az9260 photoresist
Post on 18-Nov-2021
24 Views
Preview:
TRANSCRIPT
The information contained herein is, as far as we are aware, true and accurate. However, no representations or warranties, either express or implied, whether of merchantable quality, fitness for any particular purpose or of any other nature are hereby made in respect of the information contained in this presentation or the product or products which are the subject of it. In providing this material, no license or other rights, whether express or implied, are given with respect to any existing or pending patent, patent application, trademarks, or other intellectual property right.
AZ 9260 Photoresist
Data Package at 12um FT & 24um FT
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 2
MEMS /
Ink JetFT: >30 µm
Lift-off Deep Implant /Metal Etch
Copper Plating Gold Plating Solder /
Metal PlatingFT: 2-7 µm FT: 3-10 µm FT: 5-30 µm FT: 10-30 µm FT: >30 µm
DUVTFRH/ImplantFT: 3 -
8 µm
AZ’s Thick Film Photoresist Roadmap [as of 11/2007]
<<------------------
AZAZ
EXP 100 EXP 100 ---------------->>
Materials under development
AZ LExp 500
AZ
12XT-20P
<------------------------
AZ
125nXT Series ------------------------->
Materials in sampling(all EXP products) AZ
40XT-11AZ
40XT-A1
Commercialized materials
AZ
nLOFSeries
AZ
MIR 900
<---------------P4000 (P4620)-----(Multicoat)---> AZ
33XTAZ
N4000AZ
N6000
AZ
TX 1311VS-01HJ
<------------AZ 9200------------->
AZ
PLP30/40 <------------AZ 50XT----------->AZ
10XT
AZ
5XTAZ
5nXTAZ
3nXT-HR
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 3
AZ Electronic Materials Thick Photoresist Product Summary
Platform: DNQ = Novolak, CA = Chemically Amplified, PP = Photopolymer
Wavelength: Red font indicates better performance.
Developer Compatibility: Bold font indicates most compatible developer, resulting in shorter develop times and lower exposure energies.
Thick Film Product Platform λ
FT Range (um)
Maximum Single coat
Aspect Ratio Application Developer
Compatibility
P4000 DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH4500 DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH9200 DNQ g-h -i 3 - 50 25 3:1 Solder, Cu 400K / TMAH10XT DNQ g-h -i 4 - 50 25 3:1 Solder, Cu, Au 400K / TMAH33XT DNQ g-h-i 5 - 25 25 5:1 Solder, Cu TMAH / 400K50XT DNQ g-h 15 - 65 65 3:1 Solder, Cu 400K
PLP-30 DNQ g-h 6 - 25 25 2:1 Au, Cu 303NPLP-40 DNQ g-h 20 - 30 30 2:1 Au, Cu 303N
EXP 12XT-20P CA g-h-i 5 - 20 20 3:1 Cu TMAHEXP 5XT CA g-h-i 3 - 5 5 2:1 Si, Implant, Etch TMAHEXP 40XT CA g-h-i 20 - 100 60 4:1 Etch, Solder, Cu TMAH / 400K
EXP 125nXT PP g-h-i 20 - 120 120 5:1 Cu, Au, Solder TMAH / 303NEXP 3nXT-HR CA g-h-i 3 - 5 5 5:1 Cu, NiFe, Si TMAH
EXP 5nXT CA g-h-i 5 - 15 15 3:1 Cu, NiFe, Si TMAHTX 1311 CA DUV 3 - 5 5 15:1 Cu, NiFe, Si TMAH
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 4
MTI Flexifab coat and bakeStatic dispense on 6” silicon 30 sec spin @ indicated rpmSB: 110°C in proximity10 sec @ 0.050”, 180 sec @ 0.002”
Spin Speed (rpm)
Film
Th i
ckne
ss ( µ
m)
AZ 9260 Photoresist on SiliconFilm Thickness vs. Spin Speed
5
6
7
8
9
10
11
12
13
14
15
1000 1500 2000 2500 3000 3500 4000 4500
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 5
AZ
9260 Table of Contents
▶
12µm FT Process & Performance Results Pages 6 – 22 Ultratech 1500 with AZ 300 MIF developer
▶
12µm FT Process & Performance Results Pages 23 – 35 Suss MA200 with AZ 400K 1:4 Developer
▶
24µm FT Process & Performance Results Pages 36 – 52 Ultratech 1500 with AZ 400K 1:4 Developer
▶
24µm FT Process & Performance Results Pages 53 – 65 Suss MA200 with AZ 300 MIF developer
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 6
AZ 9260 Photoresist
Lithographic Evaluationby Ultratech 1500 Stepper
