ansys 17.0 capabilities - brochure
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8/19/2019 ANSYS 17.0 Capabilities - Brochure
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ANSYS 17.0 Capabilities
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STRUCTURES
Strength Analysis
Static l l l l lBuckling - Linear l l l l Buckling - Nonlinear l l l l Substructuring l Geometric Nonlinearity
Large Strain l l l l l Large Deection l l l l l lMaterial Models
Linear Material Models l l l l l l lRate Dependant Plasticity l l l Rate Independent Plasticity l l l l Rate Dependent Hyperelasticity l l l Rate Independent Hyperelasticity l l l l Viscoelasticity l l l
Creep l Reactive Materials l l Contact Modeling
Bonded / No Separation Sliding l l l l l l lPretension (bolts, etc.) l l l l Joints l l l l lSpot Welds l l l l l Nonlinear Contact Modeling
Rough l l l p l l lFrictionless l l l p l l lFriction l l l l l lGaskets l
Cyclic Symmetry Analysis l l l l Rezoning l l Adaptive Remeshing l l l Submodeling l l l l Element Birth and Death l p p Fracture Mechanics l Vibration Modal l l l l lSpectrum l l Harmonic l l Random Vibration l l
Rotordynamicsl l
Super Elements & ComponentMode Synthesis l
Mistuning l
ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA
Enterprise Premium
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA Enterprise Premium
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
Thermal Conduction l l l l l l lConvection l l l l lRadiation l l l lPhase Change l l l l l Steady State l l l l lTransient l l l Motion
Rigid Body Mechanisms l l Rigid/Flexible Transient l Impact
Interactive Prep/Post and Solution l Remapping in Space l Remapping Solution Methods l Mass Scaling l l l De-Zoning l
Part Activation and Deactivation l Part Addition/Removal
During a Simulation l Erosion Based on Multiple Criteria l l l Natural Fragmentation l l Euler Solver l 2D Solver l l l Implicit-Explicit Deformations p l l Implicit-Explicit Material States p l Durability Stress-Life (SN) l l l lStrain-Life (EN) l l l l
Dang VanSafety Factor l l l Composite Materials Material Denitions l l l l Layers Denitions l p l l Solid Extrusion l First-ply Failure l l Last-Ply failure l Delamination l l l Draping l HPC – Structures
Parallel Solving on Local PC Option l l l l l l lParallel Solving over Network Option l l l l l CPU Support l l l l l lGPU Support l l l
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ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA
Enterprise Premium
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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MULTIPHYSICS
Platform Technologies
Advanced, Automated Data Exchange l l l lAccurate Data Interpolation Between l l l l Dissimilar Meshes l p p
Drag-n-Drop Multiphysics l lDirect Coupling Between Physics l lCollaborative Workows lFully Managed Co-Simulation lFlexible Solver Coupling Options l
Fluid-Structure Interaction
Force Induced Motion p p p p p lFluid Thermal Deformation p p p p p l
Electro-Thermal Interaction
Conduction Cooled Electronicsp p p p p
High Frequency Thermal Management p p p p pElectromechanical Thermal p p p p p Management
Other Coupled Interactions
Vibro-Acoustics lAcoustics-Structural pElectric-Magnetic lElectrostatic-Structural lMagnetic-Structural lElectromagnetic-Thermal l
Piezoelectric lPiezoresistive lThermal-Electric l lThermal-Structural l l l l lThermal-Electric-Structural l l
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ANSYS CFD
ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
FLUIDS
General Solver CapabilitiesComprehensive Inlet and Outlet l l l l l l lConditionsSteady-State Flow l l l l l l l l l
