ALICE SSD 20 May Yalta G-J Nooren ALICE SSD status ALICE SSD 20 May Sensor delivery and testing deliveries proceeding well: > 1200 delivered proper balancing needed: 3 manufacturers 1 testing site 3 module assembly sites testing defines layer 5 or layer 6 need layer 5 first matching of bias curves per half ladder testing on critical path ALICE SSD 20 May HAL 25 production status 28 k chips in house second production : 13 wafers delivered mid March, 3 tested 90 % yield thinning etc. ordered 25 more wafers delivered, to be tested chipcable production status ~ 16 k delivered Industrial production started 23 k chips in SSD ALICE SSD 20 May bonding chips Real yield ~ 85 % faulty cables, faulty chips, faulty bonding ALICE SSD 20 May Hybrids ~2000 subhybrids delivered, ~1000 bonded ALICE SSD 20 May module assembly status Folded, ready for ladder assembly 267 modules plus: Hybrids for 200 Chips for in SSD ALICE SSD 20 May module yield & quality In March, > 20 % of mass produced modules from Strasbourg and Trieste have IV-curves like Investigations at Helsinki and Utrecht Strasbourg Trieste measurements I-V curves noise response to laser optical inspection V_depl = 55 V TRI029/ITC332 ALICE SSD 20 May I-V measurement set up ALICE SSD 20 May I-V trouble: evidence 1 Hybrid GND decoupled from bias: normal behaviour ALICE SSD 20 May I-V trouble: evidence 2 By changing the Hybrid- GND potential the rise shifts forward The slope is ~1M (current by-passed the N-side resistor) ALICE SSD 20 May ALICE SSD 20 May Detailed view of a faulty bond A possible short between metal strip and p-stop sensor bonding pad chipcable ALICE SSD 20 May module yield & quality (contd) problem analysed and understood repair method available and tested bonding method improved: last modules MIPOT, Helsinki 95 % IReS 85 % mostly other failures TRI074/ITC447 ALICE SSD 20 May Thermal cyclings (hybrids/chips) Two cycling sessions Cycling profile (26 min.) 1) 16 glued chips and 6 hybrids cycled one week (387 cycles) Small vibration due the cycles caused by oven compressors 2) 5 glued and 5 unglued chips cycled one week (380 cycles) Vibrations eliminated Henri Seppnen in SSD meeting, Jalta, 16-20th of May 2005 ALICE SSD 20 May Thermal cycling test results Results 1) Chips and hybrids tested after 387 cycles - All 16 chips have many bonds opened - 30*** cables have more open bonds than 10*** cables - All 6 hybrids got fatal damages 2) 10 chips tested after 90, 264 and 380 cycles - One unglued chip got 2 open bonds after 264 cycles and got ExTest error. - No other damages. ? Indicates that vibrations + cycling might cause damages? Not likely in the ALICE conditions, but more research will be done In the past 1 hybrid survived 350 cycles, no chip functionality failures after 1326 cycles ALICE SSD 20 May Ladder cable status First prototypes delivered discussing delivery schedule 3400 in SSD ALICE SSD 20 May Ladderframes assembly is going on, 1/day 10 ladder5, 14 ladder6 72 ladders in SSD Ladderframe with all 75 sensor supports within 0.03 mm in same plane ALICE SSD 20 May Ladder assembly status Transport of French machine to SUBATECH Tests of module gripper First calibration of NIKHEF machine: 2 m accuracy of positioning, TDR: X 10 m, R 90 m, Z 50 m first ladder before summer (SUBATECH and NIKHEF) start mass production from September compatible with July delivery Formation of teams in SUBATECH and NIKHEF Calibration ladder, measured relative to ladder supports ALICE SSD 20 May Clean room SUBATECH Module and ladder storage Module test bench Ladder assembly benchSoldering bench Ladder test bench Ladder cable test bench ALICE SSD 20 May Assembly bench (2) Installation at SUBATECH : week 17 ALICE SSD 20 May Graphic user interface ALICE SSD 20 May conclusion Excellent cooperation in heterogeneous team Good progress in module production, but Folding of modules not yet started at production sites Testing of sensors too slow Slowly working towards assembly of first ladders SSD assembly late start due to cone problems important decisions this week: module test requirements ladder support rings grounding Money and manpower problems showing up everywhere