with AZ 300 MIF Developer12µm FT Process
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 7
AZ 9260 Photoresist
Process Conditions:
Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 12 µmSoftbake: 110°C hotplate/ 180 sec. full contactExposure: Ultratech 1500 gh line Stepper FEM: 1200 mJ/cm2 with increments of 75 mJ/cm2
Nominal Focus of -2µm in increments of 2µm in both directionsDevelop: AZ 300MIF (2.38% TMAH) continuous spray for 400 sec. @ 23°C
Analysis: Amray SEM
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 8
AZ 9260 Photoresist
Features (1:1)
Film
Thickness(μm)
DTP
10 μm (mJ/cm²)
Exposure Latitude 10 μm
(%)
DOF
10 μm (μm)
Linearity (μm)
Dense Lines
12
1798
106
16.0
4.0
Contact Holes
12
1539
90
>8
<10
Summary of Results:
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 9
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
Exposure Dose (mJ/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 μm L/S
8
8.5
9
9.5
10
10.5
11
11.5
12
1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200
1798 mJ/cm²106% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 10
1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²
1725 mJ/cm²
2600 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 μm L/S
1900 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 11
8.75
9.25
9.75
10.25
10.75
11.25
-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)AZ
9260 Photoresist, FT=12 μm
Depth of Focus @ 1725 mJ/cm², 10.0 µm L/S
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 12
AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1725 mJ/cm², 10.0 µm L/S
-8.0 µm -6.0 µm -4.0 µm
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
4.0 µm 2.0 µm 0.0 µm
-2.0 µm
-10.0 µm
6.0 µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 13
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=12 μm
Linearity on Silicon @ 1725 mJ/cm²
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 14
12 µm 10 µm 9.0 µm 8.0 µm
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
4.0 µm 5.0 µm 6.0 µm
7.0 µm
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 1725 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 15
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
Exposure Dose (mJ/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:1 Pitch
8
8.5
9
9.5
10
10.5
11
11.5
12
800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800
1539 mJ/cm²90% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 16
1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²
1725 mJ/cm²
2600 mJ/cm² 1900 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 17
1200 mJ/cm² 1375mJ/cm² 1550 mJ/cm²
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²
1725 mJ/cm²
2600 mJ/cm² 1900 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:0.7 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 18
1375mJ/cm² 1550 mJ/cm²
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
2425 mJ/cm² 2250 mJ/cm² 2075 mJ/cm²
1725 mJ/cm²
2600 mJ/cm² 1900 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 10.0 µm CH, 1:0.3 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 19
8.75
9.25
9.75
10.25
10.75
11.25
-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line Stepper AZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1550mJ/cm2, 10.0 µm CH, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 20
-4.0 µm 2.0 µm0.0 µm-2.0 µm-6.0 µm
1:1
1:0.7
1:0.3
AZ 9260 Photoresist, FT=12 μm Depth of Focus @ 1550mJ/cm2, 10.0 µm CH, Various Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 21
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=12 μm
Linearity on Silicon @ 1550 mJ/cm²40.0 µm to 10.0 µm CH, 1:1 Pitch