Transient Flow l l l l l l l2-D and 3-D Flow l p l p p p l Time Dependent Boundary Conditions l l l l l l lCustomizable Materials Library l l l l l l l lFan Model l l l lPeriodic domains l l l l l l lDynamic/moving-deforming mesh l l l l l lOverset Mesh lImmersed-solid/MST method for l l lmoving partsFlow-driven solid motion (6DOF) l l lPressure-based coupled solver l l l l l l l l lDensity-based coupled solver l lAutomatic on-the-y mesh generation l l lwith dynamic renementDynamic Solution-Adaptive l l l l l p l Mesh renement
Single Phase, non reacting flowsIncompressible Flow l l l l l l lCompressible Flow l l l l l l lPorous Media l l l lNon-Newtonian Viscosity l l l lTurbulence - Isotropic l l l l l l lTurbulence - Anisotropic (RSM) l l l
Turbulence - Unsteady (LES/SAS/DES) l lTurbulence - Laminar/Turbulent l l l lTransitionFlow Pathlines (Massless) l l l l l lFan Model l l l lAcoustics (Source Export) l l lAcoustics (Noise Prediction) l
Heat TransferNatural Convection l l l l lConduction & Conjugate Heat Transfer l l l l l l lInternal Radiation - Participating Media l l l l lInternal Radiation - Transparent Media l l l
External Radiation l l l lSolar Radiation & Load l l
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ANSYS CFD
ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM
Particles Flows (Multiphase)Coupled Discrete Phase Modeling l l l l l lInert Particle Tracking (With Mass) l l lLiquid Droplet (Incl. Evaporation) l l l lCombusting Particles l l l l
Multicomponent Droplets l l l lDiscrete Element Model (DEM) lBreak-Up And Coalescence l l l l
Free Surface Flows (Multiphase)Implicit And Explicit VOF l l l lCoupled Level Set/VOF l l lOpen Channel Flow And Wave l lSurface Tension l l l lPhase Change l l l lCavitation l l l l
Dispersed Multiphase Flows(Multiphase)Mixture Fraction l lEulerian Model l l l lBoiling Model l l lSurface Tension l l lPhase Change l l l l lDrag And Lift l l l lWall Lubrication l l lHeat And Mass Transfer l l l l lPopulation Balance l l l lReactions Between Phases l l l l
Reacting FlowsSpecies Transport l l l l lNon-Premixed Combustion l l l lPremixed Combustion l l l lPartially Premixed Combustion l l l lComposition PDF Transport l lFinite Rate Chemistry l l l lPollutants And Soot Modeling l l l lSparse chemistry solver with dynamiccell clustering and dynamic adaptive l l lchemistryAbility to use Model Fuel Library l l lmechanisms
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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ANSYS CFD
ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM
Flame-speed from Fuel-component lLibraryDPIK Spark-ignition Model lFlame-propagation using level-set l method (G-equation)Internal Combustion Engine l l l lSpecic Solution0-D/1-D/2-D reactor models and l reactor networksPlasma reactions lComprehensive surface-kinetics l lChemical and phase equilibrium l lFlamelet table generation l lFlamespeed and ignition table lgenerationReaction sensitivity, uncertainty l
and path analysisSurrogate blend optimizer lMechanism Reduction l
Turbomachinery
MRF/Frozen-Rotor l lSliding-Mesh/Stage l lTransient Blade Row lBlade Flutter Analysis lForced Response Analysis l
In-Flight Icing
Simulates Droplet Sizes lSimulates Ice Growth and Performs lVisibility StudiesModels Heat Transfer Anti- and lDe-icing Heat LoadsRotating frame of reference for theanalysis of turbomachines, rotors land propellersModel ice accretion at engine face(Fan and IGV) and within any number p of successive compressor stagesAerodynamic degradation (CFD) meets
the requirements of Appendix C,l
Appendix D (Ice Crystals) andAppendix O (SLD)
l = Fully Supportedp = Limited Capability p= Requires more than 1 product
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ANSYS CFD
ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM
Shape Optimization
Adjoint Solver for Sensitivity Analysis lMesh Morphing p
High Rheology Material
Viscoelasticity lSpecialty Extrusion Models lSpecialty Blow Molding Models lSpecialty Fiber Spinning Models l
HPC – Fluids
Parallel Solving On Local PC Option l l l l l l l lParallel Solving Over Network Option l l l l l l lCPU Support l l l l l l l lGPU Support l l
MULTIPHYSICS
Platform Technologies
Advanced, Automated Data Exchange l l l l l l lAccurate Data Interpolation Between l l l l l l Dissimilar MeshesDrag-n-Drop Multiphysics l l l l lDirect Coupling Between Physics l l l l lCollaborative Workows l l l l lFully Managed Co-Simulation lFlexible Solver Coupling Options l l l l l
Fluid-Structure Interaction
Force Induced Motion l l l l lFluid Thermal Deformation l l l l l
Electro-Thermal Interaction
Convection Cooled Electronics lConduction Cooled Electronics lHigh Frequency Thermal Management lElectromechanical Thermal l Management
Other Coupled Interactions
Aero-Acoustics l
Acoustics-Structural l lFluid Magnetohydrodynamics p
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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ELECTRONICSLow Frequency ElectromagneticsElectrostatics l AC Conduction lDC Conduction l
Magnetostatics lAdaptive Field Mesh lAC Harmonic Magnetic lElectric Transient lHPC Frequency Sweeps lHPC Enabled Matrix Multiprocessing lHPC Time Distribution Solver lMagnetic Transient
Translational Motion lFully Automatic Symmetrical
lMesh GenerationLayered Mesh Generation lRotational Motion lNon-Cylindrical Motion lAdvanced Embedded Circuit Coupling lCircuit Coupling with Adaptive
lTime SteppingDirect and Iterative Matrix Solvers lAdvanced Magnetic Modeling
Vector Hysteresis Modeling lNonlinear Reduced Order Models lFrequency Dependent Reduced
lOrder ModelsEquivalent Model Extraction
l(Linear-Motion, Rotational-Motion, No-Motion)
Nonlinear Anisotropic Materials lFunctional Magnetization Direction lMagnetization/De-magnetization
lModelingTemperature De-magnetization
lModelingCore Loss computation lLamination Modeling lHigh Frequency ElectromagneticsFrequency and Time Domain Analysis l
Eigenmode Analysisl
Hybrid Finite Element/Integrall
Equation Analysis
Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS HFSS SIwave Icepak
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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Modal Wave Port Excitation lLumped, Voltage and Current
l
ExcitationsFloquet Excitations lIncident Wave Excitation l
Magnetic Ferrite Bias Excitation lTerminal Solutions lPerfect Electric and Magnetic Boundary lFinite Conductivity Boundaries lLumped RLC Boundary lSymmetry Boundary lPeriodic Boundary lFrequency dependant materials lHigher and Mixed order Elements lCurvilinear Elements lFully automated adaptive
l
mesh renementS,Y,Z Matrix Results lE, H, J, P Field Results lDirect and Iterative Matrix Solvers lHPC Frequency Sweeps lHPC Enabled Matrix Multiprocessing lHPC Distributed Hybrid Solving lAntenna Parameter Calculation lInnite and Finite Antenna Array
l
CalculationsRadar Cross Section calculation lFSS, EBG and Metamaterial Calculation l
Specic Absorption Rate Calculationl
EMI/EMC Calculation lSystem Level EMI and RFI analysis l
Power and Signal IntegrityBoard Simulation Capabilities
Electronics Desktop 3D Layout GUI l l l lECAD Translation (Altium, Cadence, l l l l Mentor, Pulsonix, & Zuken)MCAD (.sat) Generation from ECAD l l l lLead Frame Editor l l l l DC Voltage, Current and Power l l l
Analysis for PKG/PCBDC Joule Heating with ANSYS Icepak l l l l l
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Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS HFSS SIwave Icepak
