crossflo ™ modular interconnect system may 6, 2004

CrossFlo™ Modular Interconnect System

May 6, 2004

Advantages of CrossFlo Design

• Simple configuration• Fewest number of block types required

• Single layer design w / second layer option

• No welding required

• Seal features• Captive seal

• Standard O-ring sizes

• Leak test port

• Configuration options• Skip purging possible

• 1X, 2X, 3X block spacing option

CrossFlo™

Basic CrossFlo Block

Compliant with ISA/ANSI SP76.00.02 open architecture standards.

Mounting holes for component

Pin holes

Leak Test channel

ID / OD seal capture

Inlet / Outlet Port

CrossFlo™

Conceptually Simple: In-Line Stick

• Substrate parts push together

• Components top mount

• Seals are captive

CrossFlo™

Conceptually Simple: CrossFlo

• Ports not required are simply plugged

CrossFlo™

Seal Features

• OD profile retains outer edge of seal

• ID is raised to capture seal inner edge

• Standard seal sizes used

CrossFlo™

In-Line and CrossFlo Blocks

CrossFlo™

Interconnect Elements

CrossFlo™

Typical Sampling System

CrossFlo™

Expansion to Second Level Interconnect

CrossFlo™

Second Layer Interconnect

CrossFlo™

Advantages of CrossFlo Design

• Simple configuration• Fewest number of block types required

• Single layer design w / second layer option

• No welding required

• Seal features• Captive seal

• Standard O-ring sizes

• Leak test port

• Configuration options• Skip purging possible

• 1X, 2X, 3X block spacing option

• www.celerity.net/crossflow

CrossFlo™