Film Thickness: 12 µmOptitrac coat and DevelopSB: 110°C/ 180 secUltratech 1500 gh line StepperAZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 22
30 µm 10 µm20 µm40 µm
1:1
1:0.7
1:0.3
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 1550 mJ/cm²
40.0 µm to 10.0 µm CH, Various Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 23
AZ 9260 Photoresist
Lithographic Evaluation by Suss
MA200 Mask Aligner
with AZ 300 MIF Developer12µm FT Process
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 24
AZ 9260 Photoresist
Process Conditions:
Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 12 µmSoftbake: 110°C hotplate/ 180 sec. full contact
Exposure: Suss MA200 CC Mask Aligner with 20 µm proximity gapFEM: 960 mJ/cm2 with increments of 80 mJ/cm2
Develop: AZ 300MIF (2.38% TMAH) continuous spray for 400 sec. @ 23°C
Analysis: Amray SEM
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 25
AZ
9260 Photoresist
Features (1:1)
Film
Thickness(μm)
DTP
20 μm (mJ/cm²)
Exposure Latitude 20 μm
(%)
Linearity (μm)
Dense Lines
12
984
144
10
Contact Holes
12
792
137
10
Summary of Results:
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 26
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 μm L/S
16
17
18
19
20
21
22
23
24
450 600 750 900 1050 1200 1350 1500 1650 1800 1950 2100
984 mj/cm²144% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 27
720 mJ/cm² 800mJ/cm² 880 mJ/cm²
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
1440 mJ/cm² 1360 mJ/cm² 1200 mJ/cm²
960 mJ/cm²
1600 mJ/cm²
AZ
9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 μm L/S
1040 mJ/cm²
640 mJ/cm²560 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 28
5.0
15.0
25.0
35.0
45.0
55.0
65.0
75.0
85.0
5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=12 μm
Linearity on Silicon @ 960 mJ/cm²
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 29
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon
@ 960 mJ/cm²
80 µm 60 µm 50 µm
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 30
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:1 Pitch
16
17
18
19
20
21
22
23
24
250 400 550 700 850 1000 1150 1300 1450 1600 1750
792 mj/cm²137% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 31
600 mJ/cm² 720mJ/cm² 760 mJ/cm²
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
1360 mJ/cm² 1200 mJ/cm² 1040 mJ/cm²
800 mJ/cm²
1600 mJ/cm² 880 mJ/cm²
520 mJ/cm²440 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 32
600 mJ/cm² 720mJ/cm² 760 mJ/cm²
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
1360 mJ/cm² 1200 mJ/cm² 1040 mJ/cm²
800 mJ/cm²
1600 mJ/cm² 880 mJ/cm²
520 mJ/cm²440 mJ/cm²
AZ 9260 Photoresist, FT=12 μm Exposure Latitude on Silicon, 20.0 µm CH, 1:0.7 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 33
5.0
15.0
25.0
35.0
45.0
55.0
65.0
75.0
85.0
5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 34
80 µm 60 µm 50 µm
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 35
80 µm 60 µm 50 µm
Film Thickness: 12 µmOptitrac coat and BakeSB: 110°C/ 180 secSuss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 400 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ 9260 Photoresist, FT=12 μm Linearity on Silicon @ 800 mJ/cm², Contact Holes, 1:0.7 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 36
AZ 9260 Photoresist Lithographic Evaluation
by Ultratech 1500 Stepper
with AZ 400K 1:4 Developer 24µm FT Process
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 37
AZ
9260 Photoresist
Process Conditions:
Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 24 µmSoftbake: 1st layer 110°C hotplate/ 80 sec. full contact
2nd layer 115°C hotplate/ 180 sec. full contact Exposure: Ultratech 1500 gh line Stepper FEM: 1900 mJ/cm2 with increments of 75 mJ/cm2
