alpha argomax sinter technology/media/files... · 2017-02-13 · alpha® argomax® sinter...
TRANSCRIPT
ALPHA® ARGOMAX® SINTER TECHNOLOGY
How can you improve the performance and reliability of your Si/SiC/GaN devices?Introducing ALPHA® Argomax® technology for increased die attach reliability and cost effective, high volume manufacturing processes.
Environmentally friendly Argomax® technology was specifically designed for low pressure sintering die attachment, based on highly engineered particles, manufactured by Alpha. It provides high thermal and electrical conductivity silver bonds, high reliability and flexible bondline thickness.
For challenging Si/SiC/GaN die attach processes Argomax® offers:• Low process temperatures from 190°C to 300°C• Recommended sintering pressure 510 MPa or higher• High thermal conductivity silver bondline from 200300
W/m°K• Dies from <1mm2 to wafers >70,000mm2
• Bondline from 5μm to 100μm• Lead free and zero voiding• Long shelf life at room temperature • Compatible with attachment to Cu
Power Modules
Lower Capital Cost
Leve
l of
Cap
ital
Inve
stm
ent
012345678
Argomax®Competition
Volume of Production
Throughput
LessLow
High
More
Argomax®
High Throughput
Pro
cess
Sp
eed
Cycles
High Thermal Shock Resistancefor Extended Die Bond Life
ΔT 220°C
2000
>40MPa
Bo
nd S
tren
gth
(die
she
ar)
Global Headquarters300 Atrium Drive Somerset, NJ 08873 USATel: +1-814-946-1611
European HeadquartersUnit 2, Genesis Business Park Albert Drive, Woking, Surrey, GU21 5RWUKTel: +44 (0) 1483 758400
Asia/Pacific8/F, Paul Y. Centre, 51 Hung To RoadKwun Tong, KowloonHong KongTel: 852-3190-3100
AlphaAssembly.com
For increased Si/SiC/GaN die attach reliability and cost effective, high volume manufacturing processes, contact your Alpha sales representative.
©2016 Alpha Issued 10/16 SM0148-3
ALPHA® Argomax® Sinter Technology delivers many cost savings and process benefits to Si/SiC/GaN die attach.
No DelaminationEven after 800 Thermal Shock Cycles
No. CyclesΔT 220°C
0 200 400 800
Argomax®
SAC 305
Thermal Cycles (–40°C / +175°C, 30 min.)
20
40
60
80
100
0
Cu (CTE 17 ppm/°C)Si (CTE 2 ppm/°C)
300200100
∆ CTE: 15 ppm/°C
400 500
Argomax®
SAC305
Argomax® is Superiorin Independent Tests
% D
elam
inat
ion
ALPHA® ARGOMAX® SINTER TECHNOLOGY
ALPHA® Argomax®
Top Side Bonding
ALPHA®Argomax®
Die AttachALPHA® Argomax®
Heat Spreader Attach
Top Side Contact
Die
Substrate
Heat Spreader
PASTE• Print with Argomax®
2010, 2020 and 5020• Dispense with
Argomax® 2040 and 5040 (Advanced Dispense Technology – ADT)
FILM (foils or rolls)• Laminate large areas
with Argomax® 8010 • Die Transfer Film (DTF)
with Argomax® 8020 • Wafer level process
with Argomax® 8030
PREFORMS• 100% customizable in
shape• Ideal for large area
attachments
ALPHA® Argomax® Sinter Technology is available in four different forms to meet your application needs.
Power modules made with Argomax® SinterTechnology meet the increasingly challengingrequirements of today’s and tomorrow’s powergeneration and consumption applications.
• Si, SiC, GaN, etc.• Multi-chip modules, discretes, cavity
packages, stacked dies, lead frames, and more
• Dies from <1mm2 to wafers >70,000mm2 • Bondlines from 5µm to 100µm
ALPHA® Argomax® for all applications.
Argomax® Sinter TechnologyTECHNICAL PROPERTIES
Granulometry 20nmRec. Processing Temp. 190-300°CThermal Conductivity 200-300W/mKElectrical Resistivity 2.5-3.5 µohm/cmCTE 18 PPM/°CRoom Temp. Storage 6 months
Tem
pera
ture
Pressure
Time
GOOD
BOND