alloy thin films by: nelson voldeng advisor: dr. king
Post on 21-Dec-2015
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Alloy Thin FilmsBy: Nelson Voldeng Advisor: Dr. King
Thin Film Applications
• •Semiconductor processing for integrated electronic components and sensors• •Super conductor materials for tomorrow’s new technologies• •Anti-reflective (AR) optical films for better light transmission and clarity• •Clear conductive films used in touch-screen and plasma flat panel display
technologies• •Hard film wear-ability coatings for tool steel and internal combustion engine
components• •Reflective coatings for media storage like CD’s, DVD’s, and tape• •Conductive coatings for miniature medical probes and sensors• •Flexible and bendable lenses for X-ray wave length telescopes for space
exploration• •Thin film coatings on Mylar, poly-carbine, and other substances for protective
and/or decorative applications• Etc…
Overview of Research
-Goals
-Sputtered films/sectioned films
-Taking data (largest hurdle)
-Results
-Future research
Goals• Research electronic applications (as well as
others) for alloy thin films.
• Have alloy film with columnar single crystals from top the film to bottom.
Phase Diagram Cu-Ag
Sputtering Mechanism and Film
Physics
Physics Continued.
• Em=0.4E*(M1+M2)/(M1+M2)^2• E=Kinetic energy of incoming particle.• M1=Mass of incoming particle.• M2=Mass of target particle.
• If Em>bond energy there’s a chance you can remove a target particle.
Hurdles with taking data• ZIESS and Profilometer microscope failed.
AFM failed at first due to 150µm maximum scanning parameter. Succeeded by measuring cracks and scratches on films
Measuring the films at first• Not easy, time consuming, and poor data.
More bad data
Good results
Gap picture
Results Overview• Height graphs for Ag and Cu
• Approximate Deposition rates for Ag and Cu
• Composition charts for CuAg film
Height graphs AgAg20min2cm side1
0
100
200
300
400
500
600
700
0 2 4 6 8 10
Series1
Ag20min2cm side2
0100200300400500600700800900
0 2 4 6 8 10
Series1
Ag30min2cm(9-16side) height(nm) vs. position
0
100
200
300
400
500
600
700
0 2 4 6 8 10
Series1
Deposition rates for Ag
Atoms per sec 1st half of side1
0
1
2
3
4
5
6
0 0.2 0.4 0.6 0.8 1 1.2
Series1
Series2
Series3
Series4
Atoms per sec 1 side 2nd half
0
1
2
3
4
5
6
0 0.2 0.4 0.6 0.8 1 1.2
Series1
Series2
Series3
Series4
Unusable height graph for Cu
Cu20min2cm height(nm) vs. position
0
200
400
600
800
1000
1200
1400
0 2 4 6 8 10 12
-Diamond scribe unreliable for scratching films.-Cuts into substrate and shatters film.
Most Recent Breakthrough!-Previously we thought Profilometry
gave unusable results. -However, the once deemed useless
profilometer is much quicker at measuring films. 1hr40mins per film (profilometer) vs. 5hrs per film (AFM)
Cu30min2cm side 1 height(nm) vs. position
0
50
100
150
200
250
300
350
400
450
1 2 3 4 5 6 7 8
Series1
Cu30min2cm side 2 height(nm) vs. position
0
50
100
150
200
250
300
350
400
450
500
1 2 3 4 5 6 7 8
Series1
Sputtering rates
Cu30min2cm and Ag30min2cm(9-16side) height(nm) vs. position
0
100
200
300
400
500
600
700
0 2 4 6 8 10
Series1
Series2
Concentration and Mole Wt Graphs for AgCu Alloy
Percentage vs. position
0
10
20
30
40
50
60
70
80
90
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Mole Wt% Ag
Mole Wt% Cu
Percentage vs. position
0
20
40
60
80
100
120
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
Concen. Wt% Ag
Concen. Wt% Cu
For Future research• Film measurement Profilometer
• Film sputtering scotch tape method, or lithography
• Composition control Use targets with unequal element areas. Use target that is an alloy
• Need more accurate results More data points for film thickness.
Thanks• Dr. King and the Materials Department.
• Grad. Students and Kei.