ca to enhance the breakthrough of intelligent textile systems

Information über die Sensorik-relevanten Förderprogramme der EU

Sensor + Test 2008 Sensor + Test 2008 Nürnberg, 6 Mai 2008

Thomas REIBEMicrosystems Unit

European Commission, Brussels

Presentation outline

• Microsystems + Flexible, organic & large area

electronics + Microelectronics + Embedded Systems

• Sensors in the EU Framework Programmes

• European Technology Platforms (ETP)

• FP7 outcome of the first 2 ICT calls

• The way ahead in Work Programme 2009-2010

Micro and nanosystems technologies play a crucial role in modern knowledge-based economies

Europe has a traditional leading position in Microsystems and related advanced technologies and should capitalize on this

competitive advantage

Europe has a traditional leading position in Microsystems and related advanced technologies and should capitalize on this

competitive advantage

• Microsystems technologies is one of the most important drivers of ICT, which account for about 40% of Europe’s productivity growth

• The relevance of Microsystems comes from:

• The importance of the semiconductor and micro/nanoelectronics market

• The added value that the smart systems provide to the applications and systems where they are integrated

• R&D institutes play an important role in the early phase of the MNT development, prior to industrialization

R&D in Microsystems in the EU Framework Programmes: from MEMS to Smart Systems

FP4

MEMS Micro and NanosystemsMicro and NanotechnologiesIndustrial applications of MEMS

Smart Systems: Complex systemscombining sensing, processing and actuating

The EU Framework Programmes have always paid attention to the area of Microsystems, from a focus on MEMS in the

early 90’s to heterogeneous technologies for multifunctional systems now

The EU Framework Programmes have always paid attention to the area of Microsystems, from a focus on MEMS in the

early 90’s to heterogeneous technologies for multifunctional systems now

FP5 FP6

Smart Systems: Heterogeneous technologies for multifunctional systems

FP7

Microsystems is an enabling technology, bringing together separate technologies and sciences

Applications• Inter-disciplinarityMechanics, electronics, fluidics, biology, magnetism, optics, photonics, chemistry,

• Multiple functionalities

Sensing, processing, actuating, energy harvesting and storage, communication, memory, logic

• Convergence of heterogeneous technologies Micro/nanotechnologies, ICT, bioengineering

• Heterogeneous Materials Semiconductors, ceramic, glass, organics and polymers, metals

• Biomedical• Transport• Telecommunications• Automotive• Safety• Environment• Smart textiles, …

Flexible, Organic and Large Area Electronics (OLAE), towards heterogeneous integration

• Inorganics/organics combinations, bio & heterogeneous integration in foils, lab-on-chips, printed logic and RFIDs also addressed

• New manufacturing paradigms & very low cost applications

Enabling functions: logic, memory, RFIDs, sensing, lighting, signage, energy scavenging/storage & power management, visualisation systems and displays

Enabling functions: logic, memory, RFIDs, sensing, lighting, signage, energy scavenging/storage & power management, visualisation systems and displays

Distribution of budget by thematic cluster

35%

18%18%

11%

10%6% 2%

Nano Bio ICT (NBIC)

Sensor based Systemsand Storage

Organic/Large areaelectronics and Displays

Micro/Nanosystems forAmI

Manufacturing/processesintegration

Smart fabrics/Interactivetextiles

Support and CoordinationActions

10 projects(3 IPs, 1 NoE)

31 M€

11 projects(4 IPs)

54 M€

5 projects(3 IPs, 1 NoE) 35

M€

10+4 projects(2+1 IPs, 2 NoEs)

Sensors/Microsystems + OLAE activities in FP6

101 M€

24 projects (6 IPs)

55 M€

11 projects 6 M €

Total budget 301M€

8 projects(4 IPs)

47 M€

Micro/Nano-bio ICT

AmI

Sensor-based systems &

storage

Smart textiles Support &

Coordination

Organic electronics &

displays

Mfg/Process integr.

Wireless sensor networks

6 projects

ETPs, an industry led forum conceived to support the European Research and Innovation Area

POLICY

POLICY

RESEARCH

RESEARCH

BUSINESS

BUSINESS

A spiral model of innovation

• Capitalising on the multiple reciprocal relationships between public & private stakeholders,

• Addressing major technological challenges in specific domains

• Aiming to leverage public & private investment for R&D & innovation

• Bundling fragmented R&D efforts towards agreed goal • Boosting Europe’s competitiveness via research and innovation

ETPs are defining and implementing

the Strategic Research Agendas (SRAs): medium to

long term key objectives for the

technology

... And some figures• 34 ETPs, 9 in ICT

• More than 700 organizations involved in ETPs (large companies, SMEs, universities, research labs, ...)