Nominal Focus of -6µm in increments of 2µm in both directionsDevelop: AZ 400K 1:4, continuous spray for 600 sec. @ 27°C
Analysis: Amray SEM
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 38
AZ
9260 Photoresist
Features (1:1)
Film
Thickness(μm)
DTP
10 μm (mJ/cm²)
Exposure Latitude 10 μm
(%)
DOF
10 μm (μm)
Linearity (μm)
Dense Lines
24
1900
22
16
4
Contact Holes
24
1805
30
>8
<10
Summary of Results:
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 39
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)AZ
9260 Photoresist, FT=24 μm
Exposure Latitude on Silicon, 10.0 μm L/S
8
8.5
9
9.5
10
10.5
11
11.5
12
1575 1650 1725 1800 1875 1950 2025 2100 2175 2250 2325
1900 mj/cm²22% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 40
1725 mJ/cm² 1800 mJ/cm²
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
2100 mJ/cm² 2025 mJ/cm²
1875 mJ/cm²
1950 mJ/cm²2175 mJ/cm²
1650 mJ/cm²
AZ
9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 10.0 μm L/S
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 41
8.75
9.25
9.75
10.25
10.75
11.25
-16.0 -14.0 -12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1875 mJ/cm², 10.0 µm L/S
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 42
-12.0 µm -10.0 µm -8.0 µm
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
0.0 µm -2.0 µm -4.0 µm
-6.0 µm
-14.0 µm
2.0 µm
AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1875 mJ/cm², 10.0 µm L/S
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 43
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm
Linearity on Silicon @ 1875 mJ/cm²
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 44
15 µm 12 µm 10.0 µm 9.0 µm
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
5.0 µm 6.0 µm 7.0 µm
8.0 µm
20 µm
4.0 µm
AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1875 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 45
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm
Exposure Latitude on Silicon,
10.0 µm CH, 1:1 Pitch
8
8.5
9
9.5
10
10.5
11
11.5
12
1500 1575 1650 1725 1800 1875 1950 2025 2100 2175 2250
1805 mj/cm²30% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 46
1650 mJ/cm² 1725 mJ/cm²
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
2025 mJ/cm² 1950 mJ/cm²
1800 mJ/cm²
1875 mJ/cm²2100 mJ/cm²
1575 mJ/cm²
2175 mJ/cm²
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,
10.0 µm CH, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 47
1650 mJ/cm² 1725 mJ/cm²
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
2025 mJ/cm² 1950 mJ/cm²
1800 mJ/cm²
1875 mJ/cm²2100 mJ/cm²
1575 mJ/cm²
2175 mJ/cm²
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,
10.0 µm CH, 1:0.7 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 48
1650 mJ/cm² 1725 mJ/cm²
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
2025 mJ/cm² 1950 mJ/cm²
1800 mJ/cm²
1875 mJ/cm²2100 mJ/cm²
1575 mJ/cm²
2175 mJ/cm²
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon,
10.0 µm CH, 1:0.3 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 49
8.75
9.25
9.75
10.25
10.75
11.25
-12.0 -10.0 -8.0 -6.0 -4.0 -2.0 0.0
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm
Depth of Focus @ 1800 mJ/cm², 10.0 µm CH, 1:1 Pitch
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 50
-8.0 µm -2.0 µm-4.0 µm-6.0 µm-10.0 µm
1:1
1:0.7
1:0.3
AZ 9260 Photoresist, FT=24 μm Depth of Focus @ 1800 mJ/cm², 10.0 µm CH, Various Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 51
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
45.0
50.0
5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm
Linearity on Silicon @ 1800 mJ/cm²40.0 µm to 10.0 µm Contact Holes, 1:1 Pitch
Optitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Ultratech 1500 gh line Stepper AZ 400K 1:4, 600 sec continuous spray @ 27 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 52
30 µm 10 µm20 µm40 µm
1:1
1:0.7
1:0.3
AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1800 mJ/cm²
40.0 µm to 10.0 µm Contact Holes, Various Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 53
AZ 9260 PhotoresistLithographic Evaluation
by Suss
MA200 Mask Aligner
with AZ 300 MIF Developer24µm FT Process
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 54
AZ 9260 Photoresist
Process Conditions:
Substrate: Bare SiliconCoat: Optitrac Static dispenseTarget FT: 24 µmSoftbake: 1st layer 110°C hotplate/ 80 sec. full contact
2nd layer 115°C hotplate/ 180 sec. full contact Exposure: Suss MA200 CC Mask Aligner with 20 µm proximity gap FEM: 2200 mJ/cm2 with increments of 200 mJ/cm2
Develop: AZ 300 MIF (2.38% TMAH) continuous spray for 720 sec. @ 23°C
Analysis: Amray SEM
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 55
AZ
9260 Photoresist
Features (1:1)
Film
Thickness(μm)
DTP
40 μm (mJ/cm²)
Exposure Latitude 40 μm
(%)
Linearity (μm)
Dense Lines
24
2228
166
10
Contact Holes
24
1674
217
10
Summary of Results:
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 56
32
34
36
38
40
42
44
46
48
900 1200 1500 1800 2100 2400 2700 3000 3300 3600 3900 4200 4500 4800
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon
, 40μm L/S
2228 mj/cm²166% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 57
1575 mJ/cm² 1785mJ/cm² 1995 mJ/cm²
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
3400 mJ/cm² 3000 mJ/cm² 2600 mJ/cm²
2200 mJ/cm²
4000 mJ/cm²
AZ
9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40μm L/S
2400 mJ/cm²
1365 mJ/cm²1155 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 58
5.0
15.0
25.0
35.0
45.0
55.0
65.0
75.0
85.0
5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)AZ 9260 Photoresist, FT=24 μm
Linearity on Silicon @ 2200 mJ/cm²
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 59
AZ 9260 Photoresist, FT=24 μm Linearity on Silicon
@ 2200 mJ/cm²
80 µm 60 µm 50 µm
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 60
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:1 Pitch
32
34
36
38
40
42
44
46
48
500 800 1100 1400 1700 2000 2300 2600 2900 3200 3500 3800 4100 4400 4700
1674 mj/cm²217% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 61
1365 mJ/cm² 1470 mJ/cm² 1575 mJ/cm²
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
3200 mJ/cm² 2600 mJ/cm² 2100 mJ/cm²
1680 mJ/cm²
3800 mJ/cm² 1785 mJ/cm²
1260 mJ/cm²1155 mJ/cm²
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 62
1365 mJ/cm² 1470 mJ/cm² 1575 mJ/cm²
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
3200 mJ/cm² 2600 mJ/cm² 2100 mJ/cm²
1680 mJ/cm²
3800 mJ/cm² 1785 mJ/cm²
1260 mJ/cm²1155 mJ/cm²
AZ 9260 Photoresist, FT=24 μm Exposure Latitude on Silicon, 40µm Contact Holes,1:0.7 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 63
5.0
15.0
25.0
35.0
45.0
55.0
65.0
75.0
85.0
5.0 15.0 25.0 35.0 45.0 55.0 65.0 75.0 85.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1680 mJ/cm²,
Contact Holes, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 64
80 µm 60 µm 50 µm
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ 9260 Photoresist, FT=24 μm Linearity on Silicon @ 1680 mJ/cm²,
Contact Holes, 1:1 Pitch
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.page 65
80 µm 60 µm 50 µm
Film Thickness: 24 µmOptitrac coat and BakeSB: 1st layer 110°C/ 80 sec
2nd layer 115°C/180 sec Suss MA200 CC Mask Aligner20 µm proximity gapAZ 300 MIF, 720 sec continuous spray @ 23 °C
10 µm 20 µm 30 µm
40 µm
AZ 9260 Photoresist, FT=24 μmLinearity on Silicon @ 1680 mJ/cm²,
Contact Holes, 1:0.7 Pitch
top related