datacon ds9000e - besi · pdf filedatacon ds9000e wafer to frame sorting up to 14,500 uph the...
Post on 05-Feb-2018
217 Views
Preview:
TRANSCRIPT
Datacon DS9000eWafer to Frame Sorting up to 14,500 UPH
The Datacon DS9000e is a high speed fully automatic die sorter
with output to a frame or carrier. It handles any wafer sizes up
to 300 mm and can therefore reconstruct wafers to different
output form factors. This enables the transition to larger wafer
formats without having to reinvest in downstream packaging
equipment. Besides wafers, the Datacon DS9000e handle a variety
of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak®.
The Datacon DS9000e offers the ultimate combination of
performance, flexibility, and versatility, handling the most
challenging die sorting applications.
Future Proof Equipment
Performance, Versatility and FlexibilityFully automatic wafer loading and vision alignment
±35 μm @ 3 sigma placement accuracy
Small die and thin die handling
Die inspection prior to pick and after placement
CLEANROOMENCLOSURE
AUTOMATICVISION
DUALPICK & PLACE
FLEXIBLEWAFER HANDLING
ELECTRONIC
WAFER MAP
SORTING
www.besi.com
Datacon DS9000eWafer to Frame Sorting up to 14,500 UPH
The Datacon DS9000e is a high speed fully automatic die sorter
with output to a frame or carrier. It handles any wafer sizes up
to 300 mm and can therefore reconstruct wafers to different
output form factors. This enables the transition to larger wafer
formats without having to reinvest in downstream packaging
equipment. Besides wafers, the Datacon DS9000e handle a variety
of chip carriers such as waffle pack, JEDEC tray, and Gel-Pak®.
The Datacon DS9000e offers the ultimate combination of
performance, flexibility, and versatility, handling the most
challenging die sorting applications.
Future Proof Equipment
Performance, Versatility and FlexibilityFully automatic wafer loading and vision alignment
±35 μm @ 3 sigma placement accuracy
Small die and thin die handling
Die inspection prior to pick and after placement
Reconstru
ct
Wafer
InspectionBin
Sort
chipcarrier
Package to
MPUU
LED
mageImensorSe
Consumer
Autom
otiv
e
Computing
Mobile
EEllectronics
CLEANROOMCENCLOSURE
AUTOMATICVISION
DUALPICK & PLACE
FLEXIBLEWAFER HANDLING
ELECTRONIC
WAFER MAPW
SORTING
www.besi.comw
Dual Pick & PlaceParallel processing for high throughput up to 14,500 UPH
Adjustable force with synchronized die eject and pick
Precise force control of GaAs, GaN, Si, and thin die
High Placement accuracy of ±35 μm @ 3 sigma
Handles a broad range of form factors - Bare die to LED Packages
Flexible Wafer Handling300 mm diameter wafers and smaller
Film frame, expander grip ring
Waffle pack, Gel-Pak® and JEDEC tray carriers
Automated wafer loading and unloading from cassette
Electronic Wafer Map SortingSort known good die by bin grade
Automatic bar code scanning and wafer map retrieval
On board wafer map translation
Multi-project and reticle wafer
Optional 148 bin multi-cassette output
Automatic Vision Alignment & Inspection
Programmable strobe LED illumination
Bad mark inspection for sorting without electronic map
Pre pick and post placement die inspection
Edge chipping, die crack, surface defect and bump
inspection capabilities
Cleanroom Mini-Environment Enclosure
Optionally available
US Federal Standard209E Class 100 (ISO 14644-1 Class 5)
Ionizers for ESD management
Ducted exhaust ports for facility exhaust connection
**Final performance depends on user specific data.*Without/with multi cassette elevator.
Machine Data
Width: 1594/1900 mm*
Depth: 1422 mm
Height: 2468 mm
Weight: approx. 1588 kg
Air Supply
6 - 7.5 bar 140 l/min clean&dry
Electrical Requirements
Voltage: 208-430 VAC single ph.
Power: 3 kVA
Wafer Handling
Input: 300, 200, 150 mm frame
Output: 300, 200, 150 mm
frame, JDEC tray, 2”and 4”
Waffle pack, 2” Gel-Pak
Die Handling
Minimum thickness: 50 μm
Minimum size: 0.2 mm
Maximum size: 32 mm
Die Size Range
10:1 with 7x optical zoom
15:1 with 12.5x optical zoom
Throughput**
14,500 UPH (150 mm / 150 mm
with 10” rotary transfer)
10,500 UPH (300 mm/300 mm
with 15” rotary transfer)
Placement Accuracy
± 35 μm @ 3 sigma
± 1 degree theta
Dual Pick & PlaceParallel processing for high throughput up to 14,500 UPH
Adjustable force with synchronized die eject and pick
Precise force control of GaAs, GaN, Si, and thin die
High Placement accuracy of ±35 μm @ 3 sigma
Handles a broad range of form factors - Bare die to LED Packages
Flexible Wafer Handling300 mm diameter wafers and smaller
Film frame, expander grip ring
Waffle pack, Gel-Pak® and JEDEC tray carriers
Automated wafer loading and unloading from cassette
Electronic Wafer Map SortingSort known good die by bin grade
Automatic bar code scanning and wafer map retrieval
On board wafer map translation
Multi-project and reticle wafer
Optional 148 bin multi-cassette output
Automatic Vision Alignment & Inspection
Programmable strobe LED illumination
Bad mark inspection for sorting without electronic map
Pre pick and post placement die inspection
Edge chipping, die crack, surface defect and bump
inspection capabilities
Cleanroom Mini-Environment Enclosure
Optionally available
US Federal Standard209E Class 100 (ISO 14644-1 Class 5)
Ionizers for ESD management
Ducted exhaust ports for facility exhaust connection
**Final performance depends on user specific data.*Without/with multi cassette elevator.
Machine Data
Width: 1594/1900 mm*
Depth: 1422 mm
Height: 2468 mm
Weight: approx. 1588 kg
Air Supply
6 - 7.5 bar 140 l/min clean&dry
Electrical Requirements
Voltage: 208-430 VAC single ph.
Power: 3 kVA
Wafer Handling
Input: 300, 200, 150 mm frame
Output: 300, 200, 150 mm
frame, JDEC tray, 2”and 4”
Waffle pack, 2” Gel-Pak
Die Handling
Minimum thickness: 50 μm
Minimum size: 0.2 mm
Maximum size: 32 mm
Die Size Range
10:1 with 7x optical zoom
15:1 with 12.5x optical zoom
Throughput**
14,500 UPH (150 mm / 150 mm
with 10” rotary transfer)
10,500 UPH (300 mm/300 mm
with 15” rotary transfer)
Placement Accuracy
± 35 μm @ 3 sigma
± 1 degree theta
www.besi.com - sales@besi.com
top related