• 9 SRAs in ICT field, a very important input to ICT WPs

ETPs, a key organisational innovation in the creation and exploitation of innovation-friendly markets

Some benefits from ETPs• Speed up innovation by knowledge sharing

• Pool of resources to overcome technology roadblocks

• Build partnership to share risk

• Attract higher research investment in Europe

• Optimise the return of public & private research investment

• Help turn research results into marketable products and services

• Boost industrial competitiveness and meet society´s needs

PARADES

www.roboticsplatform.com

www.nessi-europe.com

www.emobility.eu.org

EUROP

www.photonics21.de

www.nem-initiative.org

www.isi-initiative.eu.org

www.artemis-office.org

www.eniac.eu

To boost the development of robotics business & bringrobotics services to Europe’s citizens

New software & services architecturebased on open standards

To reinforce Europe’s world leadership in mobile & wireless communications & services

To explore the almost limitless applications of lightfor ICT, lighting, manufacturing and health applications

Convergence of existing and new media technologies creating advanced personalised services

An integral Satcom initiative covering all aspects ofsatellite communication

To address the needs of silicon-basedtechnologies & beyond

Ubiquitous, interoperable & cost-effective embedded systems

There are 34 ETPs successfully working, 9 in ICT

A multi-disciplinary endeavour:Combining optics, mechanics, electronics, fluidics, thermodynamics, chemistry, biology

Converging scientific disciplines: Looking at the overlapping areas between nano-, bio-, information & cognitive sciences

Multi-material integration:

Semiconductors, polymers (plastics), ceramics, glass, …

Multi-technology integration:

Monolithic, hybrid, multichip, large-area, … miniaturisation techniques

Multi-functional integration:Combining sensing, processing, actuating

EPoSS, the ETP in Smart System Integration

www.smart-systems-integration.org

Results from ICT first calls

• ICT call 1 « Next generation Nanoelectronics Components and electronics integration » related to More than Moore

• ICT call 1 « Organic & large area electronics, visualisation and display systems »

• ICT call 2 « Micro/nanosystems »• ICT call 2 « Networked Embedded and Control

Systems » related to wireless sensor networks

FP7 Projects - Nanoelectronics“More than Moore”

FP7 Call 1 in Nanoelectronics covered:

• More Moore: “to advance miniaturization in baseline CMOS technology”

• More than Moore: “to master diversification targeting non-digital applications, heterogeneous integration in Systems-on-Chip (SoC) or Systems-in-a-Package (SiP)”

• Beyond CMOS: “to prepare for the technology generation beyond the CMOS scaling”

FP7 ICT Call 1on Nanoelectronics

Total budget: 86 M€

- More than Moore: 32 M€- Beyond CMOS: 3 M€- More Moore – Miniturisation: 51 M€.

FP7 “More than Moore” Example of projects

Wadimos: “To develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.”

Rec. Fund: 2.3 M€Coordinator: Interuniversity Micro-Electronics Center, IMEC

Icestars: “Integrated Circuit/EM simulation and design technologies for advanced Radio Systems-on-chip.”

Rec. Fund: 2.8 M€ Coordinator: NXP Semiconductor B.V.

Elite: “Extended Large (3-D) Integration Technology”Rec. Fund: 3.6 M€Coordinator: Qimonda Flash GmbH

Athenis: “Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip”Rec. Fund: 5.15 M€Coordinator: Austriamicrosystems AG

Mocha: “MOdelling and CHAracterization for SiP Signal and Power Integrity Analysis”Rec. Fund: 1.85 M€Coordinator: STMicroelectronics S.r.l, Italy

NANOPACK IP: “Nano Packaging Technology for Interconnects and Heat Dissipation”Rec. Fund: 7.4 M€Coordinator: Thales SA

FP7 ICT Call 1on Organic and Large

Area Electronics

Total budget: 63 M€

- 20 new projects funded in Organic and Large Area Electronics

- 13 new projects in the field with a EU funding of ≈43M€

- Emergence of large area/inorganics: large area sensor and memory.

