al - kapton bus development at riken
DESCRIPTION
Al - Kapton Bus development at RIKEN. Process Sticking Al – Kapton Etching Through hole Stacking Gold plating Issues Plan. Atsushi Taketani ([email protected]). ALICE Full Al BUS. 5 to 7 m m Al. 12 m m Polyimide. 5 to 7 m m Al. 5 m m glue. 12 m m Polyimide. 5 m m glue. - PowerPoint PPT PresentationTRANSCRIPT
2004-11-15 ALICE ITS 1
Al - Kapton Bus developmentat RIKEN
Atsushi Taketani ([email protected])1.Process
2.Sticking Al – Kapton
3.Etching
4.Through hole
5.Stacking
6.Gold plating
7.Issues
8.Plan
2004-11-15 ALICE ITS 2
ALICE Full Al BUS5 to 7 m Al
12 m Polyimide5 m glue5 to 7 m Al
12 m Polyimide5 m glue
15 m Al5 m glue
12 m Polyimide5 m glue
5 m glue12 m Polyimide
5 m glue
5 m glue12 m Polyimide
Glue 35 m 0.0122%X0
Al 125 -130 m 0.140% X0
Polyimide 60 m 0.0210%X0
50 m Al
50 m Al
Total radiation length = 0.173 % X0
2004-11-15 ALICE ITS 3
Manufacture Process
Aluminum
Polyimide
1 Glued
Polyimide
2 Etching
Polyimide
3 Glued
Aluminum
4 Through hole
5 Alignment and Etching
6 Gold plating
2004-11-15 ALICE ITS 4
Sticking Al - Kapton
8 micron m Polyimide (Ink)
12 micron m Al
Press with heat
No glue!
2004-11-15 ALICE ITS 5
Etching
ALICE BUS VerticalALICE BUS Horizontal
I bring most of the samples which I show in slides.
Trying 30 micron line width!
2004-11-15 ALICE ITS 6
Our Trial pattern
12 micron Al
8 micron Kapton
Single layer
80 micron space
80 micron width
2004-11-15 ALICE ITS 7
Bad etching sample
Fatal caseDimple along the line
We expect to avoid these problem by washing with NaOH before photo resist painting.
2004-11-15 ALICE ITS 8
Sticking next layer
8 micron m Polyimide (Ink)
12 micron m Al
Press with heatNo glue!
Etched
8 micron m Polyimide (Ink)
12 micron m Al Not Etched
2004-11-15 ALICE ITS 9
Through Hole (Laser drilling)
2004-11-15 ALICE ITS 10
Through Hole (Cross section)
0.5mm
2004-11-15 ALICE ITS 11
Stacking layer
8 micron m Polyimide (Ink)
12 micron m Al
8 micron m Polyimide (Ink)
12 micron m Al
Etched
Not Etched
Photo resist
Project line patterns with alignment (Common technique for Cu board)
2004-11-15 ALICE ITS 12
3 signal layers + Power/GND layers
Top
2nd
3rd
2004-11-15 ALICE ITS 13
Gold Plating
• We already made a Al -Ni-Au plated sample.
• It worked for Al wire boding.
2004-11-15 ALICE ITS 14
Issue
50 m Al
50 m Al
We do not have an idea how to make these steps
2004-11-15 ALICE ITS 15
Possible Solution
50 m Al
50 m Al
Additional through hole and bonding pad
2004-11-15 ALICE ITS 16
Plan• We almost establish essential techniques
which we need.• I am requesting a board including all
essential techniques( etching, through hole, stacking with alignment, gold-plating)
• It will come end of Dec. 2004.• After we confirm them, we start to design
PHENIX board in Jan. 2004 and fabricate until Mar. 2005.(fastest guess)