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
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l = Fully Supportedp = Limited Capability p= Requires more than 1 product
Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS HFSS SIwave Icepak
Passive Excitation Plane Resonance l l AnalysisDriven Excitation Plane Resonance l l AnalysisAutomated Decoupling Analysis l l
Capacitor Loop Inductance Analysis l lAC SYZ Analysis - PI, SI, & EMI l l lDynamically Linked Electromagnetic
l l l Field SolversChip, Package, PCB Analysis (CPM) l l lHPC SYZ Speed Up l l lNear-Field EMI Analysis lFar-Field EMI Analysis lCharacteristic Impedance (Zo) l PKG/PCB ScanFull PCB/PKG Cross-talk Scanning lTDR Analysis l l Transient IBIS Circuit Analysis lSerDes IBIS-AMI Circuit Analysis lMacro-Modeling (Network Data Explorer) l l l lSteady State AC (LNA) Analysis l lVirtual Compliance - DDRx, GDDRx,
l & LPDDRxSynopsys HSPICE Integration lCadence PSPICE Support lElectromagnetically Circuit Driven l Field Solvers
RLCG Parasitic Extraction
DCRL, ACRL & CG Solver l l l lIC Packaging RLCG IBIS Extraction
l l l l for Signals & PowerTouchpanel RLCG Unit Cell Extraction l l l lAdaptive Meshing for Accurate l ExtractionBus Bar RLCG Extraction lPower Inverter & Converter
l
Component ExtractionSpecialized Thin Plane Solver for
l
Touchpanel ExtractionHPC Acceleration for DCRL, ACRL,
l and CG3D Component Library l
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Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS HFSS SIwave Icepak
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
Reduced RLCG Matrix Operations lSPICE equivalent Modeling Export lDCRL & ACRL Joule Heating Analysis
l with IcepakMacro-modeling (Network Data Explorer) l
2D Transmission Line Modeling Toolkit l2D Cable Modeling Toolkit l
Electronics Cooling
Multi-mode Heat Transfer lSteady-state and Transient l CFD Analysis lTurbulent Heat Transfer lMultiple-uid Analysis lSpecies Transport lSolar Loading l
Reduced Order Flow and Thermall
Network Modeling lJoule Heating Analysis l l l l l l lThermo-electric Cooler Modeling lThermostat Modeling lPackage Characterization lData Center Modeling l
MultiphysicsPlatform Technologies
Advanced, Automated Data Exchange l lAccurate Data Interpolation Between l l
Dissimilar Meshes l lDrag-n-Drop Multiphysics l lDirect Coupling Between Physics l lCollaborative Workows l lFully Managed Co-Simulation l lFlexible Solver Coupling Options l l
Electro-Thermal Interaction
Convection Cooled Electronics l lConduction Cooled Electronics l lHigh Frequency Thermal Management l
Electromechanical Thermal Management l
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PowerArtist Pathnder ANSYS ReadhawkTotem
SEMICONDUCTOR
Integrated Circuit ReliabilityStatic and Dynamic Power EM
l
l(Electromigration) AnalysisSignal EM Analysis for Average,
l
l
RMS and PeakFoundry Certied EM Rules Support
l
lfor Advanced NodesTemperature-Dependent EM Analysis l lCTM and Package Aware Thermal
l
lAnalysisSelf-Heat Calculation for FinFET Nodes l lTransistor-level Dynamic Signal
l
EM AnalysisTransistor-level Vectorless Signal
l
EM AnalysisTransistor-level Dynamic Power
l
EM AnalysisLayout Based ESD Analysis lBump to Bump, Bump to Clamp,
lClamp to Clamp Connectivity CheckBump to Bump, Bump to Clamp,
lClamp to Clamp Resistance CheckHBM/MM/CDM ESD Analysis lResistance and Current Density
lBased ESD AnalysisGuard Ring Weakness Checking l
IC Power Effi ciency
RTL Inference Based Power Analysisl
Simulation Based (FSDB, VCD, SAIF)l
and Vectorless Power AnalysisPhysically Aware RTL Clock Tree and
lWire Capacitance ModelingPower Hotspot Identication by Logical
l
Hierarchy, Design and Power CategoryAverage and Time Based Power