• Flexible, organic and large area electronics have a high potential market growth

• New large area electronic device processing capabilities are acting as a powerful driver

• In FP6 and FP7, the EC has funded 31 projects in this field with a contribution exceeding 140 M€

• The focus is on large area electronics and materials for low cost manufacturing and subcomponents like energy scavenging and storage, memories, sensors and OLEDs and flexible displays

Flexible, Organic and Large Area Electronics, an emerging field

POLYNET (NoE)FACESSPRODI (CSA)OLATRONICS

3PLASTPRIMEBITS

OLEDs

COMBOLEDFAST2LIGHT (IP)

OPERA (CSA)AEVIOMPOLYMAP (CSA)

(b): Display Systems & Visualisation

Real3DMAXIMUS

IMVISMEMIHELIUM3D

AMAZOLED HYPOLED

FLAME

BIND

20.5M€42.5M€

Flexible, Organic and Large Area Electronics in FP7

(a): Organic & Large Area Electronics

http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/

projects_en.html

FP7 ICT Call 2“Micro and

nanosystems”

Total budget: 83 M€

Micro and nanosystems in FP7

• Next generation smart systemsSensor- & actuator-based systemsHigh density mass storage• Micro/Nano-Bio-ICT convergenceBiosensors, lab-on-a-chip, bioMEMS,autonomous implants

• Integration of smart materialsIntegration of MST and smart systems into new & traditional materials, e.g. textiles, glass, paper

• From smart systems to viable productsMicrosystems manufacturing technologies• Smart systems for communications & data managementSmart micro/nanosystems enabling wireless access & facilitating intelligent networking

• Support actionsTechnology access, education & training, coordination and dissemination at EU level

Manufacturing (1IP, 3 STPs, 16.85 m€)

MST for Energy/power

(4 STPs, 12.3 m€)

Support actions (3 CSA, 2.25 M€)

Materials, Sensors, Actuators, etc

MEMS-NEMS

and Integration

(6 STPs, 18m€)

Micro-Nano-Bio Convergence

(7 STPs, 2IPs, 33.6 m€)

Areas covered after Call 2 on Micro/nanosystems*

* Under negotiation

•Micro/nano/bio technologies, biosensors, LoC: • LabonFoil: Ultra low cost laboratories on chip • PYTHIA: Monolithically Integrated Interferometric Biochips for label-free Early Detection of Human Diseases• MicroFLUID: Micro-Fabrication of polymeric Lab-on-a-chip by Ultrafast lasers with Integrated optical Detection• ULTRA: Ultra-fast electronics for Terahertz Rapid Analysis in compact lab-on-chip applications

•Micro-robotics and integrated micro-systems for endoluminal surgery (ARAKNES)•Micro-Nano Sensors & transducer based systems

• ULTRAsponder: In vivo Ultrasonic Transponder System for Biomedical Applications• MiniSurg: Miniaturized Stereoscopic Distal Imaging Sensor for Minimally Invasive Surgery • NANOMA: Nano-Actuators and Nano-Sensors for Medical Applications

•Multichannel Electrode systems• TIME: Transverse, Intrafascicular Multichannel Electrode system for induction of sensation and treatment of phantom limb pain in amputees

Micro-Nano-Bio Convergence

• DATA STORAGE

• SUPARSS: Super-Resolution for Advanced Storage Systems• TERAMAGSTOR: Terabit Magnetic Storage technologies

• ENERGY STORAGE

• E-STARS: Efficient Smart sysTems with enhAnced eneRgy Storage • GREENBAT: GREEN and SAFE thin film Batteries for flexible cost efficient energy storage

Micro/Nanosystems for Energy/power

• MEMSPACK: Zero- and First-level packaging of RF-MEMS

• NEMSIC: Hybrid Nano-Electro-Mechanical/Integrated Circuit Systems for Sensing and Power Management Applications

• ARASCOM: MEMS and Liquid Crystal based, Agile Reflect-array antennas for Security and Communication

• TUMESA: MEMS tuneable Metamaterials for Smart Wireless Applications

• MAC-TFC: MEMS Atomic Clocks for Timing, Frequency control and Communications

• MEMFIS: Ultra-small MEMS FTIR Spectrometer

MEMS-NEMS and Integration

• MEMS4MMIC: Enabling MEMS-MMIC technology for cost-effective multifunctional RF-system integration

• SMARTHIES: Smart inspection system for high speed and multifunctional testing of MEMS and MOEMS

• TIPS: Thin Interconnected Package Stacks

• HERMES: Large area manufacturing and high density integration of electronic circuits

Manufacturing

• EuroTraining-MST: SA on Microsystems and smart systems integration training

• SYSTEX: CA to enhance the breakthrough of intelligent textile systems • CEPoSS: Coordination action on smart systems integrated technologies

Support Actions

Call 2 – Strategic Objective Wireless Sensor Networks

• Target for sub-area “wireless sensor networks”:– TWO orders of magnitude more

sensors– HALF the maintenance time and

cost– ONE order of magnitude less effort

• New services and applications tailored to specific needs

FP7 ICT Call 2“Networked

Embedded and Control Systems”

