div class=ts-pagebuttonPage 1button div class=ts-image amp-img class=ts-thumb alt=Page 1: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails1jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 2button div class=ts-image amp-img class=ts-thumb alt=Page 2: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails2jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 3button div class=ts-image amp-img class=ts-thumb alt=Page 3: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails3jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 4button div class=ts-image amp-img class=ts-thumb alt=Page 4: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails4jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 5button div class=ts-image amp-img class=ts-thumb alt=Page 5: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails5jpg width=142 height=106 layout=responsive amp-img divdivdiv class=ts-pagebuttonPage 6button div class=ts-image amp-img class=ts-thumb alt=Page 6: · Component Assembly issues microvia pad that at the fine-pitch BGA devices the ground copper goes substantially all the way into the center ground pins src=https:reader034vdocumentinreader034viewer20220518025aea08997f8b9a3b2e8c1016html5thumbnails6jpg width=142 height=106 layout=responsive amp-img divdiv