data sheet sky65160-11: 350-470 mhz, 4 w high power pa …
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 1
DATA SHEET
SKY65160-11: 350-470 MHz, 4 W High Power PA Module Applications
• Terrestrial Trunked Radios (TETRAs)
• GSM450 and GSM480
• NMT450
• Wireless Local Loops
• UHF TV broadcasts
Features
• Wideband frequency operation: 350 to 470 MHz
• High efficiency: 45% PAE
• High gain: 37 dB
• P1dB = +33 dBm
• Saturated power = +36 dBm
• Single DC supply = 3.6 V
• Internal RF match and bias circuits
• PA on/off voltage control
• Unconditionally stable under any load impedance
• Small, MCM (16-pin, 8 x 10 mm) package (MSL3, 260 °C per JEDEC J-STD-020)
Skyworks Pb-free products are compliant with all applicable legislation. For additional information, refer to Skyworks Definition of Lead (Pb)-Free, document number SQ04-0073.
Description The SKY65160-11 is a fully-matched, 4 W Power Amplifier (PA). Its high efficiency is designed for use in the 350 to 470 MHz frequency range.
The PA contains all the active bias and RF matching circuits, which makes it easy to integrate into 50 Ω RF systems. The internal input and output match are optimized for efficiency and high power performance into a 50 Ω load.
Primary bias to the SKY65160-11 is supplied directly from a single cell Li-ion or other suitable battery with a nominal output of 3.6 V. No external supply-side switch is needed since typical “off” leakage is a few microamperes with full primary voltage supplied by the battery.
The SKY65160-11 is fabricated using Skyworks high reliability GaAs Heterojunction Bipolar Transistor (HBT) process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is provided in an 8 x 10 mm, 16-pin Multi-Chip Module (MCM) package.
A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
RF_IN
VBAT
VCC1 VCC2
VREG
RF_OUTInputMatch
OutputMatch
Stage 1PA
Stage 2PA
Active Bias Control
Inter-StageMatch
S1842
Figure 1. SKY65160-11 Block Diagram
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 2 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
S1843
1
2N/C
VBAT
RF_I
N
VREG
GND
GND
N/C
N/C
VCC1
GND
GND
RF_O
UT
GND
GND
VCC2
GND
3
4
5 6 7 8 9
10
11
12
13141516
Figure 2. SKY65160-11 Pinout – 16-Pin MCM (Top View)
Table 1. SKY65160-11 Signal Descriptions
Pin # Name Description Pin # Name Description
1 RF_IN RF input to PA 9 RF_OUT RF output of PA
2 N/C No connection 10 GND Ground
3 VBAT Supply voltage for bias circuit, +3.6 V 11 VCC2 Supply voltage to 2nd amplifier, +3.6 V
4 GND Ground 12 GND Ground
5 N/C No connection 13 N/C No connection
6 VCC1 Supply voltage to 1st amplifier, +3.6 V 14 GND Ground
7 GND Ground 15 GND Ground
8 GND Ground 16 VREG PA enable control signal (on = +3.6 V, off = 0 V)
Electrical and Mechanical Specifications The absolute maximum ratings of the SKY65160-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4.
Performance characteristics for the SKY65160-11 are illustrated in Figures 3 through 9.
