bga rework removal

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This is one slide set in a multi part series on the BGA rework process. In this section the BGA removal process is explained. Get more information on www.solder.net or to see or multitude of soldering process videos.

TRANSCRIPT

Rework and Repair of PCBs Solder/Assembly Training

Rework/Repair Soldering Tools

BEST Inc.Solder.net

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BGA Rework

I.I. Why ReworkWhy Rework

II.II. Scope of Material CoveredScope of Material Covered

III.III. BGA Rework ProcessBGA Rework ProcessA.A. RemovalRemoval

B.B. Site DressingSite Dressing

C.C. PlacementPlacement

D.D. ReflowReflow

E.E. CleaningCleaning

F.F. InspectionInspection

IV.IV. MaterialsMaterials

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BGA Rework-Why Rework?

Misplaced part Part Upgrade Failed Part Do not know why

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BGA Rework-A PrimerSCOPE

Plastic packages attachment of new parts using hot air as the reflow source

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BGA Rework-A PrimerSCOPE

Reference DocumentsIPC-A-610IPC-7095

IPC 7711/21IPC J-STD-020IPC J-STD-033

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BGA Rework-the process

Removal-controlled heat sourceObjective is to get the device off as quickly as possible without damaging the device (may need to reball and use again) or neighboring devices or the laminate

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BGA Rework-the processRemoval-locating the right location

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BGA Rework-the processRemoval-controlled heat source-bottom side preheat

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BGA Rework-the processRemoval-bakeout if need to reball or salvage the component

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BGA Rework-the processRemoval-popcorning and wire bonding damage

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Removal-controlled heat source-bottom side preheat

BGA Rework-the process

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Removal-proper board holders

BGA Rework-the process

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Removal-controlled heat sourceShield the surrounding area

BGA Rework-the process

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Removal-controlled heat sourceShield the surrounding area

BGA Rework-the process

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Removal-controlled heat sourceProfile on, underneath and next to the device

BGA Rework-the process

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Removal-controlled heat sourceTypical Removal Profile-tin lead

BGA Rework-the process

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Removal-controlled heat sourceTypical Removal Profile- lead-free

BGA Rework-the process

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