— test board for cbm01b2 baby detectors —
Post on 02-Feb-2016
18 Views
Preview:
DESCRIPTION
TRANSCRIPT
— Test board for CBM01B2 baby detectors —
Anton Lymanets & Johann Heuser
CBM collaboration meeting
GSI, 27 February 2008
Microstrip detector testing at GSI
Detector CBM01B2
256 256
orthogonal strips;
50.7 µm pitch;
AC readout;
285 µm thick
Dimensions:
1.56 1.56 cm2
test global detector characteristics
e.g. IV, CV
access both detector sides
contact a few strips for detailed measurements, including n-XYTER readout
do all this as quickly and as simple as possible
Let’s make a test board
Read-out CBM01B2 sensor (“small baby”, 50.7 μm pitch)
Read-out 32 strips in the middle of sensor on both sides
Ultrasonic wedge bonding PCB → sensor
Ordinary line density
Two test zones 1 cm2 each for adjustment of bonding head
Standard ERNI 114805 connector to n-XYTER kit
Test board
PCB: • Standard manufacturing limits • in particular the pitch size of the bonding pads: 200 µm line pitch
Wire bonding: • Max. recommended bond wire
length @ 50 µm pitch: ~ 2.5 mm
• Fan-out bond pattern required.
Max. opening angle: ~ 40 deg
Advice from:
H. Deppe (bonding, PCB)R. Lalik (connection to n-XYTER board)
PCB top side PCB bottom side
100 mm
70 mm
70 m
m
100
mm
pad 10 x 10 mm2
copper with chemical gold
opening for detectorlegs bias pads
SMD 1 M, 4 x total
15.6 mm
"balcony"
15.6
mm
15.0
mm
15.0 mm
1.6 mm
15.6 mm
PCB
bond wire
"balcony"
PCBglue
0.3 mm
detector
0.6
mm
1.0
mm
Opening in PCB for detector mounting
Top view
Side view
4 bias pads
Connector:ERNI model 114805 Dual row, male, type BPins: 68 (unused pins marked red) Height: 8.2 mmSize: ~(6.3×46.3) mm2
Pin pitch: 1.27 mm (both x and y)
Four 1MΩ resistors
http://www.erni.com/smc.htd?gID=4654590
PCB to Si sensor bonding
Pads layout at PCB:Line width: 100 μm 2
(no pads)Pitch: 200 μm
PCB
CBM01B2
Max angle: 51°Max bond length: 3.3 mm
Mechanical mounting of the detector
"balcony"
~ 1.6 mm
~ 1.5 cm
~ 300 µm
"balcony"
PCB PCBglue
bond wire
PCB Layout
Layout made by
P. Skott
Metal support structure to support PCB and sensor during bonding
100
12 50
120
Conclusions & work plan
Design finished, Layout finished
Production @ ILFA, Hannover: ongoing
(incl. gold plating, machining of hole) Weeks 8, 9, 10 2008
Al bonding fixture: to be manufactured
Setup of testing station in C27 (Power supply, etc.)
top related