_akrometrixsolutionscompetitiveanalysis.ppt

Automated Flatness Inspection

Akrometrix

Surface Characterization Solutions and Competitive Analysis

Presentation

To

Flextronics

April 25, 2008


To deliver innovative flatness measurement software solutions, hardware, analysis

capabilities and test services to the microelectronics industry supply chain...

Akrometrix Mission


Company OverviewAkrometrix was founded in 1994 in Atlanta, Georgia, USA, based on applied research by Professor Charles Ume at the Georgia Institute of Technology.

Innovation Milestones:

• 1994 – Started delivering test services

• 1997 – Introduced the TherMoiré PS88

• 2000 – Introduced the LineMoiré PS16

• 2003 – Introduced the TherMoiré PS400

• 2004 – Introduced the Convective Module

• 2005 – Introduced the PS600 and next generation PS200

• 2006 – Introduced the J5000, CoolBoost Module

• 2007 – Introduced the LineMoiré PS16M, XL , DIC Module and MP10 Module

• 2008 – Worldwide sales, service and support in the Americas, APAC and EMEA

Akrometrix has over 170 installations worldwide, as well as local China service/support.

95% of the top 20 OEMs in the world have Akrometrix equipment.


Akrometrix Flatness Characterization techniques can identify and reduce common flatness related defects such as:

• Solder joint opens, bridges, cracking• Package delamination• Silicon chip cracking• Solder paste misprints• Component placement errors

Value PropositionAkrometrix provides the microelectronics

industry with unique and enabling metrology solutions to address yield loss and reliability

related field failures…


Core Competencies

• Modular Metrology

• Advanced Thermal Profiling

• Application Specific Analysis Algorithms

• Comprehensive Data Management

• Global Service and Support


Applications

• Research and Development – Prototyping

• Performance Validation – Stress and strain

• Reliability Modeling

• Product Development – NPI line

• Manufacturing QA/QC – Defect/failure analysis

• Manufacturing Process Optimization – New materials


Modular Metrology Platform:

- Shadow Moiré

- Convective Module (HHCM)

- Digital Image Correlation (DIC)

- Micro Fringe Projection (MP10)

- CoolBoost

TherMoiré Platform

HHCM

MP10 CoolBoost

DIC


Specifications• Sample Size: PS200 - up to 200 x 200 mm

PS400 - up to 400 x 400 mm

PS600 - up to 600 x 600 mm

• Vertical Resolution: ± 0.8 µm

• Lateral Resolution: 1392 x 1080 pixels

• Data Acquisition Time: 1 second

• Temperature Range: Room Temperature to 300 C

• Automated heating, cooling and exhaust

Current TherMoiré Product Line


Recent TherMoiré PS400 Improvements

• 1.4 MP camera allows for 4x higher pixel density

• Windows XP-compatible software

• Convective Module is 4x larger (200 x 200 mm)

• Capable of being integrated with DIC and MP10 Modules


Productivity with Refrigerated Boost - 250 to 30 C Profile

0

50

100

150

200

250

300

1

60

119

17

8

23

7

29

6

35

5

41

4

47

3

53

2

59

1

65

0

70

9

76

8

82

7

88

6

94

5

10

04

10

63

112

2

118

1

12

40

12

99

Time (seconds)

Tem

pe

ratu

re (

C)

Refrigerated Boost Room Temperature Air

CoolBoost Module Delivers 50% higher throughput


Batch Processing and Statistical Analysis


Spider Frame with Quartz Insert:Enables further increases in throughput


Digital Image Correlation fully integrated with the TherMoiré PS400

• Exclusive, global partnership with Correlated Solutions (Columbia, SC USA) for the distribution of DIC equipment into the microelectronics industry

• CS was founded in 1998 and has over 150 installations worldwide

• Their engineering staff has over 80 combined years of DIC experience

• DIC software is robust, versatile, highly automated and fully integrated into the TherMoiré platform

• Camera mounts integrated into PS400 oven

• Designed for simple installation/removal

• Can be used with Convective Module

• Features remote control movement of calibration sample for ease of use

• Together, Akrometrix and Correlated Solutions deliver 25 combined years of optical, non-contact metrology expertise


DIC Module: Camera Configuration


DIC Module: Data Output

U Strain measurement (26°C to 210°C). 3D plot.

V strain measurement (26°C to 260°C). 2D plot overlayed on sample

Z-axis displacement at 260°C. 3D plot.

MP10 Module - Micro Fringe Projection


The MP10 Module for the TherMoiré PS400

• Ability to measure small samples down to 1 x 1 mm and below• Finer XY imaging resolution• No grating adjacent to the sample• Higher tolerance for measuring discontinuous surfaces• Analysis almost identical to shadow moiré


Fringe Projection Technique

• Non-contact, non-destructive• Full field, high data density• High speed• Combined with Phase Shifting Technique


The MP10 in the TherMoiré PS400

Specifications Region of Interest: 17 x 13 mm

Vertical Resolution: ± 2.5 µm

Lateral Resolution: 1392 x 1040 pixels

Temperature Range: Room Temperature to 300 ºC (continuous)

Air cooling and exhaust

Time per Measurement: 3 seconds (data acquisition), 3-10 seconds total


MP10 Configuration

Camera

Camera Lens

Micro-motorController

Grating

CollimatedLens

ProjectionLens

Light Bundle Holder


Principle of Fringe Projection

I1

I2

I3

I4

Phase


MP10 Module: Measurement Capabilities

• Based on fringe projection• Full-field, non-contact optical technique• Time per measurement - 3 seconds• Temperature-dependent z-axis measurement (-55C to 300C)• 2.5 micron resolution• Sample sizes as small as 1 x 1 mm• Pixel size of 12 x 12 micron


Calibration

• MP10 comes with a metal calibration standard (NIST-traceable certification) and white flat reference plane.

