g g

11 cos 1 cos2 2

3 ( )

114 2 2 3 2

11

1 0.75

1

s s s

sss s s s

ss

s s

s

LW R

L T T t t t t


E vE v

E v tL TE v t

α κκ

α α

α

= − = −

− − +≈

−− + + + +

−−

−≈ ∆ ∆

−

glass, , ,g g g gE v t α

, , ,s s s sE v t α semi

Under typical fan-out conditions, in-process warp follows a simplified formula showing its dependence on:

1. CTE mismatch between glass and the composite semi material 2. Glass Young’s modulus 3. Square of glass thickness

Levers to control in-process warpDecreasing ∆CTE between carrier and semi

g s

g s

s

o oroom process

70GPa; 20GPa;0.22; 0.35;1.1mm; 0.15mm;

20 C; 250 C;g

E Ev vt t

T T

= =

= =

= =

= =

300mmL =


Perfect CTE match is desirable, but not possible due to composite semi CTE changing in process

Levers to control in-process warpIncreasing the modulus of the carrier

s

g s

s

o

o oroom process

20GPa;0.22; 0.35;1.1mm; 0.15mm;

ΔCTE 1.0ppm/ C; 20 C; 250 C;

g

Ev vt t

T T

== =

= =

=

= =

300mmL =


Warp is inversely proportional to the Young’s modulus of the carrier

Levers to control in-process warpIncreasing the thickness of the carrier

g s

g s

so

o oroom process

70GPa; 20GPa;0.22; 0.35;0.15mm;

ΔCTE 1.0ppm/ C; 20 C; 250 C;

E Ev vt

T T

= =

= =

=

=

= =

300mmL =


Warp is inversely proportional to carrier thickness squared, but returns diminish beyond 1mm

Levers to control in-process warp∆CTE is part of fan-out reality

s

g s

s

o oroom process

20GPa;0.22; 0.35;1.1mm; 0.15mm;

20 C; 250 C;=300mm.

g

Ev vt t

T TL

== =

= =

= =


Higher Young’s modulus helps overcome the ∆CTE mismatch challenge

Real-world customer challengesAdditional considerations

Product• CTE mismatch is unavoidable due to different materials

added during fan-out• Very high YM may introduce failure modes not yet well

understood• Too high a carrier thickness limits the Z-height of the package

Material availability and consistency• Long lead times for carrier samples result in delayed

package development• Changes in carrier material during MP ramp may create

issues

Real-world customer challengesCustomer selection of ideal carrier CTE may take more than a year

Research & Development Mass Production (MP)

Customer Challenges

Vendor/Material Requirements

• Identifying CTE• Iterate design

• Multiple CTEs fast• Fine granularity of available

CTEs

6-9 months

Small volume test cycles

• Finalize CTE• Lock in design

• Quick turnaround of chosen CTE

• Flexibility to go back to small volume design changes

• Reliable supply of MP volume with consistent material properties

• Ability to ramp quickly• Ability to work with customer

to finalize and deliver the specs

6-9 months +3-4 months

Small volume test cycles CTE finalization

6-9 months +3-4 months

Small volume test cycles CTE finalization

>6 months

Introducing Advanced Packaging CarriersUp to 40% reduction in customers’ in-process warp

Fine granularity of CTEs

High stiffness

4-6 week sample lead time


We’ve tailored our glass carriers by Young’s Modulus and CTE to meet customers’ requirements for advanced packaging

Youn

g’s

Mod

ulus

(GP

a)

CTE (ppm/oC)

Corning Carrier Solutions

NEW Advanced Packaging Carriers

Standard Glass Carriers


70.0

75.0

80.0

85.0

90.0

95.0

3 4 5 6 7 8 9 10 11 12 13

90-95

85-90

80-85

75-80

70-75

65-70

Optimized for Chip-First Optimized for Chip-Last

Standard Glass Carriers

NEW Advanced Packaging Carriers

Introducing Corning Advanced Packaging CarriersDemonstration of high stiffness in Corning’s carriers


Watch this video at: http://www.corning.com/worldwide/en/products/advanced-optics/product-materials/PrecisionGlassSolutions/advanced-packaging-carriers.html

Introducing Corning Advanced Packaging CarriersSimulation results after PMC: Typical vs. Corning Advanced Packaging Carrier

Typical carrier

Corning Advanced Packaging Carrier


20% reduction in in-process warp

Source: ASMPT

Introducing Corning Advanced Packaging CarriersDemonstration of the impact of in-process warp on chucking

Watch this video at: http://www.corning.com/worldwide/en/products/advanced-optics/product-materials/PrecisionGlassSolutions/advanced-packaging-carriers.html


Introducing Corning Advanced Packaging CarriersCombining core strengths to support fan-out industry requirements

Glass science expertise


Customer Stage

Supply high quantity of selected carrier

Understand material

requirements

Develop high YM glass in

multiple CTEs

Deliver multiple CTE samples in 4-6 weeks

Research & Development Mass Production

Agile Manufacturing Platform

Component Expansion Modulus

SiO2 ↓ ↓Al2O3 ↓ ↑B2O3 ↓ ↓Li2O ↑ ↓Na2O ↑ ↓K2O ↑ ↓MgO ↑CaO ↑TiO2 ↑ZrO2 ↑

Corning glass science expertiseThese components determine the properties of glass for fan-out

Positive impact for FONeutral impact for FONegative impact for FO


Network modifiers

Colorants

Fining agents(get rid of bubbles)

Glass formers

Corning glass science expertiseExample of glass development for CTE range of 7.5-10 ppm/oC

• High accuracy of regression model designed for CTE space provides high confidence in predicted CTE based on glass composition

• We can control batch materials to hit CTE within +/- 0.1 ppm/oC


Introducing Advanced Packaging CarriersUp to 40% reduction in customers’ in-process warp


Thank you! Contact me at [email protected] for more information

Fine granularity of CTEs

High stiffness

4-6 week sample lead time

mailto:[email protected]

agile manufacturing of glass carriers for fan-out · agile manufacturing of glass carriers for...

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