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 3
Table 2. SKY65160-11 Absolute Maximum Ratings
Parameter Symbol Minimum Typical Maximum Units
RF output power POUT +37 dBm
Supply voltage (VCC1, VCC2, VBAT, VREG) VCC 5.1 V
Supply current ICC 2500 mA
Operating temperature TOP –40 +85 °C
Storage temperature TSTG –65 +125 °C
Junction temperature TJ 150 °C
Thermal resistance ΘJC 18 °C/W
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65160-11 Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Operating frequency f 350 470 MHz
Supply voltage (VCC1, VCC2) VCC 3.2 3.6 4.0 V
Bias voltage VBAT 3.2 3.6 4.0 V
Enable voltage: On state Off state
VREG 2.7 0
3.6
4.0 0.5
V V
Operating temperature TOP –40 +25 +85 °C
Table 4. SKY65160-11 Electrical Specifications (1 of 2) (Note 1) (VBAT = VCC1 = VCC2 = VREG = 3.6 V; f = 350 MHz, 410 MHz, and 470 MHz; TOP = +25 °C, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
1 dB Output Compression Point OP1dB CW +33.0 +34.0 dBm
Saturated output power PSAT CW, input power = +5 dBm
+35.8 +36.5 dBm
Small signal gain GSMALL_SIGNAL CW, input power = –5 dBm
34.3 35.5 dB
Large signal gain GLARGE_SIGNAL POUT = +32.8 dBm 33.9 37.2 40.0 dB
Noise Figure NF 6.5 7.0 dB
Quiescent current IQ No RF input 300 mA
Operating current @ P1dB I1DB POUT = +33 dBm 2000 mA
Operating current @ PSAT ISAT CW, input power = +5 dBm
2500 mA
PAE @ PSAT PAEPSAT TETRA-correlated CW measurements, input power = +5 dBm
45 48 %
PAE @ POUT = +32.8 dBm PAE+32.8DBM TETRA-correlated CW measurements
34 36 %
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 4 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
Table 4. SKY65160-11 Electrical Specifications (2 of 2) (Note 1) (VBAT = VCC1 = VCC2 = VREG = 3.6 V; f = 350 MHz, 410 MHz, and 470 MHz; TOP = +25 °C, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Input return loss |S11| Input power = –15 dBm 11 14 dB
Output return loss |S22| Input power = –15 dBm 12 dB
VSWR for stable operation VSWR CW 8:1 –
Leakage current ILEAK No RF input, VREG = 0 V 0.5 1.0 μA
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Typical Performance Characteristics (VBAT = VCC1 = VCC2 = VREG = 3.6 V, f = 410 MHz, TOP = +25 °C, Unless Otherwise Noted)
30
31
32
33
34
35
36
37
38
39
+28 +29 +30 +31 +32 +33 +34 +35 +36 +37
POUT (dBm)
Gain
(dB)
350 MHz410 MHz470 MHz
Figure 3. Gain vs. Output Power Over Frequency
37
38
39
40
41
34
35
36
350 370 390 410 430 450 470 490
Frequency (MHz)
Gain
(dB)
Figure 5. Gain vs Frequency
1.0
1.5
2.0
2.5
3.0
0
0.5
+24 +25 +26 +27 +28 +29 +30 +31 +32 +33 +34 +35 +36 +37
POUT (dBm)
Icc (A
)
350 MHz410 MHz470 MHz
Figure 7. Total Operating Current vs Output Power Over Frequency
+30
+32
+34
+36
+38
+20
+22
+24
+26
+28
–15 –13 –11 –9 –7 –5 –3 –1 +1 +3 +5 +7
PIN (dBm)
POUT
(dBm
)350 MHz410 MHz470 MHz
Figure 4. Input Power vs Output Power Over Frequency
–10
–8
–6
–20
–18
–16
–14
–12
Retu
rn L
oss
(dB)
350 370 390 410 430 450 470 490
Frequency (MHz)
S22S11
Figure 6. Input and Output Return Loss vs Frequency
35
40
45
50
55
25
30
10
15
20
0+25+24 +26 +27 +28 +29 +30 +31 +32 +33 +34 +35 +36 +37
POUT (dBm)
PAE
(%)
350 MHz410 MHz470 MHz
Figure 8. PAE vs Output Power Over Frequency
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 5
Evaluation Board Description The SKY65160-11 Evaluation Board is used to test the performance of the SKY65160-11 LNA. An assembly drawing for the Evaluation Board is shown in Figure 9 and the layer detail is provided in Figure 10. The layer detail physical characteristics are noted in Figure 11. A schematic diagram of the SKY65160-11 Evaluation Board is shown in Figure 12.
Input and output trace lengths have been minimized to reduce losses. All surface mount components are 0402-sized to reduce component parasitics. The use of 0603 or larger components is not recommended. Component spacing has also been minimized. The board is provisioned with two RF connectors and a DC launch.
It is very important to place multiple ground vias as close to shunt components as possible. This ensures proper grounding and circuit performance.
Board material is 10 mil thick VT47 FR4 with 1 oz. copper cladding. RF input and output traces are 50 Ω.
Evaluation Board Test Procedure
Step 1: Connect RF test equipment to amplifier input/output SMA connectors.
Step 2: Connect DC ground.
Step 3: Connect VBAT, VCC1, VCC2, and VREG to a +3.6 V supply with a current limit of 3 A. Verify that the board draws approximately 290 mA.
Step 4: Apply a low RF signal (e.g., –30 dBm) or noise source.
Package Dimensions The PCB layout footprint for the SKY65160-11 is provided in Figure 13. Package dimensions for the 16-pin MCM are shown in Figure 14, and tape and reel dimensions are provided in Figure 15.
Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.
THE SKY65160-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 260 °C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, PCB Design & SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752.
Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 6 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
RF_OUT
RF_IN
J3
S2541
Figure 9. SKY65160-11 Evaluation Board Assembly Diagram
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 7
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
S1844
Figure 10. SKY65160-11 Evaluation Board Layer Detail
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 8 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
S2540
Cross Section Name Thickness (mm) Material εr
Pri 0.025 Cu –
Die1 0.400 Rogers 4003 –
L2 0.025 Cu –
Die2 0.600 FR4 4.0
L3 0.025 Cu –
Die3 0.400 FR4 4.0
Sec 0.025 Cu –
Figure 11. Layer Detail Physical Characteristics
1 16 15 14
6 7 8
2
3
4
5
13
12
11
10
9
N/C
VBATBias Circuit Supply
(+3.6 V)
GND
N/C
VCC1
GND
GND
RF_O
UT
RF_I
N
VREG
GND
GND
N/C
GND
VCC2
GND
J5
J4
C510 μF
C60.022 μF
S1845
×
×
×C10.022 μF
C210 μF
C310 μF
C40.022 μF
PA1 Supply(+3.6 V)
PA2 Supply(+3.6 V)
PA Enable
Figure 12. SKY65160-11 Evaluation Board Schematic
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 9
10.3
10.310.4
0.0625 Typ. 16X 0.76
0.875 Typ.
Pin 16
Pin 1
0.2 X 0.2
ComponentOutline
ComponentOutline
ComponentOutline
Stencil aperture size of 80% to 100%of the module/package solder mask openings.
Pin 16Pin 1
Pin 16
Pin 1
Stencil ApertureTop View
MetallizationTop View
Thermal Via Array, ∅0.3 mmon 0.6 mm pitch will improvethermal performance.NOTE: thermal vias should be tentedwith solder mask, 30-35 mmCu plating recommended.
Solder Mask OpeningTop View
S2565All dimensions are in millimeters
2X 2.93759X 0.76
8.3
8.3
16X 1.175
16X 1.275
2X 1.9375
16X 0.86
9X 1.175
1.91 Typ.
1.91 Typ.
0.6 Typ.8.4
1.91 Typ.
0.25 Typ.
0.2 X 0.2
Opening size of60 to 100% of exposedcenter opening shown;exposed center pad
Figure 13. SKY65160-11 PCB Layout Footprint
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 10 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
Metal Pad Edge
0.9 ± 0.1
0.76 ± 0.05
0.875SolderMask Edges
(0.125)
Side View Bottom ViewTop View
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994. S1623b
SolderMask Edges4X R0.05 Max.
SolderMask Edges5X R0.05 Max.
10 B
AA
10X 3.875
12X 1.5
12X 0.5
4X 1.91
4X 3
.82
6X 4
.875
8X 2
.5
8X 1
.5
8X 0
.5
4X 1
.91
C
0.15 A B C0.1
Pin 1Indicator
1.35 ± 0.1
Pin 16
Pin 1 IndicatorSee Detail C
24X Solder Mask OpeningSee Detail B
16X SMT Pad
0.2 A B C
A B CM0.1
8
Pin 1
Detail APad
Scale: 2X
5X This rotation5X Rotated 180°3X Rotated 90° CW3X Rotated 90° CCW
Detail BScale: 2X
23X This rotation
Detail CScale: 2X
1X This rotation
0
0
0.875
0.875
0.875
Figure 14. SKY65160-11 16-Pin MCM Package Dimensions
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201202A • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • September 12, 2011 11
0.3 ±0.05 (T)Pin 1
10.35 (Bo)
A
A
B
12 (P1)Ø1.5 ±0.05
4 (Po)
0.3 Ref
A
2.0
Ref
2 ± 0.051.75 ± 0.1
7.5 ± 0.05
16 ± 0.3
Ø1.5 MinB
8.35 (Ao)
2 (Ko)
B
Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive PSA. 3. Cover tape size: 13.3 mm width. 4. Po/P1, 10 pitches cumulative tolerance on tape ±0.20 mm. 5. Ao and Bo measurement point to be 0.3 mm from bottom pocket. 6. All measurements are in millimeters. S1625
Figure 15. SKY65160-11 Tape and Reel Dimensions
DATA SHEET • SKY65160-11 HIGH POWER PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 12 September 12, 2011 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • 201202A
Ordering Information Model Name Manufacturing Part Number Evaluation Board Part Number
SKY65160-11 High Power PA SKY65160-11 TW18-D110-003
Copyright © 2011 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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