lAnalysisUPF / CPF Based What-If RTL Power
lExploration of Power DomainsPACE Model Generation lCross Probing Between Power Annotated
l
Schematics, Waveforms and HDLSequential and Combinatorial Power
l
Reduction Algorithms
l = Fully Supportedp = Limited Capability p= Requires more than 1 product
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PowerArtist Pathnder ANSYS ReadhawkTotem
l = Fully Supportedp= Limited Capability p= Requires more than 1 product
Block-level Data and Clock Gatingl
Opportunity Identication15 Clock, Memory and Logic Power
l
Reduction TechniquesPower Reduction Opportunity
Identication for Clock, Memory l and LogicPeak and di/dt Cycle Selection
l
from FSDBRTL Power Driven Early Chip and
l
Package Power Grid PlanningStandard Power Metrics Reporting l Tcl Based UI to OADB Power
l
Database for Custom ReportsOn/O State Power Leakage Analysis l lVoltage Island Ramp-up /
l
Ramp-down Analysis
In-Rush Current Analysisl
Driver / Receiver Hot-Pair Analysis lMixed-Mode Ramp-up and
l
On-State AnalysisPower Gate/Switch Id-Sat Check lDriver/Receiver Dierential
l
Voltage CheckPower Gate Optimization lPower Gate Delay Optimization lMixed-Mode VCD and Vectorless
l
l
Power AnalysisLow Power IP/Block Analysis l
Power Gated IP Analysis lAutomatic Switch Identicationl
and CharacterizationSwitched RAM Analysis l lLDO / Voltage Regulator Based
l
l
Low Power Analysis
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ANSYS Simplorer ANSYS SCADE ANSYS SCADE ANSYS SCADE System Suite Display
SYSTEMS & EMBEDDED SOFTWARE
Virtual Systems Prototyping Integrated Graphical Modeling
l
EnvironmentStandard Modeling Languages and
l
Exchange FormatsExtensive Model Libraries l Reduced Order Modeling (ROM) l Power Electronic Device AndModule Characterization l Model Import Interfaces l Rapid Prototyping l Modelica Library Integration l
Model-based Systems Engineering Model-Based System Design lFunctional Decomposition lArchitecture Decomposition l
Allocation Of Functions ToComponents lModel Checks lSystem Model Di/Merge lSystem / Software Bi-Directional Sync l Model Sharing And IP Protection l Model-Based Interface Control
lDocument ProductionCongurable For Industry Standards
l
(IMA, AUTOSAR, Etc.)Product conguration for avionics
ldevelopers
Embedded Control SoftwareDevelopment Data Flow And State Machine Design
lAnd Simulation CapabilitiesExtensive Set Of Libraries Delivered
lAs Design ExamplesSimulation Capabilities l Record And Playback Scenarios l Integration In To Conguration
lManagement EnvironmentPlant Model Co-Simulation Including
l
FMI
Coverage Analysis For Requirements- lBased Tests
l = Fully Supportedp = Limited Capability p= Requires more than 1 product
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l = Fully Supportedp= Limited Capability p= Requires more than 1 product
ANSYS Simplorer ANSYS SCADE ANSYS SCADE ANSYS SCADESystem Suite Display
Formal Verication lTiming And Stack Optimization lWorst Case Execution Time Estimates
l
On TargetVerication Of Stack Space Requirements l
Certied Code Generation For DO-178C, l EN 50128, ISO 26262, IEC 61508Certication Kits For DO-178C,
l
EN50128, ISO 26262, IEC 61508
Man-Machine Interface Software Model-Based Prototyping And
l
Specication Of MMIsSupport Of OpenGl, OpenGl SC and
l
OpenGL ESIntegration In To Conguration
l
Management EnvironmentFont Management lOptimization Of Graphical Specications lPlant Model Co-Simulation Including
l
FMIAutomatic Generation Of iOS and
l
Android ProjectsCertied Code Generation For DO-178C,
l
EN 50128, ISO 26262, IEC 61508Certication Kits For DO-178C,
l
EN50128, ISO 26262, IEC 61508Testing capabilities l
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