Total budget: 47 M€

EU-funded Research in FP7 Wireless Sensor Networks

Networked Embedded and Control Systems – CHOsen – Automotive and Aerospace– CONET – WSNs and Cooperating Objects– GINSENG – Energy Distribution– IPAC – Plant control; Traffic Management;

Crisis management– LocON – Localisation; large-scale

infrastructures– PECES – Automotive; Localisation– POBICOS – Home Automation and Energy-

Efficient Buildings– SM4ALL – Smart Homes and Home Care

DOTSENSEGroup III-nitride quantum dots as optical transducers for chemical sensors

MARISE Materials for avalanche receivers for ultimate sensitivity

MINIGASMiniaturised photo-acoustic gas sensor based on mid-infrared lasers

PHOSFOS Photonic skins for optical sensing

SENSHYPhotonic sensing of hydrocarbons based on mid-infrared lasers

Photonic SensorsProjects Supported by DG-INFSO Photonics Unit

The way ahead: the preparation of WP2009-2010

Orientation paper

Draft WP

Dec 07 June 08 Dec 08 June 09

Final WP

Consultations Drafting Decision Call 4 Call 5

ETPs ICTC EC

Microsystems and Smart Systems Work programme 2009-10

• Strengthen project portfolio in the area

FP6 and FP7 call 2

• Emphasis on intelligence integration

Multisensing, context awareness

• Smart systems based on innovative nanosensing principles

Nanowires, CNT-based MEMS

• Specific chapter on autonomous energy efficient smart systems

Energy scavenging, power generation, efficient communication

WP ’09-10 – Flexible, organic and large area electronics

• Objective should continue the orientation defined in the previous work programme, if no additional budget is becoming available.

• Research should focus on material-device co-developments and system integration, based on functional building blocks, measurement & inspection, quality control and automation.

• Building blocks are important: TFTs, sensors, memories, energy sources and power management, OLEDs for displays & lighting, organic photovoltaics etc.

• Emphasis on inorganic / organic material thin layer structuring• Fundamental research should be in parallel with applied research

leading to device demonstrators for short term applications, including field tests.

• Support measures should facilitate standardisation, training and education

• International collaboration might be beneficial but also difficult.• All instruments IPs, Streps, NoEs, CA & SSAs are appropriate, but

STREPs and IPs should not compete for the same budget.• Next call should be published as soon as possible.

Vision from 20.2.2008 consulation meeting:

Future calls: Nanoelectronics

FP7 WP09/10• Miniaturisation and

functionalisation • Manufacturing

technologies• Design of

semiconductor components and electronic based miniaturised systems (in a separate call)

ENIAC Call 1 (to be published on 8 May 08 at http://www.eniac.eu )

• Nanoelectronics for Transport and Mobility

• Nanoelectronics for security and safety

• Nanoelectronics for energy and environment

• Design methods and tools for nanoelectronics

• Equipment and materials for nanoelectronics

WP ’09-10 - Engineering of Large-Scale, Complex Networked Systems

Wireless Sensor Networks Facilitate the deployment, activation, operation and low-cost

maintenance of distributed systems composed of heterogeneous networked smart objects, e.g. in manufacturing, process plants, buildings and large scale infrastructures, aiming at flexibility, reliability, dependability, safety, security and energy efficiency, as well as lower cost

• Focus on:– semantics that allow object/service definition and instantiation– abstractions and support tools to facilitate (re)programming– lightweight operating systems and kernels– open wireless communication protocols for harsh (industrial)

environments– virtual sensing/actuation through aggregation of sensors/actuators– novel large-scale applications of wireless sensor networks

Photonics Work programme 2009-10

• Key applications and social needs• Lighting and light sources • Biophotonics• Communications• Cost effective high-performance imaging for

Safety & Security• Highly integrated components for high average

and high peak power lasers (ICT & industrial applications)

• Organic Photonics

• Disruptive technologies

Particularly relevant for Heterogeneous

Integration

Particularly relevant for Heterogeneous

Integration

• European research on the web:– http://cordis.europa.eu– http://cordis.europa.eu/fp7– http://ec.europa.eu/comm/research/future/

• Information Society and Media:– http://cordis.europa.eu/fp7/ict/programme/

challenge3_en.html

• Contact:– thomas.reibe@ec.europa.eu– augusto.dealbuquerque@ec.europa.eu

• European research on the web:– http://cordis.europa.eu– http://cordis.europa.eu/fp7– http://ec.europa.eu/comm/research/future/

• Information Society and Media:– http://cordis.europa.eu/fp7/ict/programme/

challenge3_en.html

• Contact:– thomas.reibe@ec.europa.eu– augusto.dealbuquerque@ec.europa.eu

Thank you! …