cheminform abstract: tensile properties and microstructural characterization of sn—0.7cu—0.4co...
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2008
Inorganic chemistryZ 0100 Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co
Bulk Solder Alloy for Electronics Applications — [24 refs.]. — (ANDERSSON*, C.; SUN, P.; LIU, J.; J. Alloys Compd. 457 (2008) 1-2, 97-105; Bionano Syst. Lab., Dep. Microtechnol. Nanosci., Chalmers Univ. Technol., S-412 96 Goeteborg, Swed.; Eng.) — Schramke
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