• Measured heights from the MP10 system are compared with known heights from the standard certificate to verify system calibration.

• Fringe value (the height-per-fringe-change) is the calibration constant.

• The AkroDAQ software has a special calibration wizard for measuring the calibration sample and recalibrating the system.


Applications (12×12mm area on a coin)

PS400, 100lpi MP10PS400, 300lpi


Applications (14×14mm PCB BGA Site)

PS400, 300lpi MP10


Applications (14mm PCB BGA Site, Zoomed View)


Applications(14 × 14 mm PoP)


Applications 4.5×4.5mm area with solder bumps

Ball pitch ~= 0.56mm


Applications(14 × 14 mm PoP)

PS400, 100lpi MP10


Applications (13mm PBGA)


2nd/3rd Order Surface Fit

2nd order surface fit3D surface plot


New Features in MP10 Fringe Analysis Software

• Multiple phase images and display windows may be open at the same time

• Commands are available by right-mouse clicking on the image

• Phase image filtering is applied as a command, not an option during analysis, and can be applied multiple times

• 2nd order and 3rd order surface fit functions added


Convective Module for the TherMoiré PS400

• Convectively heated and cooled chamber

• Modular design for simple installation/removal (<2 minute switchover)

• Sample sizes up to 200 x 200 mm• -55 C to 300 C temperature range• 30 minutes from room temperature to

–55 C to 150 C


Case Study: BGA Temperature Cycling Using Convective Module for the TherMoiré PS400

•Sample: 37.5mm BGA

•Temperature profile: RT -> –40C -> 125C

•Equipment: TherMoiré with Convective Module

•Data collection every 10 degrees


Akrometrix TherMoiré PS400 vs.

Direct Projection Technique


Akrometrix PS400 vs. DPTAkrometrix PS400 Direct Projection Technique

Principle Shadow Moiré technique Direct projection technique

Real-time inspection Yes (<1 sec data acquisition time) No (4 sec data acquisition time)

Depth of field (DOF) 5 mm fixed (with 100 lpi grating)20 mm fixed (with 50 lpi grating)

Larger DOF possible with DIC module

Variable from 4 – 32 mm (dependent on FOV)

Step height measurement? Yes (with DIC module) Yes

Sample size 5 mm to 400 mm (base PS400)<1 mm to 13 mm (with MP10 module)

10 mm to 200 mm

Field of view (FOV) Min: 13 x 17 mm (with MP10 module)Max: 400 x 400 mm (base PS400)

Min: 25 x 25 mmMax: 200 x 200 mm

Z-axis resolution FOV up to 400 x 400 mm: 2.5 um (with 100 lpi grating)FOV up to 100 x 100 mm: 0.8 um (with 300 lpi grating)

FOV of 25 x 25 mm: 2.5 umFOV of 200 x 200 mm: 20 um

Z-axis resolution dependent on FOV?

No Yes

Simultaneous X-Y-Z deformation measurement (warpage, CTE, strain, etc.)?

Yes (with DIC module) Yes

Max temperature variation during data acquisition

<2.5 C Up to 12 C

CONFIDENTIAL


Compliance - JEDEC JESD22B112

Akrometrix PS400 Direct Projection Technique

Measuring Parameters

Total warpage magnitude as function of reflow temperature

Yes Yes

Sign convention Yes No

3D and 2D plots Yes Yes

Diagonal line scan Yes Yes

Measurement Setup

Number of thermocouples available for sample temperature monitoring

8 Unknown

Driving thermocouple placement Bottom only Top and bottom of sample(can result in loss of data)

Temperature range -55 C to 300 C -40 to 300 C

CONFIDENTIAL

Disclaimer: Information on direct projection equipment obtained from published literature, 3rd party evaluators and technical publications.

Automated Flatness InspectionAutomated Flatness Inspection

• Siemens AG• HP• Flextronics• Alcatel Lucent• ASE• Samsung• Henkel• ISE Labs• Altera• Nitto Denko• Sony• IZM Fraunhofer Institute• Nippon CMK• Agere• Freescale Semiconductor• Mitsubishi Gas Chemical• Spansion

• ChipPac• TI • IBM• Cisco• Fujitsu• 3M Corporation• Sony Semiconductor • Canon• CMK• Intel• Cookson Electronics• Denso• Shiima Electronics• Namics Corporation• Hynix• Kyocera SLC• Sun Micro

• Shinko• Fujikara• Micron Technologies• Sanyo• Shinko Electric• Infineon• Philips CFT• EMC• Research In Motion• Sony Japan• Toshiba Japan• NEC• Amkor• STMicroelectronics• Renesas• Seagate• OSE• Skyworks

Akrometrix Customer List (Partial)>170 Installations Worldwide

Automated Flatness InspectionAutomated Flatness Inspection

• Innovative solutions provider for flatness measurement and analysis

• The industry leader in temperature dependent metrology

• Vendor committed to innovation through software development

• An Industry leader in standards for methodology

Summary


Questions?

ContactJoe Thomas in the USA

[email protected]

HT Poh in [email protected]


Thank You!

_akrometrixsolutionscompetitiveanalysis.ppt

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